산업공학 (IE interfaces)

  • 제20권1호
  • /
  • Pages.87-93
  • /
  • 2007
  • /
  • 1225-0996(pISSN)
  • /
  • 2234-6465(eISSN)
대한산업공학회 (Korean Institute of Industrial Engineers)
권호 표지

수율과 신뢰도의 상충효과를 고려한 번인

Burn-in Considering a Trade-Off of Yield and Reliability

  • 투고 : 20061100
  • 심사 : 20070100
  • 발행 : 2007.03.31
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

Burn-in is an engineering method for screening out products containing reliability defects which would cause early failures in field operation. Previously, various burn-in models have been proposed mainly focused on the trade-off of shop repair cost and warranty cost ignoring manufacturing yield. From the view point of a manufacturer, however, burn-in decreases warranty cost at the expense of yield reduction. In this paper, we provide a general model quantifying a trade-off between product yield and reliability, in which any defect distribution from previous yield models can be used. A profit function is expressed in burn-in environments for determining an optimal burn-in time. Finally, the method is illustrated with gate oxide failures which is an important reliability concerns for VLSI CMOS circuits.

키워드

참고문헌

  1. Block, H.W. and Savits, T. H. (1997), Burn-in, Statistical Science, 12(1), 1-13 https://doi.org/10.1214/ss/1029963258
  2. Cunningham, J. A.(1990), The Use and Evaluation of Yield Models in Integrated Circuit Manufacturing, IEEE Transactions on Semiconductor Manufacturing, 3 (2),60-71 https://doi.org/10.1109/66.53188
  3. Ferris-Prabhu, A. V. (1992) lntroduction to Semiconductor Device Yield Modeling, Artech House, Boston, MA.
  4. Huston, H.H and Clarke, C. P. (1992) Reliability Defect Detection and Screening during Processing: Theory and Implementation, Proc. Int Reliability Physics Sympos,268-275
  5. Jensen, F. and Peterson, N. E. (1982), Burn-in : An Engineering Approach to the Design and Analysis of Burn-in Procedures, John Wiley & Sons
  6. Kuo, W., Kim, K. O. and Kim, T. (2006), Modeling and Analyzing Yield, Burn-in and Reliability for Semiconductor Manufacturing, Springer Handbook of Engineering Statistics. Pham, Hoang(Ed.)
  7. Kim, K. O., Kuo, W. and Luo, W. (2004), A Relation Model of Gate Oxide Yield and Reliability, Microelectronics Reliability, 44(3), 425-434 https://doi.org/10.1016/j.microrel.2003.09.009
  8. Kim, K. O., Zuo, M.J. and Kuo, W. (2005), On the Relationship of Semiconductor Yield and Reliability, IEEE Transaactions on Semiconductor Manufacturing, 18(3),422-429 https://doi.org/10.1109/TSM.2005.852110
  9. King, J. C, Chan, W, Y. and Hu, C (1994), Efficient Gate Oxide Defect Screen for VLSI Reliability, IEEE/IEDM, 597-600
  10. Lee J. C, Chen, I.C and Hu, C (1988), Modeling and Characterizing of Gate Oxide Reliability, IEEE Transactions on Electron Devices, 35(12), 2268-2277 https://doi.org/10.1109/16.8802
  11. Leemis. L, M. and Beneke, M.(1990), Burn-in Models and Methods: a Review, lIE Transactions, 22(2), 172-180
  12. Mi, J. (1997), Warranty Policies and Burn-in, Naval Research Logistics, 44(2), 199-209 https://doi.org/10.1002/(SICI)1520-6750(199703)44:2<199::AID-NAV4>3.0.CO;2-4
  13. Mi,J. (1994), Burn-in and Maintenance Policies, Advances in Applied Probability, 26(1), 207-221 https://doi.org/10.2307/1427587
  14. Moazzami, R and Hu, C (1990), Projecting Gate Oxide Reliability and Optimizing Reliability Screens, IEEE Transactions on Electron Devices, 37(7), 1643-1650 https://doi.org/10.1109/16.55751
  15. Nguyen, D. G. and Murphy, D. N. P,(1982), Optimal Burn-in Time to Minimize Cost for Products Sold under Warranty, IIE Transactions, 14(3), 167-174 https://doi.org/10.1080/05695558208974600
  16. Park, K. S.(1985), Effect of Burn-in on Mean Residual Life, IEEE Transactions on Reliability, 34(2), 522-523 https://doi.org/10.1109/TR.1985.5222253