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http://dx.doi.org/10.6117/kmeps.2019.26.3.043

Improving Joint Reliability of Lead-free Solder on Flexible Substrate under Cyclic Bending by Adding Graphene Oxide Powder  

Ko, Yong-Ho (Joining R&D Group, Korea Institute of Industrial Technology (KITECH))
Yu, Dong-Yurl (Joining R&D Group, Korea Institute of Industrial Technology (KITECH))
Son, Junhyuk (Joining R&D Group, Korea Institute of Industrial Technology (KITECH))
Bang, Junghwan (Joining R&D Group, Korea Institute of Industrial Technology (KITECH))
Kim, Taek-Soo (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST))
Publication Information
Journal of the Microelectronics and Packaging Society / v.26, no.3, 2019 , pp. 43-49 More about this Journal
Abstract
In this study, a new approach using graphene oxide (GO) powder-composited Sn-3.0Ag-0.5Cu(in wt.%) solder paste for improving the bending reliability of solder joints between a flexible substrate and small outline package (SOP) was suggested. The GO addition slightly affected the melting temperature, however, the change in the melting temperature was not significant. Meanwhile, we observed the addition of GO could suppress IMC growth and IMC thickness of solder joint during the reflow process. Moreover, the cyclic bending test was also performed for evaluation of reliability in solder joint and we could improve the cyclic bending reliability of solder joint by adding GO powders. For 0.2 wt.% of GO added to the solder joint, the bending lifetime was increased to 20% greater than that without GO. Pull strength and ductility of the solder joint with GO were also higher than those of the joint without GO and it was assumed that this effect by adding GO could contribute to improve cyclic bending reliability of solder joint.
Keywords
graphene oxide (GO); flexible substrate; small outline package (SOP); solder joint; cyclic bending test;
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Times Cited By KSCI : 2  (Citation Analysis)
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