• Biomedical Science Letters
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• v.18 no.4
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• pp.391-398
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• 2012

The conventional blink reflex has limited clinical application since it displays a wide range of change in the responses. Thus, we studied the blink reflex using the averaging process which is engaged in evoked potential studies in order to measure various responses such as latency, amplitude, and duration, which have been difficult to measure due to their wide ranges of changes. Among the Bell's palsy patient group, 13 patients who had the symptoms of incomplete palsy were examined to assess the results of the blink reflex through the averaging process. The subjects were 54 people in a normal group (108 eyes) and 18 patients (36 eyes) with Bell's palsy. For the study method, the conventional blink reflex and the blink reflex using the averaging process were measured for the people in the normal group, while in the Bell's palsy group, only the blink reflex using the averaging process was analyzed. In the case of the normal group, the blink reflex using the averaging process could measure all of the latency, amplitude, and duration. It was also observed that the latency, amplitude, and duration of R1, ipsilateral R2, and contralateral R2 significantly differed on the affected side of the Bell's palsy patients, compared to the unaffected side. The blink reflex using the averaging process should be more effective than the conventional method since the former can evaluate the latency, amplitude, and duration for Bell's palsy, while the latter can only assess latency.

• Journal of the Korean Data and Information Science Society
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• v.10 no.1
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• pp.223-232
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• 1999

Multivariate quality control charts with combine-accumulate approach and accumulate-combine apprach for monitoring both means and variances under multivariate normal process are investigated. Numerical performances of the charts show that multivariate EWMA chart with accumulate-combine approach can be recommended for all kinds of shift in means and variances.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.9
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• pp.2242-2251
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• 1993

The mesh-based frictional contact model has been developed which does not rely on the spatial derivatives of the tool surface. Only points on the surface are evaluated from the description. which can then be simplified because of the relaxed demands placed on it. The surface tangents, normals, and corresponding derivatives at each finite-element node are evaluated directly from the finite-element mesh, in terms of the connecting nodal positions. The advantages accrue because there is no longer a need for a smooth tool surface to assure reasonable normals and derivatives. Furthermore, it can be shown that the equilibrium equations can only be properly written with a special normal derived from the mesh itself. The validity, accuracy, computation time, and stability of mesh-based contact model were discussed with the numerical examples of rounded flat-top and rough, flat-top rounded punch forming operations. Also, the forming process of a automobile inner panel section was simulated for testing the robustness of new contact model. In the discussion, the superiority of new model was examined, comparing with tool-based contact one.

• Journal of Korean Society for Quality Management
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• v.38 no.2
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• pp.171-179
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• 2010

Pearn et al.(2002) supposed the $C_{pp}$ multiple process performance analysis chart. This chart displays multiple processes with the process variation and process departure on one single chart. But, this chart can not display the distribution of the process variation and process departure and is inappropriate for processes with non-normal distributions. With bootstrapping method, we can display the distribution of the process variation and process departure on the $C_{pp}$ multiple process performance analysis chart.

• Journal of Industrial Technology
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• v.36
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• pp.23-31
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• 2016

This paper presents EMQ models in which some proportion of defective items are produced and some of them are converted to good items through rework process and items not converted are disposed. Numerical models are developed for three cases of disposal and optimal solution of each model is derived. In the first model, if a defective item is found during the production process, only re-workable items are stored and reworked after normal production is finished. Not re-workable items are disposed immediately during normal production. The second model deals with the case where all defective items are stored and items to be disposed are determined in rework process. In the third model, an additional inspection process exists before rework to determine rework or disposal. Numerical examples are presented to validate the proposed models.

• Proceedings of the KOSOMBE Conference
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• v.1994 no.12
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• pp.61-64
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• 1994

This paper describes the construction of an anisotropic three dimensional ventricular model based on the bidomain model. The cardiac artivation process in the normal cardiac cell and the myocardiac ischemic cell are simulated by the Huygen's principle. The depolarization process in the myocardial ischemia displays the delayed activation compared to the normal state. The repolarization process is simulated by the myocardial potential at the arbitrary ellapsed time after activation process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.8
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• pp.715-718
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• 2008

An in-line wet etch/cleaning system was established for the research and development in wet etch process. The system was equipped with a reverse moving system for the reduction in the size of the in-line wet etch/cleaning system and it was possible for the glass substrate to be moved back and forth and alternated in a wet etch bath. For the comparison of the effect of the normal motion and that of the alternating motion on the in-line wet etch process, indium tin oxide(ITO) pattern was obtained through both wet etch process conditions. The results showed that the alternating motion is not inferior to the normal motion in etch rate and in etch uniformity. It is concluded that the alternating motion is possible to be applied to the in-line etch process.

• Journal of the Korea Society of Computer and Information
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• v.21 no.7
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• pp.85-92
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• 2016

The law of large numbers, central limit theorem, and connection among binomial distribution, normal distribution, and statistical estimation require dynamics of continuous visualization for students' better understanding of the concepts. During this visualization process, the differences and similarities between statistical probability and mathematical probability that students should observe need to be provided with the intermediate steps in the converging process. We propose a visualization method that can integrate intermediate processes and results through Excel. In this process, students' experiences with dynamic visualization help them to perceive that the results are continuously changed and extracted from multiple situations. Considering modeling as a key process, we developed a classroom exercise using Excel to estimate the population mean and standard deviation by using a sample mean computed from a collection of data out of the population through sampling.

• Nuclear Engineering and Technology
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• v.25 no.1
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• pp.1-7
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• 1993

This paper describes a prototype expert system to aid operation in rod consolidation process. The knowledgebase is composed of three database groups and 60 rules with production, and object oriented techniques that correlates database groups. The expert system is designed to track the transitions of nuclear materials through the operation areas of the rod consolidation process, to diagnose current status in any operating conditions, normal and off-normal, and to advise operators to properly recover off-normality. The expert system can give efficient management of nuclear material accountability and process operation in the rod consolidation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.365-371
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• 2003

We prepared silicon on insulator(SOI) wafer pairs of Si/1800${\AA}$ -SiO$_2$ ∥ 1800${\AA}$ -SiO$_2$/Si using water direct bonding method. Wafer pairs bonded at room-temperature were annealed by a normal furnace system or a fast linear annealing(FLA) equipment, and the micro-structure of bonding interfaces for each annealing method was investigated. Upper wafer of bonded pairs was polished to be 50 $\mu\textrm{m}$ by chemical mechanical polishing(CMP) process to confirm the real application. Defects and bonding area of bonded water pairs were observed by optical images. Electrical and mechanical properties were characterized by measuring leakage current for sweeping to 120 V, and by observing the change of wafer curvature with annealing process, respectively. FLA process was superior to normal furnace process in aspects of bonding area, I-V property, and stress generation.