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S. H. Kim, S. K. Hong, H. H. Yim, H. J. Lee, "Characterization of the SnAg Electrodeposits according to the Current Density and Cross-sectional Microstructure Analysis in the Cu Pillar Solder Bump", J. Kor. Inst. Surf. Eng. 48(4), 131 (2015).
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D. Josell, D. Wheeler, W. H. Huber, and T. P. Moffat, "Super-conformal Electrodeposition in Submicron Features", Phys. Rev. Lett. 87, 016102 (2001).
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T. P. Moffat, D. Wheeler, M. D. Edelstein, and D. Josell, "Superconformal Film Growth: Mechanism and Quantification", IBM J. Res. & Dev. 49, 19 (2005).
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9 |
S. H. Kim, S. J. Kim, H. K. Shin, C. H. Heo, S. Moon, and H. J. Lee, "A Study on the Microstructure Formation of Sn Solder Bumps by Organic Additives and Current Density", J. Microelectron. Packag. Soc., 28(1), 47 (2021).
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S. H. Kim, H. J. Lee, D. Josell, and T. P. Moffat, "Bottom-up Cu filling of annular through silicon vias microstructure and texture", Electrochim Acta 335, 135612 (2020).
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