Development of Polymer Elastic Bump Formation Process and Bump Deformation Behavior Analysis for Flexible Semiconductor Package Assembly |
Lee, Jae Hak
(Dept. of Ultra-Precision Machines and Systems, Advanced Manufacturing Systems Research Division Korea Institute of Machinery and Materials (KIMM))
Song, Jun-Yeob (Dept. of Ultra-Precision Machines and Systems, Advanced Manufacturing Systems Research Division Korea Institute of Machinery and Materials (KIMM)) Kim, Seung Man (Dept. of Ultra-Precision Machines and Systems, Advanced Manufacturing Systems Research Division Korea Institute of Machinery and Materials (KIMM)) Kim, Yong Jin (Dept. of Ultra-Precision Machines and Systems, Advanced Manufacturing Systems Research Division Korea Institute of Machinery and Materials (KIMM)) Park, Ah-Young (Dept. of Ultra-Precision Machines and Systems, Advanced Manufacturing Systems Research Division Korea Institute of Machinery and Materials (KIMM)) |
1 | J. V. D. Brand, M. de Kok, M. Koetse, M. Cauwe, R. Verplancke, F. Bossuyt, M. Jablonski, and Jan Vanfleteren, "Flexible and stretchable electronics for wearable health devices", Solid-State Electronics, 113, 116 (2015). DOI |
2 | D. H. Park, K. S. Han, and T. S. Oh, "Comparison of flipchip bonding characteristics on rigid, flexible, and stretchable substrates: Part II. Flip-chip bonding on compliant substrates", Materials Transactions, 58(8), 1217 (2017). DOI |
3 | J. V. D. Brand, J. D. Baets, T. V. Mol, and A. Dietzel, "Systems-in-foil-Devices, fabrication processes and reliability issues", Microelectronics Reliability, 48(8-9), 1123 (2008). DOI |
4 | J. N. Burghartz, "Ultra-Thin Chip Technology and Applications", pp.141-157, Springer, New York (2011). |
5 | J. M. Koo, Y. N. Kim, J. B. Lee, J.W. Kim, S. S. Ha, S. H. Won, S. J. Suh, M. S. Shin, P. W. Cheon, and S. B. Jung, "Ultrasonic bonding of Au stud flip chip bump on flexible printed circuit board", J. Microelectron. Pacag. Soc., 14(4), 79 (2007). |
6 | J. K. Chen, Z. L. Xu, Y. A. Huang, Y. Q. Duan, and Z. P. Yin, "Analytical investigation on thermal-induced warpage behavior of ultrathin chip-on-flex (UTCOF) assembly", Science China Technological Sciences, 59(11), 1646 (2016). DOI |
7 | M. Feil, C. Adler, D. Hemmetzberger, M. Konig, and K. Bock , "The challenge of ultra thin chip assembly", Proc. 54th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, 35, IEEE Components and Manufacturing Technology Society (2004). |
8 | T. H. Lee, K. H. Shin, and Y. J. Kim, "Flexible and Embedded Packaging of Thinned Silicon Chip", J. Microelectron. Pacag. Soc., 11(1), 29 (2004). |