A Study on the Microstructure Formation of Sn Solder Bumps by Organic Additives and Current Density |
Kim, Sang-Hyeok
(Department of Materials Science and Engineering, Dong-A University)
Kim, Seong-Jin (Department of Materials Science and Engineering, Dong-A University) Shin, Han-Kyun (Department of Materials Science and Engineering, Dong-A University) Heo, Cheol-Ho (Substrate Solution, Samsung Electro-Mechanics) Moon, Seongjae (Substrate Solution, Samsung Electro-Mechanics) Lee, Hyo-Jong (Department of Materials Science and Engineering, Dong-A University) |
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