• 제목/요약/키워드: Normal process

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Utilization of Averaging Process of Blink Reflex to Improve Diagnosis of Facial Nerve Palsy

  • Yoo, Jong-Kyun;Cho, Jeong-Hee;Kim, Dea-Sik
    • 대한의생명과학회지
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    • 제18권4호
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    • pp.391-398
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    • 2012
  • The conventional blink reflex has limited clinical application since it displays a wide range of change in the responses. Thus, we studied the blink reflex using the averaging process which is engaged in evoked potential studies in order to measure various responses such as latency, amplitude, and duration, which have been difficult to measure due to their wide ranges of changes. Among the Bell's palsy patient group, 13 patients who had the symptoms of incomplete palsy were examined to assess the results of the blink reflex through the averaging process. The subjects were 54 people in a normal group (108 eyes) and 18 patients (36 eyes) with Bell's palsy. For the study method, the conventional blink reflex and the blink reflex using the averaging process were measured for the people in the normal group, while in the Bell's palsy group, only the blink reflex using the averaging process was analyzed. In the case of the normal group, the blink reflex using the averaging process could measure all of the latency, amplitude, and duration. It was also observed that the latency, amplitude, and duration of R1, ipsilateral R2, and contralateral R2 significantly differed on the affected side of the Bell's palsy patients, compared to the unaffected side. The blink reflex using the averaging process should be more effective than the conventional method since the former can evaluate the latency, amplitude, and duration for Bell's palsy, while the latter can only assess latency.

Control Charts for Means and Variances under Multivariate Normal Process

  • Chang, Duk-Joon;Kwon, Yong-Man
    • Journal of the Korean Data and Information Science Society
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    • 제10권1호
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    • pp.223-232
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    • 1999
  • Multivariate quality control charts with combine-accumulate approach and accumulate-combine apprach for monitoring both means and variances under multivariate normal process are investigated. Numerical performances of the charts show that multivariate EWMA chart with accumulate-combine approach can be recommended for all kinds of shift in means and variances.

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박판 성형 공정의 유한요소 해석을 위한 마찰접촉 모델 (Frictional Contact Model for Finite Element Analysis of Sheet-Metal Forming Processes)

  • 금영탁
    • 대한기계학회논문집
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    • 제17권9호
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    • pp.2242-2251
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    • 1993
  • The mesh-based frictional contact model has been developed which does not rely on the spatial derivatives of the tool surface. Only points on the surface are evaluated from the description. which can then be simplified because of the relaxed demands placed on it. The surface tangents, normals, and corresponding derivatives at each finite-element node are evaluated directly from the finite-element mesh, in terms of the connecting nodal positions. The advantages accrue because there is no longer a need for a smooth tool surface to assure reasonable normals and derivatives. Furthermore, it can be shown that the equilibrium equations can only be properly written with a special normal derived from the mesh itself. The validity, accuracy, computation time, and stability of mesh-based contact model were discussed with the numerical examples of rounded flat-top and rough, flat-top rounded punch forming operations. Also, the forming process of a automobile inner panel section was simulated for testing the robustness of new contact model. In the discussion, the superiority of new model was examined, comparing with tool-based contact one.

붓스트랩 $C_{pp}$ 다공정 수행분석차트 (Bootstrap $C_{pp}$ Multiple Process Performance Analysis Chart)

  • 장대흥
    • 품질경영학회지
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    • 제38권2호
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    • pp.171-179
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    • 2010
  • Pearn et al.(2002) supposed the $C_{pp}$ multiple process performance analysis chart. This chart displays multiple processes with the process variation and process departure on one single chart. But, this chart can not display the distribution of the process variation and process departure and is inappropriate for processes with non-normal distributions. With bootstrapping method, we can display the distribution of the process variation and process departure on the $C_{pp}$ multiple process performance analysis chart.

재작업과 폐기가 수반되는 경제적 생산량 모형 (Economic Manufacturing Quantity Models with Rework and Disposal)

  • 손권익
    • 산업기술연구
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    • 제36권
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    • pp.23-31
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    • 2016
  • This paper presents EMQ models in which some proportion of defective items are produced and some of them are converted to good items through rework process and items not converted are disposed. Numerical models are developed for three cases of disposal and optimal solution of each model is derived. In the first model, if a defective item is found during the production process, only re-workable items are stored and reworked after normal production is finished. Not re-workable items are disposed immediately during normal production. The second model deals with the case where all defective items are stored and items to be disposed are determined in rework process. In the third model, an additional inspection process exists before rework to determine rework or disposal. Numerical examples are presented to validate the proposed models.

