• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.2
• /
• pp.43-48
• /
• 2017

Conductive $Sn_xO_y$ thin films were fabricated via RF reactive sputtering using SnO:Sn (80:20 mol%) composite target. The composite target was used to produce a chemically stable composition of $Sn_xO_y$ thin film while controlling structural defects by chemical reaction between tin and oxygen. During sputtering pressure, RF power, and substrate temperature were fixed, and oxygen partial pressure was varied from 0% to 12%. Annealing process was carried out at $300^{\circ}C$ for 1 hour in vacuum. Except $P_{O2}=0%$ sample, all samples showed the transmittance of 80~90% and amorphous phase before and after annealing. Electrically stable p-type $Sn_xO_y$ thin film with high transmittance was only obtained from the oxygen partial pressure at 12%. The carrier concentration and mobility for the $P_{O2}=12%$ were $6.36{\times}10^{18}cm^{-3}$ and $1.02cm^2V^{-1}s^{-1}$ respectively after annealing.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.3
• /
• pp.43-49
• /
• 2019

In this study, a new approach using graphene oxide (GO) powder-composited Sn-3.0Ag-0.5Cu(in wt.%) solder paste for improving the bending reliability of solder joints between a flexible substrate and small outline package (SOP) was suggested. The GO addition slightly affected the melting temperature, however, the change in the melting temperature was not significant. Meanwhile, we observed the addition of GO could suppress IMC growth and IMC thickness of solder joint during the reflow process. Moreover, the cyclic bending test was also performed for evaluation of reliability in solder joint and we could improve the cyclic bending reliability of solder joint by adding GO powders. For 0.2 wt.% of GO added to the solder joint, the bending lifetime was increased to 20% greater than that without GO. Pull strength and ductility of the solder joint with GO were also higher than those of the joint without GO and it was assumed that this effect by adding GO could contribute to improve cyclic bending reliability of solder joint.

• Journal of the Microelectronics and Packaging Society
• /
• v.28 no.3
• /
• pp.17-24
• /
• 2021

Perovskite solar cells (PSCs) can be fabricated through solution process economically with variable bandgap that is controlled by composition of precursor solution. Tandem cells in which PSCs combined with silicon solar cells have potential to reach high power conversion efficiency over 30%, however, lack of long-term stability of PSCs is an obstacle to commercialization. Degradation of PSCs is mainly attributed to the mass transport of halide and metal electrode materials. In order to ensure the long-term stability, the mass transport should be inhibited. In this study, we confirmed degradation behaviors due to the mass transport in PSCs and designed buffer layers with LiF and/or SnO₂ to improve the long-term stability by suppressing the mass transport. Under high-temperature storage test at 85℃, PSCs without the buffer layers were degraded by forming PbI₂, AgI, and the delta phase of the perovskite material, while PSCs with the buffer layers showed improved stability with keeping the original phase of the perovskite. When the LiF buffer and encapsulation were applied to PSCs, superior long-term stability on 85℃-85% RH dump heat test was achieved; efficiency drop was not observed after 200 h. It was also confirmed that 90.6% of the initial efficiency was maintained after 200 hours of maximum power tracking test under AM 1.5G-1SUN illumination. Here, we have demonstrated that the buffer layer is essential to achieve long-term stability of PSCs.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.2
• /
• pp.31-43
• /
• 2019

In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.2
• /
• pp.1-8
• /
• 2019

The demand and importance of adhesives and paint coatings applied to solid surfaces such as metals, ceramics, and plastics are increasing. In this study, the influencing factors on the adhesive strength between the polymer coating and the metal adherend were investigated by Dolly test when the adhesive or the paint coating was applied on the metal adherend. Two-component epoxy adhesive was used as the adhesive, and EH2350, a two-component epoxy paint for anti-corrosion, was used as the paint. Especially, the effect of adherend metals(Al, Fe, STS, Cu, Zn), surface roughness and surface contamination(tap water, salt water) on adhesive strength was studied as influencing factors. The adhesive strength between adhesive and adherend was different when the type of metal adherend was different even when the same adhesive was used. It was found that spray water cleaning was necessary before the paint coating process on the surface of the oxide contaminated adherend with tap water or salt water. As a result of this study, it was confirmed that Dolly test can be widely used in the future to measure adhesive strength between paint coating and adherend.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.4
• /
• pp.143-148
• /
• 2018

Sodium silicate based silica aerogels are lower in cost than silica alkoxide based silica aerogels, but the demand is decreasing as their physical properties are lowered. In this research, acetonitrile as a drying control chemical additive (DCCA) is added in the sol state to improve the pore-structural properties of sodium silicate based silica aerogel by preventing the agglomeration of particles and cross-linked bond. The sodium silicate based silica aerogel by ambient pressure drying were prepared by sol-gel process. Acetonitrile/$Na_2SiO_3$ molar ratio of 0, 0.05, 0.1, 0.15, and 0.2 was added to the sol state. The physical properties of the final product were analyzed using Fourier transform infrared, contact angle measurement, Brunauer-Emmett-Teller and Barrett-Joyner-Halenda measurements and field emission scanning electron microscopy. It was confirmed that the sample with adding 0.15 molar ratio of acetonitrile and sodium silicate showed a high specific surface area ($577m^2/g$), a high pore volume (3.29 cc/g), and a high porosity (93%) comparable to the pore-structural properties of silica alkoxide based silica aerogels.

