• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1149-1152
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• 2008

Nitride semiconductor based light-emitting diodes attain a new functionality of polychromatic emission by the use of three-dimensionally faceted microstructures, which may lead to an advanced lighting technology in which the light source spectra are synthesized so as to meet requirements of the application.

• YAKHAK HOEJI
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• v.30 no.6
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• pp.306-310
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• 1986

The release of heparin from monolithic devices composed of different ratios of polyethylene oxide(PEO MW 20,000) and polydimethylsiloxane was investigated. Water soluble PEO plended into the polydimethylsiloxane proved a controlled release of heparin. The release rate of heparin could be controlled by varying the content of PEO and loading dose of heparin. The release rate of heparin from the devices increased as the content of PEO and heparin in the devices increased. The release rate of heparin from devices were related to nature of solute(ionic strength) and temperature. The release mechanism may be associated with the creation of pore or domine through the devices the water-uptake and the change in the physical structure of the polydimethysiloxane network.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.6
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• pp.14-20
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• 2009

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.259-263
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• 2002

We design and characterize a millimeter-wave ceramic package in a frequency range from DC to 300Hz using the FEM(Finite Element Method) calculation. From these calculation results, the designed feed-through structure achieved 0.32 dB, 16.8 dB of the insertion loss and the return loss at 30 GHz respectively. This ceramic package will be useful for MMIC(Monolithic Microwave Integrated Circuit) modules.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.147-151
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• 2002

We fabricated and characterized a millimeter-wave ceramic package in a frequency range from 6 to 40㎓ using the LTCC(Low Temperature Cofired Ceramic) Technology and TRL(Thru-Reflect-Line) calibration method. From these measurement results, the fabricated feed-through structure achieved 0.5 dB, 14 dB of the insertion loss and the return loss at 30 GHz respectively. This ceramic package will be useful for MMIC(Monolithic Microwave Integrated Circuit) modules.

• Journal of the Korean Ceramic Society
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• v.49 no.4
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• pp.369-374
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• 2012

Based on the structure feature of a tree, a cylindrical $Ti_2AlC$/graphite layered composite has been fabricated through heat treating a graphite column and six close-matched thin wall $Ti_2AlC$ cylinders bonded with the $Ti_2AlC$ powders at $1300^{\circ}C$ and low oxygen partial pressure. SEM examination reveals that the bond interlayers between cylinders or that between cylinder and column are not fully dense without any crack formation. During the compressive test, the strain of the $Ti_2AlC$/graphite layered composite is about twice higher than that of the monolithic $Ti_2AlC$ ceramic, and the compressive strength of the layered composite is 348 MPa. The layered composite show the noncatastrophic fracture behaviors due to the debonding and shelling off of the layers, which are different from the monolithic $Ti_2AlC$ ceramic. The mechanism of the improved deformation capacity and noncatastrophic failure modes are attributed to the presence of the central soft graphite column and cracks deflection by the bond interlayers.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.33-38
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• 2002

High performance packages must have a minimum insertion loss and return loss. In this paper, we design a millimeter-wave ceramic package using LTCC (Low Temperature Cofired Ceramic) technology to satisfy excellent transmission characteristics and characterize in a frequency range from DC to 30 GHz using the FEM (Finite Element Method) calculation. From these calculation results, the designed feed-through structure achieved 0.32 dB, 16.8 dB of the insertion loss and the return loss at 30 GHz respectively. This designed ceramic package will be useful for MMIC (Monolithic Microwave Integrated Circuit) modules.

• Journal of the Korean Ceramic Society
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• v.44 no.3 s.298
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• pp.162-168
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• 2007

Silica wet gels were prepared ken water glass ($29\;wt%\;SiO_{2}$) by using Amberlite as a ion exchange resin. After washing in distilled water, the wet gels were further aged in a solution of TEOS/EtOH to strengthen of 3-dimensional network structure. As increase TEOS content in aging solution, BET surface area and porosity of the ambient dried silica aerogels were significantly decreased, and average pore diameter was also decreased 30 nm to -10 nm. Also, higher density and compressive strength were obtained in case of higher TEOS content. This is due to precipitation of $SiO_{2}$ nano particles by TEOS. Hence, TEOS addition plays an important role of both strengthening and stiffness of silica wet gel network. By adding over 30 vol% TEOS, a crack-free monolithic silica aerogel tiles were obtained and its density, compressive strength, and thermal conductivity were shown $0.232g/cm^{3}$, 7.3 MPa, and 0.029 W/mk, respectivly.

• ETRI Journal
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• v.36 no.1
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• pp.106-115
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• 2014

In this work, the coplanar waveguide is fabricated on a PES (poly[ether sulfone]) substrate for application to a flexible monolithic microwave integrated circuit, and its RF characteristics were thoroughly investigated. The quality factor of the coplanar waveguide on PES is 40.3 at a resonance frequency of 46.7 GHz. A fishbone-type transmission line (FTTL) structure is also fabricated on the PES substrate, and its RF characteristics are investigated. The wavelength of the FTTL on PES is 5.11 mm at 20 GHz, which is 55% of the conventional coplanar waveguide on PES. Using the FTTL, an impedance transformer is fabricated on PES. The size of the impedance transformer is $0.318mm{\times}0.318mm$, which is 69.2% of the size of the transformer fabricated by the conventional coplanar waveguide on PES. The impedance transformer showed return loss values better than -12.9 dB from 5 GHz to 50 GHz and an insertion loss better than -1.13 dB in the same frequency range.

• Journal of IKEEE
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• v.1 no.1 s.1
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• pp.1-10
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• 1997

It is well-known that rectangular bulk-Si sensors prepared by etch or epi etch-stop micromachining technology are already in practical use today, but the conventional bulk-Si sensor shows some drawbacks such as large chip size and limited applications as silicon sensor device is to be miniaturized. We consider a circular-shape SOI(Silicon-On-Insulator) micro-cavity technology to facilitate multiple sensors on very small chip, to make device easier to package than conventional sensor like pressure sensor and to provide very high over-pressure capability. This paper demonstrates the cross-functional results for stress analyses(targeting $5{\mu}m$ deflection and 100MPa stress as maximum at various applicable pressure ranges), for finding permissible diaphragm dimension by output sensitivity, and piezoresistive sensor theory from two-type SOI structures where the double SOI structure shows the most feasible deflection and small stress at various ambient pressures. Those results can be compared with the ones of circular-shape bulk-Si based sensor$^{[17]}. The SOI micro-cavity formed the sensors is promising to integrate with calibration, gain stage and controller unit plus high current/high voltage CMOS drivers onto monolithic chip.