Journal of Korean Society of Industrial and Systems Engineering (산업경영시스템학회지)

Society of Korea Industrial and System Engineering (한국산업경영시스템학회)
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Differential Burn-in and Reliability Screening Policy Using Yield Information Based on Spatial Stochastic Processes

공간적 확률 과정 기반의 수율 정보를 이용한 번인과 신뢰성 검사 정책

  • Hwang, Jung Yoon (Device Solution Division, Samsung Electronics Co., Ltd.) ;
  • Shim, Younghak (Device Solution Division, Samsung Electronics Co., Ltd.)
  • Received : 2012.05.08
  • Accepted : 2012.09.23
  • Published : 2012.12.31
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Abstract

Decisions on reliability screening rules and burn-in policies are determined based on the estimated reliability. The variability in a semiconductor manufacturing process does not only causes quality problems but it also makes reliability estimation more complicated. This study investigates the nonuniformity characteristics of integrated circuit reliability according to defect density distribution within a wafer and between wafers then develops optimal burn-in policy based on the estimated reliability. New reliability estimation model based on yield information is developed using a spatial stochastic process. Spatial defect density variation is reflected in the reliability estimation, and the defect densities of each die location are considered as input variables of the burn-in optimization. Reliability screening and optimal burn-in policy subject to the burn-in cost minimization is examined, and numerical experiments are conducted.

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References

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