• KIPS Transactions on Computer and Communication Systems
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• v.3 no.5
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• pp.129-140
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• 2014

BIST(Built-in self test) is to detect various faults of the existing memory and BIRA(Built-in redundancy analysis) is to repair detected faults by allotting spare. Also, BISR(Built-in self repair) which integrates BIST with BIRA, can enhance the whole memory's yield. However, the previous methods were suggested for RAM and are difficult to diagnose disturbance that is NAND-type flash memory's intrinsic fault when used for the NAND-type flash memory with different characteristics from RAM's memory structure. Therefore, this paper suggests a BISD(Built-in self diagnosis) to detect disturbance occurring in the NAND-type flash memory and to diagnose the location of fault, and BISR to repair faulty blocks.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.6
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• pp.122-130
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• 2013

The demand and the supply are increasing sharply in accordance with the growth of the Memory Semiconductor Industry. The Flash Memory above all is being utilized substantially in the Industry of smart phone, the tablet PC and the System on Chip (SoC). The Flash Memory is divided into the NOR-type Flash Memory and the NAND-type Flash Memory. A lot of study such as the Built-In Self Test (BIST), the Built-In Self Repair (BISR) and the Built-In Redundancy Analysis (BIRA), etc. has been progressed in the NOR-type fash Memory, the study for the Built-In Self Test of the NAND-type Flash Memory has not been progressed. At present, the pattern test of the NAND-type Flash Memory is being carried out using the outside test equipment of high price. The NAND-type Flash Memory is being depended on the outside equipment as there is no Built-In Self Test since the erasure of block unit, the reading and writing of page unit are possible in the NAND-type Flash Memory. The Built-In Self Test equipped with 2 kinds of finite state machine based structure is proposed, so as to carry out the pattern test without the outside pattern test equipment from the NAND-type Flash Memory which carried out the test dependant on the outside pattern test equipment of high price.

• Journal of The Institute of Information and Telecommunication Facilities Engineering
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• v.10 no.4
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• pp.115-120
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• 2011

Recently flash memory is widely used in various mobile devices as storage medium. Nonvolatile memory can be divided into two categories: NAND- and NOR-type flash memory. NOR flash memory is mainly used to store instruction codes for operation; while NAND for data storage. However, NAND does show more economical benefits, that is, it is approximately 30~40% cheaper than NOR flash. Therefore it can be useful to improve NAND flash performance by replacing NOR flash with NAND flash combining with various buffer systems.

• Journal of IKEEE
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• v.25 no.4
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• pp.778-781
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• 2021

In this paper, we propose the 16-layer 3D NAND Flash memory compact modeling using SPICE. In the same structure and simulation conditions, the channel potential about Down Coupling Phenomenon(DCP) and Natural Local Self Boosting (NLSB) were simulated and analyzed with Technology Computer Aided Design(TCAD) tool Atlas(Silvaco^TM) and SPICE, respectively. As a result, it was confirmed that the channel potential of TCAD and SPICE for the two phenomena were almost same. The SPICE can be checked the device structure intuitively by using netlist. Also, its simulation time is shorter than TCAD. Therefore, using SPICE can be expected to efficient research on 3D NAND Flash memory.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.4
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• pp.26-33
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• 2012

As the flash memory has increased the market share of data storage in imbedded system and occupied the most of area in a system, It has a profound impact on system reliability. Flash memory is divided NOR/NAND-type according to the cell array structure, and is classified as SLC(Single Level Cell)/MLC(Multi Level Cell) according to reference voltage. Although NAND-type flash memory is slower than NOR-type, but it has large capacity and low cost. Also, By the effect of demanding mobile market, MLC NAND-type is widely adopted for the purpose of the multimedia data storage. Accordingly, Importance of fault detection algorithm is increasing to ensure MLC NAND-type flash memory reliability. There are many researches about the testing algorithm used from traditional RAM to SLC flash memory and it detected a lot of errors. But the case of MLC flash memory, testing for fault detection, there was not much attempt. So, In this paper, Extend SLC NAND-type flash memory fault detection algorithm for testing MLC NAND-type flash memory and try to reduce these differences.

• Journal of KIISE
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• v.44 no.11
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• pp.1130-1137
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• 2017

The multi-leveling technique that stores multiple bits in a single memory cell has significantly improved the density of NAND flash memory along with shrinking processes. However, because of the side effects of the multi-leveling technique, the average write performance of MLC NAND flash memory is degraded more than twice that of SLC NAND flash memory. In this paper, we introduce existing cross-layer optimization techniques proposed to improve the performance of MLC NAND flash-based storages, and propose a new integration technique that overcomes the limitations of existing techniques by exploiting their complementarity. By fully exploiting the performance asymmetry in MLC NAND flash devices at the flash translation layer, the proposed technique can handle many write requests with the performance of SLC NAND flash devices, thus significantly improving the performance of NAND flash-based storages. Experimental results show that the proposed technique improves performance 39% on average over individual techniques.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.2
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• pp.286-291
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• 2015

