A Study on The Effect of Current Density on Copper Plating for PCB through Electrochemical Experiments and Calculations |
Kim, Seong-Jin
(Department of Materials Science and Engineering, Dong-A University)
Shin, Han-Kyun (Department of Materials Science and Engineering, Dong-A University) Park, Hyun (Department of Materials Science and Engineering, Dong-A University) Lee, Hyo-Jong (Department of Materials Science and Engineering, Dong-A University) |
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