• Korean Journal of Optics and Photonics
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• v.24 no.6
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• pp.331-337
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• 2013

A large optical surface is fabricated by grinding, polishing and figuring. The grinding process is the most rapid and has the largest amount of fabrication of all processes. If we measure the surface precisely and rapidly in the grinding process, it is possible to improve the efficiency of the fabrication process. Since the surface of grinding process is rough and not shiny, it is not easy to measure the surface using light so that we cannot use an interferometer. Therefore, we have to measure the surface using a mechanical method. We can measure the surface under the grinding process by using a laser tracker which is a portable 3-dimensional coordinate measuring machine. In this paper, we used the laser tracker to measure the surface error of 1 m diameter spherical mirror. This measurement result was compared to that of an interferometer. As a result, surface measurement error was found to be $0.2{\mu}m$ rms (root mean square) and $2.7{\mu}m$ PV (Peak to Valley), which is accurate enough to apply to the rough surface under the grinding stage.

• The korean journal of orthodontics
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• v.27 no.5 s.64
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• pp.791-800
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• 1997

Sixty premolars extracted for orthodontic treatment were divided into four groups, and the residual resin was removed with four different rotary finishing instruments at a fixed speed of $18,500{\pm}300 rpm$ on the low speed handpiece. The instruments were G1; No.169L carbide fissure bur, G2: No.2 round bur, G3; No.4 round bur, G4: No.8 round bur. Then, the enamel received a S-second polishing with a rubber cup and a pumice. To find the extent of loss on the enamel at this point, prophylaxis was done with the rubber cup and pumice prior to bonding of the bracket(P1) and removal of residual resin by means of appropriate procedure applicable to each respective group(P2) followed. The final polishing was done with the rubber cup and pumice(P3), and the enamel surface roughness was measured each by the surface measuring instrument. The whole process was observed under a scanning electron microscope to gain the following results: At P2, the enamel surface roughness in G1 showed most smoothly with $2.60{\pm}0.55{\mu}m;\;in\;G2,\;3.24{\pm}0.80{\mu}m;\;in\;G3,\;3.44{\pm}0.94{\mu}m;\;in\;G4,\;3.89{\pm}0.54{\mu}m$, the roughest. G2 and G3 showed no statistical significance(P>0.05). At P3, the enamel surface roughness in G1 showed most smoothly with $2.29{\pm}0.47{\mu}m;\;in\;G2,\;2.44{\pm}0.56{\mu}m;\;in\;G3,\;2.44{\pm}0.56{\mu}m;\;in\;G4,\;2.92{\pm}0.43{\mu}m$, the roughest. G1 vs G2, G3, and G2 vs G3 had no statistical significances(p>0.05). In all groups, P2 and P3 showed rougher in surface roughness than P1, and P2 rougher than P3(p<0.01). In a case of 5-second prophylaxis with the rubber cup and the pumice on a virgin, normal enamel, fine scratches were found under the scanning electron microscope. In all four groups, unremovable gouges remained even after polishing with the ubber and pumice; residual resin was not observed with naked eye when finished with the rubber and pumice, but the resin debris was observed under the scanning electron microscope.

• Progress in Superconductivity
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• v.12 no.2
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• pp.118-123
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• 2011

The properties of $2^{nd}$ generation high temperature superconducting wire, coated conductor strongly depend on the quality of superconducting oxide layer and property of metal substrate is one of the most important factors affecting the quality of coated conductor. Good mechanical and chemical stability at high temperature are required to maintain the initial integrity during the various process steps required to deposit several layers consisting coated conductor. And substrate need to be nonmagnetic to reduce magnetization loss for ac application. Hastelloy and stainless steel are the most suitable alloys for metal substrate. One of the obstacles in using stainless steel as substrate for coated conductor is its difficulties in making smooth surface inevitable for depositing good IBAD layer. Conventional method involves several steps such as electro polishing, deposition of $Al_2O_3$ and $Y_2O_3$ before IBAD process. Chemical solution deposition method can simplify those steps into one step process having uniformity in large area. In this research, we tried to improve the surface roughness of stainless steel(SUS310). The precursor coating solution was synthesized by using yttrium complex. The viscosity of coating solution and heat treatment condition were optimized for smooth surface. A smooth amorphous $Y_2O_3$ thin film suitable for IBAD process was coated on SUS310 tape. The surface roughness was improved from 40nm to 1.8 nm by 4 coatings. The IBAD-MgO layer deposited on prepared substrate showed good in plane alignment(${\Delta}{\phi}$) of $6.2^{\circ}$.