For highly scalable NAND flash memory applications, a compact ($4F^2/cell$) nonvolatile memory architecture is proposed and investigated via three-dimensional device simulations. The back-channel program/erase is conducted independently from the front-channel read operation as information is stored in the form of charge at the backside of the channel, and hence, read disturbance is avoided. The memory cell structure is essentially equivalent to that of the fully-depleted transistor, which allows a high cell read current and a steep subthreshold slope, to enable lower voltage operation in comparison with conventional NAND flash devices. To minimize memory cell disturbance during programming, a charge depletion method using appropriate biasing of a buried back-gate line that runs parallel to the bit line is introduced. This design is a new candidate for scaling NAND flash memory to sub-20 nm lateral dimensions.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.236.2-236.2
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• 2014

세계 반도체 시장은 컴퓨터 기능이 더해진 모바일 기기의 수요가 증가함에 따라 메모리반도체의 시장규모가 최근 빠른 속도로 증가했다. 특히 모바일 기기에서 저장장치 역할을 하는 비휘발성 반도체인 NAND Flash Memory는 스마트폰 및 태블릿PC 등 휴대용 기기의 수요 증가, SSD (Solid State Drive)를 탑재한 PC의 수요 확대, 서버용 SSD시장의 활성화 등으로 연평균 18.9%의 성장을 보이고 있다. 이러한 경제적인 배경 속에서 NAND Flash 미세공정 기술의 마지막 단계로 여겨지는 1Xnm 공정이 개발되었다. 그러나 1Xnm Flash Memory의 생산은 새로운 제조설비 구축과 차세대 공정 기술의 적용으로 제조비용이 상승하는 단점이 있다. 이에 따라 제조공정기술을 미세화하지 않고 기존의 수평적 셀구조에서 수직적 셀구조로 설계 구조를 다양화하는 기술이 대두되고 있는데 이 중 Flash Memory의 대용량화와 수명 향상을 동시에 추구할 수 있는 3D NAND 기술이 주목을 받게 되면서 공정기술의 변화도 함께 대두되고 있다. 3D NAND 기술은 기존라인에서 전환하는데 드는 비용이 크지 않으며, 노광장비의 중요도가 축소되는 반면, 증착(Chemical Vapor Deposition) 및 식각공정(Etching)의 기술적 난이도와 스텝수가 증가한다. 이 중 V-NAND 3D 기술에서 사용하는 박막증착 공정의 경우 산화막과 질화막을 번갈아 증착하여 30layer 이상을 하나의 챔버 내에서 연속으로 증착한다. 다층막 증착 공정이 비정상적으로 진행되었을 경우, V-NAND Flash Memory를 제조하기 위한 후속공정에 영향을 미쳐 웨이퍼를 폐기해야 하는 손실을 초래할 수 있다. 본 연구에서는 V-NAND 다층막 증착공정 중에 다층막의 두께를 가상 계측하는 알고리즘을 개발하고자 하였다. 증착공정이 진행될수록 박막의 두께는 증가하여 커패시터 관점에서 변화가 생겨 RF 신호의 진폭과 위상의 변화가 생긴다는 점을 착안하여 증착 공정 중 PECVD 장비 RF matcher와 heater에서 RF 신호의 진폭과 위상을 실시간으로 측정하여 데이터를 수집하고, 박막의 두께와의 상관성을 분석하였다. 이 연구 결과를 토대로 V-NAND Flash memory 제조 품질향상 및 웨이퍼 손실 최소화를 실현하여 제조 시스템을 효율적으로 운영할 수 있는 효과를 기대할 수 있다.

• Journal of the Korea Society of Computer and Information
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• v.24 no.8
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• pp.9-17
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• 2019

In this paper, we propose a block mapping technique applicable to NAND flash memory. In order to use the NAND flash memory with the operating system and the file system developed on the basis of the hard disk which is mainly used in the general PC field, it is necessary to use the system software known as the FTL (Flash Translation Layer). FTL overcomes the disadvantage of not being able to overwrite data by using the address mapping table and solves the additional features caused by the physical structure of NAND flash memory. In this paper, we propose a new mapping method based on the block mapping method for efficient use of the NAND flash memory. In the case of the proposed technique, the data modification operation is processed by using a blank page in the existing block without using an additional block for the data modification operation, thereby minimizing the block unit deletion operation in the merging operation. Also, the frequency of occurrence of the sequential write request and random write request Accordingly, by optimally adjusting the ratio of pages for recording data in a block and pages for recording data requested for modification, it is possible to optimize sequential writing and random writing by maximizing the utilization of pages in a block.

• Journal of KIISE:Computer Systems and Theory
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• v.37 no.3
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• pp.161-171
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• 2010

As embedded systems adopt monolithic kernels, NAND flash memory is used for swap space of virtual memory systems. While flash memory has the advantages of low-power consumption, shock-resistance and non-volatility, it requires garbage collections due to its erase-before-write characteristic. The efficiency of garbage collection scheme largely affects the performance of flash memory. This paper proposes a novel garbage collection technique which exploits data redundancy between the main memory and flash memory in flash memory-based virtual memory systems. The proposed scheme takes the locality of data into consideration to minimize the garbage collection overhead. Experimental results demonstrate that the proposed garbage collection scheme improves performance by 37% on average compared to previous schemes.