[KSCI] Korea Science Citation Index Service

http://dx.doi.org/10.4313/JKEM.2008.21.8.715

ITO Wet Etch Properties in an In-line Wet Etch/Cleaning System by using an Alternating Movement of Substrate

Hong, Sung-Jae (경원대학교 전자공학과)
Kwon, Sang-Jik (경원대학교 전자공학과)
Cho, Eou-Sik (경원대학교 전자공학과)

Publication Information

Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.21, no.8, 2008 , pp. 715-718 More about this Journal

Abstract

An in-line wet etch/cleaning system was established for the research and development in wet etch process. The system was equipped with a reverse moving system for the reduction in the size of the in-line wet etch/cleaning system and it was possible for the glass substrate to be moved back and forth and alternated in a wet etch bath. For the comparison of the effect of the normal motion and that of the alternating motion on the in-line wet etch process, indium tin oxide(ITO) pattern was obtained through both wet etch process conditions. The results showed that the alternating motion is not inferior to the normal motion in etch rate and in etch uniformity. It is concluded that the alternating motion is possible to be applied to the in-line etch process.

Keywords

In-line wet etch/cleaning system; Alternating motion; Etch-uniformity;

Citations & Related Records

Reference

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KSCI

ITO Wet Etch Properties in an In-line Wet Etch/Cleaning System by using an Alternating Movement of Substrate 기판의 왕복 운동을 이용한 인라인 식각세정장치 내 ITO 식각특성

ITO Wet Etch Properties in an In-line Wet Etch/Cleaning System by using an Alternating Movement of Substrate