• Clean Technology
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• v.4 no.2
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• pp.41-53
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• 1998

Most of flame furnace with uncontrolled atmosphere forms oxidation scales in the surface during heat treatment. In this case, shot blasting and pickling are commonly used for reduction of oxidation scales. These processes have many disadvantages, such as long process time, high operating cost and environmental problems due to polishing dust, etc. Hence, this study aimed to develop the advanced heat treating equipment which could make a controlled atmosphere using a heatresisting structure into the flame furnace. The analysis result with SEM, EPMA, and EDX revealed that the amount of scales formed is much less than that with the conventional flame furnace. A brightness of the sample treated with the advanced process is similar compared to the treatment with vacuum furnace. In the present work, it was recommended that the inside structure of the furnace and gas line system could made up of SBB410 and STS310, respectively. The operating cost with the advanced heat treatment system could be reduced annually by forty million won. As a result of this study, it may be possible to reduce the oxidation scales. The fundamental information obtained in this study will be useful not only for improving the heat treatment process(reduction of shot blast and cleaning process), but for promoting the manufacture of bright products.

• Corrosion Science and Technology
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• v.9 no.6
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• pp.276-280
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• 2010

Copper(Cu) as an interconnecting metal layer can replace aluminum (Al) in IC fabrication since Cu has low electrical resistivity, showing high immunity to electromigration compared to Al. However, it is very difficult for copper to be patterned by the dry etching processes. The chemical mechanical polishing (CMP) process has been introduced and widely used as the mainstream patterning technique for Cu in the fabrication of deep submicron integrated circuits in light of its capability to reduce surface roughness. But this process leaves a large amount of residues on the wafer surface, which must be removed by the post-CMP cleaning processes. Copper corrosion is one of the critical issues for the copper metallization process. Thus, in order to understand the copper corrosion problems in post-CMP cleaning solutions and study the effects of DC biases and post-CMP cleaning solution concentrations on the Cu film, a constant voltage was supplied at various concentrations, and then the output currents were measured and recorded with time. Most of the cases, the current was steadily decreased (i.e. resistance was increased by the oxidation). In the lowest concentration case only, the current was steadily increased with the scarce fluctuations. The higher the constant supplied DC voltage values, the higher the initial output current and the saturated current values. However the time to be taken for it to be saturated was almost the same for all the DC supplied voltage values. It was indicated that the oxide formation was not dependent on the supplied voltage values and 1 V was more than enough to form the oxide. With applied voltages lower than 3 V combined with any concentration, the perforation through the oxide film rarely took place due to the insufficient driving force (voltage) and the copper oxidation ceased. However, with the voltage higher than 3 V, the copper ions were started to diffuse out through the oxide film and thus made pores to be formed on the oxide surface, causing the current to increase and a part of the exposed copper film inside the pores gets back to be oxidized and the rest of it was remained without any further oxidation, causing the current back to decrease a little bit. With increasing the applied DC bias value, the shorter time to be taken for copper ions to be diffused out through the copper oxide film. From the discussions above, it could be concluded that the oxide film was formed and grown by the copper ion diffusion first and then the reaction with any oxidant in the post-CMP cleaning solution.

• Journal of the Korean institute of surface engineering
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• v.46 no.6
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• pp.248-257
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• 2013

It is generally recognized that thin Pd-Cu alloy films fabricated by sputtering show a wide range of microstructures and properties, both of which are highly dependent on the sputtering conditions. In view of this, the present study aims to investigate the relationship between the performance of hydrogen separation membranes and the microstructure of Pd alloy films depending on sputtering deposition conditions such as substrate temperature, working pressure, and DC power. We fabricated thin and dense Pd-Cu alloy membranes by the micro-polishing of porous Ni support, an advanced Pd-Cu sputtered multi-deposition under the conditions of high substrate temperature / low working pressure / high DC power, and a followed by Cu-reflow heat-treatment. The result of a hydrogen permeation test indicated that the selectivity for $H_2/N_2$ was infinite because of the void-free and dense surface of the Pd alloy membranes, and the hydrogen permeability was 10.5 $ml{\cdot}cm^{-2}{\cdot}min^{-1}{\cdot}atm^{-1}$ for a 6 ${\mu}m$ membrane thickness.

