• 대한산업공학회지
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• 제33권2호
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• pp.273-281
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• 2007

The decision of how long performing system burn-in must be answered with a probabilistic model of a system lifetime at which infant mortality failures created during assembly processes are quantified. In this paper, we propose such a model which is modified from previous results. Using the system model, we derived system reliability in terms of component and system burn-in times for the two cases of minimal repair at system failure and of component replacement and connection repair at their failure times. The procedure is illustrated with a bridge system and the optimal system burn-in times are obtained for maximizing system reliability. The result suggests that an assumption of minimal repair at system failure may underestimate the optimal burn-in time in practice.

• 산업경영시스템학회지
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• 제35권4호
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• pp.1-9
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• 2012

Decisions on reliability screening rules and burn-in policies are determined based on the estimated reliability. The variability in a semiconductor manufacturing process does not only causes quality problems but it also makes reliability estimation more complicated. This study investigates the nonuniformity characteristics of integrated circuit reliability according to defect density distribution within a wafer and between wafers then develops optimal burn-in policy based on the estimated reliability. New reliability estimation model based on yield information is developed using a spatial stochastic process. Spatial defect density variation is reflected in the reliability estimation, and the defect densities of each die location are considered as input variables of the burn-in optimization. Reliability screening and optimal burn-in policy subject to the burn-in cost minimization is examined, and numerical experiments are conducted.

• Communications for Statistical Applications and Methods
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• 제12권1호
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• pp.1-9
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• 2005

Burn-in is an engineering method which is used to eliminate early failures of products or systems after they have been produced. Recently, various models for determining optimal burn-in times have been developed, where some preventive maintenance policies were considered together with burn-in problem. In this paper, a survey of recent research in burn-in is undertaken.

• 산업경영시스템학회지
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• 제19권40호
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• pp.99-105
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• 1996

최적 Burn-In 방법은 신뢰성이나 평균수명을 극대화하고 위험율과 Cost를 극소화 하는 것이다. 기존의 연구는 하나의 목적을 대상으로 Burn-In 방법에 대하여 연구하였으나 상호 상충되는 목표에 대해 의사 결정을 하는 복잡하고 어려운 상황을 고려하여야 한다. 그러므로 둘 이상의 목표에 대한 최적의 Burn-In 방법에 대하여 연구되어야 한다. 본 논문에서는 이를 위해 Surrogate Worth Trade Off 기법을 사용하여 실제 최적의 Burn-In 방법을 구하고자 하는 경우에 대하여 연구하였다.

• Journal of the Korean Data and Information Science Society
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• 제14권4호
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• pp.997-1005
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• 2003

In this paper, the problem of determining optimal burn-in time is considered under a general failure model. There are two types of failure in the general failure model. One is Type I failure (minor failure) which can be removed by a minimal repair and the other is Type II failure (catastrophic failure) which can be removed only by a complete repair. In this model, when the unit fails at its age t, Type I failure occurs with probability 1 - p(t) and Type II failure occurs with probability p(t), $0{\leq}p(t)\leq1$. Under the model, the properties of optimal burn-in time maximizing mean time to the catastrophic failure during field operation are obtained. The obtained results are also applied to some illustrative examples.

• 품질경영학회지
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• 제21권2호
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• pp.102-108
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• 1993

The purpose of burn-in is to eliminate the early failures of the products before they are delivered for customer use. Therefore burn-in should he continued until one is reasonally sure that all the weak items have failed, thus leaving the remaining items in a healthy state of reliability. From this point of view, burn-in time dependent costs such as a cost per product per burn-in time, and cost of repair of the product per failure occurred during burn-in time will he increased. Conversely, the cost of field repair of the product per failure occurred during the guarantee period will be decreased since the early failure of the product is fully eliminated during burn-in. Hence, this paper intend to determine optimal burn-in time which minimize the total of above costs associated with burn-in.

• 한국추진공학회지
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• 제18권3호
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• pp.40-47
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• 2014

우주발사체 최적 설계에 사용될 내탄도 해석 코드를 위한 그레인 Burn-back 연구를 수행하였다. 그레인 Burn-back은 내탄도 해석에 필수적인 그레인의 연소면적의 계산에 사용된다. 최적 설계에 사용될 내탄도 해석 코드는 설계 변수의 변경 및 반복계산을 통해 요구 성능을 만족할 때 까지 반복 계산을 수행한다. 따라서 내탄도 해석에 적용될 Burn-back 해석기법은 설계 변수의 변경이 용이하며 계산시간이 짧아야 한다. 이에 본 연구에서는 Analytical Method를 이용하여 Burn-back 해석코드를 개발하였으며, 그레인 형상에 대해 기하학적 변수를 선정 및 형상 변화에 대해 정리하였다. 개발된 코드는 Numerical Method로부터 산출된 값과 비교하여 검증을 수행하였다.

• 대한안전경영과학회:학술대회논문집
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• 대한안전경영과학회 2001년도 춘계학술대회
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• pp.77-81
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• 2001

Burn-in is a test procedure to find and eliminate the inherent initial failure of a product during or at the final stage of production process. Software testing is the validation and verification process which is used to cut off the faults from a software. The two have the common function and objective of "debugging". This article summarizes some significant models on the optimal hardware and software burn-in time, and provides the relevant paper lists. The need for the development of the unified burn-in policy of a hardware-software system is addressed.addressed.

• Journal of the Korean Statistical Society
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• 제28권4호
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• pp.399-413
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• 1999

• 산업공학
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• 제20권1호
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• pp.87-93
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• 2007

Burn-in is an engineering method for screening out products containing reliability defects which would cause early failures in field operation. Previously, various burn-in models have been proposed mainly focused on the trade-off of shop repair cost and warranty cost ignoring manufacturing yield. From the view point of a manufacturer, however, burn-in decreases warranty cost at the expense of yield reduction. In this paper, we provide a general model quantifying a trade-off between product yield and reliability, in which any defect distribution from previous yield models can be used. A profit function is expressed in burn-in environments for determining an optimal burn-in time. Finally, the method is illustrated with gate oxide failures which is an important reliability concerns for VLSI CMOS circuits.