Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
권호 표지
DOI QR코드

DOI QR Code

ITO Wet Etch Properties in an In-line Wet Etch/Cleaning System by using an Alternating Movement of Substrate

기판의 왕복 운동을 이용한 인라인 식각세정장치 내 ITO 식각특성

  • Published : 2008.08.01
Download PDF
⟨ Previous Next ⟩

Abstract

An in-line wet etch/cleaning system was established for the research and development in wet etch process. The system was equipped with a reverse moving system for the reduction in the size of the in-line wet etch/cleaning system and it was possible for the glass substrate to be moved back and forth and alternated in a wet etch bath. For the comparison of the effect of the normal motion and that of the alternating motion on the in-line wet etch process, indium tin oxide(ITO) pattern was obtained through both wet etch process conditions. The results showed that the alternating motion is not inferior to the normal motion in etch rate and in etch uniformity. It is concluded that the alternating motion is possible to be applied to the in-line etch process.

Keywords

References

  1. J. W. Kim, K. J. Hong, H. C. Cho, K. S. Kim, D. Y. Kim, and J. K. Cho, "A study on design of intelligent wet station for semiconductor", Journal of the Semiconductor & Display Equipment Technology, Vol. 4, No. 3, p. 29, 2005
  2. S. Y. Yoo, H. S. Choi, J. I. Ryu, W. B Lee, and J. Y. Lee, "Manufacturing process of 4mask a—Si TFT panel by one step dry etching on Mo/Al/Mo data line", IDW05, p. 1121, 2005
  3. Y. J. Lee, J. W. Bae, H. R. Han, J. S. Kim, and G. Y. Yeom, "Dry etching characteristics of ITO thin films deposited on plastic substrates", Thin Solid Films, Vol. 383, Issues 1-2, p. 281, 2001 https://doi.org/10.1016/S0040-6090(00)01578-9
  4. Meziani, P. Colpo, V. Lambertini, G. Ceccone, and F. Rossi, "Dry etching of ITO by magnetic pole enhanced inductively coupled plasma for display and biosensing devices Applied Surface", Science, Vol. 252, Issue 10, p. 3861T, 2006
  5. I. H. Moon, S. J. Cho, and Y. K. Hwang, "Propulsion force coefficient of injection nozzle size on air levitation type wafer transfer system", Journal of the Semiconductor & Display Equipment Technology, Vol. 4, No. 1, p. 35, 2005