• The Journal of Advanced Prosthodontics
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• v.8 no.2
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• pp.137-143
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• 2016

PURPOSE. Grinding with less stress on 3Y-TZP through proper selection of methods and instruments can lead to a long-term success of prosthesis. The purpose of this study was to compare the phase transformation and physical properties after zirconia surface grinding with 3 different grinding burs. MATERIALS AND METHODS. Forty disc-shaped zirconia specimens were fabricated. Each Ten specimens were ground with AllCeramic SuperMax (NTI, Kahla, Germany), Dura-Green DIA (Shofu Inc., Kyoto, Japan), and Dura-Green (Shofu Inc., Kyoto, Japan). Ten specimens were not ground and used as a control group. After the specimen grinding, XRD analysis, surface roughness test, FE-SEM imaging, and biaxial flexural strength test were performed. RESULTS. After surface grinding, small amount of monoclinic phase in all experimental groups was observed. The phase change was higher in specimens, which were ground with Dura-Green DIA and AllCeramic SuperMax burs. The roughness of surfaces increased in specimens, which were ground with Dura-Green DIA and AllCeramic SuperMax burs than control groups and ground with Dura-Green. All experimental groups showed lower flexural strength than control group, but there was no statistically significant difference between control group and ground with Dura-Green DIA and AllCeramic SuperMax burs. The specimens, which were ground with Dura-Green showed the lowest strength. CONCLUSION. The use of dedicated zirconia-specific grinding burs such as Dura-Green DIA and AllCeramic SuperMax burs decreases the grinding time and did not significantly affect the flexural strength of zirconia, and therefore, they may be recommended. However, a fine polishing process should be accompanied to reduce the surface roughness after grinding.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.12
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• pp.1159-1165
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• 2013

Powder blasting, which is an efficient micromachining method for glass, silicon, and ceramics, has a critical disadvantage in that the surface finish is poor owing to the brittle fracture of materials. Low-pressure waterjet machining can be applied to smoothen the rough surface inside the blasted structure. In this study, the surface roughness and sectional dimension of micro-channels are observed during the repetitive application of a waterjet to blasted micro-channels. The asperities and subsurface cracks created by blasting are removed by waterjet machining. Along with the surface roughness, it is found that the sectional dimension increases and the edges of the finished micro-channel become slightly round. Finally, a microfluidic chip is machined by the blasting-waterjet process and a transparent microfluidic channel is obtained efficiently.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.3
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• pp.1058-1062
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• 2011

After the design and production of cold rolling to make titanium-alloyed(Gr.9) eyerim, the function of the roller was evaluated. The surface roughness values of the roller of Ra was $0.05{\sim}0.156{\mu}m$ and of Rz was $0.23{\sim}067{\mu}m$. The values showed a satisfactory result compared with the surface roughness values Ra was $0.04{\mu}m$ and Rz was $0.3{\mu}m$ which was measured after barrel polishing for the titanium eyeglasses frame PVD (Physical Vapor Deposition) gilding. As a result of cold rolling of Ti-3Al-2.5V (Half Titanium), the degree of hardness increased to 221Hv, 247Hv(1st), 270Hv(2nd), etc. Therefore, it was found that proper heat treatment and multi-stand rolling process are necessary.

• Journal of Korean Society on Water Environment
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• v.23 no.5
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• pp.642-649
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• 2007

The effectiveness of add-on tertiary treatment processes for the polishing of the effluent of a biological nutrient removal (BNR) system from a modified $A^2/O$ process has been examined under the field condition with pilot-scale plants. The add-on treatment processes of 1) combined biofilm anoxic reactor and sand filtration, and 2) two-stage denitrification filter had been operated with various operating conditions. The experimental results indicated that two-stage denitrification filter could produced a better polished tertiary effluent. Filtration rate of $150m^3/m^2{\cdot}d$ for the 2-stage denitrifying filter could decrease the nitrate removal probably due to shorter detention time that caused insufficient reaction for denitrification. Two stage denitrification filter operated with M/N ratio of 3.0 and filtration rate of $100m^3/m^2{\cdot}d$ produced the tertiary effluent with nitrate and SS concentraitons of 2.8 mg/L and 2.3 mg/L, respectively. When the operating temperature reduced $30^{\circ}C$ to $18^{\circ}C$, $NO_3{^-}-N$ removal efficiency decreased from 73% to 68%.