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3차원 심실모델을 이용한 심근허혈 시뮬레이션 (A Simulation of the Cardiac Ischemia Using Three Dimensional Ventricular Model)

  • 이경중;윤형로
    • 대한의용생체공학회:학술대회논문집
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    • 대한의용생체공학회 1994년도 추계학술대회
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    • pp.61-64
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    • 1994
  • This paper describes the construction of an anisotropic three dimensional ventricular model based on the bidomain model. The cardiac artivation process in the normal cardiac cell and the myocardiac ischemic cell are simulated by the Huygen's principle. The depolarization process in the myocardial ischemia displays the delayed activation compared to the normal state. The repolarization process is simulated by the myocardial potential at the arbitrary ellapsed time after activation process.

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기판의 왕복 운동을 이용한 인라인 식각세정장치 내 ITO 식각특성 (ITO Wet Etch Properties in an In-line Wet Etch/Cleaning System by using an Alternating Movement of Substrate)

  • 홍성재;권상직;조의식
    • 한국전기전자재료학회논문지
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    • 제21권8호
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    • pp.715-718
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    • 2008
  • An in-line wet etch/cleaning system was established for the research and development in wet etch process. The system was equipped with a reverse moving system for the reduction in the size of the in-line wet etch/cleaning system and it was possible for the glass substrate to be moved back and forth and alternated in a wet etch bath. For the comparison of the effect of the normal motion and that of the alternating motion on the in-line wet etch process, indium tin oxide(ITO) pattern was obtained through both wet etch process conditions. The results showed that the alternating motion is not inferior to the normal motion in etch rate and in etch uniformity. It is concluded that the alternating motion is possible to be applied to the in-line etch process.

Re-exploring teaching and learning of probability and statistics using Excel

  • Lee, Seung-Bum;Park, Jungeun;Choi, Sang-Ho;Kim, Dong-Joong
    • 한국컴퓨터정보학회논문지
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    • 제21권7호
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    • pp.85-92
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    • 2016
  • The law of large numbers, central limit theorem, and connection among binomial distribution, normal distribution, and statistical estimation require dynamics of continuous visualization for students' better understanding of the concepts. During this visualization process, the differences and similarities between statistical probability and mathematical probability that students should observe need to be provided with the intermediate steps in the converging process. We propose a visualization method that can integrate intermediate processes and results through Excel. In this process, students' experiences with dynamic visualization help them to perceive that the results are continuously changed and extracted from multiple situations. Considering modeling as a key process, we developed a classroom exercise using Excel to estimate the population mean and standard deviation by using a sample mean computed from a collection of data out of the population through sampling.

핵연료 밀집공정의 지능적 조업을 위한 전문가시스템 모형의 개발 (Development of a Prototype Expert System for Intelligent Operation Aids in Rod Consolidation Process)

  • Kim, Ho-Dong;Kim, Ki-Joo;Yoon, Wan-Ki
    • Nuclear Engineering and Technology
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    • 제25권1호
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    • pp.1-7
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    • 1993
  • 핵연료 밀집공정의 조업을 보조하는 전문가시스템 모형을 개발하였다. 시스템의 지식기반은 3개의 데이타베이스와 60개의 규칙을 객체지향 방법에 의해 설계되었다. 본 전문가시스템은 핵연료 밀집시설의 물질계량관리 영역에서 핵물질의 이동 상황을 추적하여 체계적으로 데이터베이스화하고, 정상 및 비정상조업 조건하에서 현 운전상황을 진단하며, 비정상 조업상황을 적절히 회복할 수 있게 조업자에게 필요한 정보를 제공하여, 효과적으로 핵연료 밀집시설의 공정조업을 이룰 수 있도록 하였다.

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열처리 방법에 따른 실리콘 기판쌍의 접합 특성 (Bonding Property of Silicon Wafer Pairs with Annealing Method)

  • 민홍석;이상현;송오성;주영창
    • 한국전기전자재료학회논문지
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    • 제16권5호
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    • pp.365-371
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    • 2003
  • We prepared silicon on insulator(SOI) wafer pairs of Si/1800${\AA}$ -SiO$_2$ ∥ 1800${\AA}$ -SiO$_2$/Si using water direct bonding method. Wafer pairs bonded at room-temperature were annealed by a normal furnace system or a fast linear annealing(FLA) equipment, and the micro-structure of bonding interfaces for each annealing method was investigated. Upper wafer of bonded pairs was polished to be 50 $\mu\textrm{m}$ by chemical mechanical polishing(CMP) process to confirm the real application. Defects and bonding area of bonded water pairs were observed by optical images. Electrical and mechanical properties were characterized by measuring leakage current for sweeping to 120 V, and by observing the change of wafer curvature with annealing process, respectively. FLA process was superior to normal furnace process in aspects of bonding area, I-V property, and stress generation.