• Journal of Korean Home Economics Education Association
• /
• v.33 no.3
• /
• pp.159-171
• /
• 2021

In order for young people to be interested in tradition, a specialized experience program that can be frequently encountered is needed. We have developed an after-school traditional gift-wrapping design program in relation to the subject of home economics for the purpose of enabling students to become interested in tradition and deepen their traditional knowledge. The research process was comprised of analysis, development, and evaluation. We analyzed the home economics curriculum, authentic designs from blogs and department stores along with books published by gift-wrapping associations, and interviews with three gift wrapping specialists. Contemporary traditional packaging design is not limited to the reproduction of the traditional design but also creates designs that strongly express unique Korean identity using traditional symbol patterns, colors, traditional decorations, and small items along with modern materials. A 16-week after-school program was developed based on the analysis results. After the implementation of the after-school program in a middle school, survey results showed students who were indifferent toward tradition showed interest and acquired a positive image towards tradition.

• Journal of Communication Design
• /
• v.64
• /
• pp.64-75
• /
• 2018

Luxury fashion brands, which have dominated the market of high-priced apparel, bags and shoes, are recently showing changes of stepping into the cosmetics market. The purpose of this study is to examine how luxury fashion brand identity is transferred to cosmetic brand while expanding into luxury cosmetic brand, and to analyze the plastic signs of cosmetic package design and to analyze visual identity through a semi-symbolic system. Therefore, in this study, we tried to analyze the visual semiotic analysis of the package design such as the cushion compact, the lip tint and the brand logo which appeared in the popular product line of the fashion luxury brand such as Yves Saint Laurent and Armani. As a result of the analysis, this study has identified the semantic qualities expressed by each plastic element through the visual semiotic analysis process of the cosmetic package of Yves Saint Laurent and Giorgio Armani. These traits were found to be used as visual signs to reveal the 'Classicism' identity pursued by Yves Saint Laurent and the 'Baroque' identity pursued by Armani. Based on the results of this study, this study finds that the brand identity as a fashion brand is not transferring to the visual identity of cosmetic brands in the case of Yves Saint Laurent. On the other hand, this study found that Armani uses visual communication strategies to effectively transfer the brand identity as a fashion brand to the visual identity of cosmetic brands. On these two different results, it is necessary to examine whether luxury fashion brands and also Korean fashion brands are expanding into the cosmetics market and how they can better grasp the existing brand identity and apply it to the communication strategies of cosmetics brands.

• Journal of the Microelectronics and Packaging Society
• /
• v.28 no.1
• /
• pp.47-54
• /
• 2021

For the bonding of smaller PCB solder bumps of less than 100 microns, an experiment was performed to make up a tin plating solution and find plating conditions in order to produce a bump pattern through tin electroplating, replacing the previous PCB solder bumps process by microballs. After SR patterning, a Cu seed layer was formed, and then, through DFR patterning, a pattern in which Sn can be selectively plated only within the SR pattern was formed on the PCB substrate. The tin plating solution was made based on methanesulfonic acid, and hydroquinone was used as an antioxidant to prevent oxidation of divalent tin ions. Triton X-100 was used as a surfactant, and gelatin was used as a grain refiner. By measuring the electrochemical polarization curve, the characteristics of organic additives in Triton X-100 and gelatin were compared. It was confirmed that the addition of Triton X-100 suppressed hydrogen generation up to -1 V vs. NHE, whereas gelatin inhibited hydrogen generation up to -0.7 V vs. NHE. As the current density increased, there was a general tendency that the grain size became finer, and it was observed that it became finer when gelatin was added.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.1
• /
• pp.49-54
• /
• 2022

The copper plating process used to fabricate the submicron damascene pattern of Cu wiring for Si wafer was applied to the plating of a PCB pattern of several tens of microns in size using the same organic additives and current density conditions. In this case, the non-uniformity of the plating thickness inside the pattern was observed. In order to quantitatively analyze the cause, a numerical calculation considering the solution flow and electric field was carried out. The calculation confirmed that the depletion of Cu²⁺ ions in the solution occurred relatively earlier at the bottom corner than the upper part of the pattern due to the plating of the sidewall and the bottom at the corner of the pattern bottom. The diffusion coefficient of Cu²⁺ ions is 2.65 10^-10 m²/s, which means that Cu²⁺ ions move at 16.3 ㎛ per second on average. In the cases of small damascene patterns, the velocity of Cu²⁺ ions is high enough to supply sufficient ions to the inside of the patterns, while sufficient time is required to replenish the exhausted copper ions in the case of a PCB pattern having a size of several tens of microns. Therefore, it is found that the thickness uniformity can be improved by reducing the current density to supply sufficient copper ions to the target area.