Journal of IKEEE (전기전자학회논문지)

Institute of Korean Electrical and Electronics Engineers (한국전기전자학회)
권호 표지

A Monolithic Integration with A High Density Circular-Shape SOI Microsensor and CMOS Microcontroller IC

CMOS Microcontroller IC와 고밀도 원형모양SOI 마이크로센서의 단일집적

  • 이명옥 (동신대학교 정보통신공학과) ;
  • 문양호 (삼성전기주식회사)
  • Published : 1997.12.01
Download PDF
⟨ Previous Next ⟩

Abstract

It is well-known that rectangular bulk-Si sensors prepared by etch or epi etch-stop micromachining technology are already in practical use today, but the conventional bulk-Si sensor shows some drawbacks such as large chip size and limited applications as silicon sensor device is to be miniaturized. We consider a circular-shape SOI(Silicon-On-Insulator) micro-cavity technology to facilitate multiple sensors on very small chip, to make device easier to package than conventional sensor like pressure sensor and to provide very high over-pressure capability. This paper demonstrates the cross-functional results for stress analyses(targeting $5{\mu}m$ deflection and 100MPa stress as maximum at various applicable pressure ranges), for finding permissible diaphragm dimension by output sensitivity, and piezoresistive sensor theory from two-type SOI structures where the double SOI structure shows the most feasible deflection and small stress at various ambient pressures. Those results can be compared with the ones of circular-shape bulk-Si based sensor$^{[17]}. The SOI micro-cavity formed the sensors is promising to integrate with calibration, gain stage and controller unit plus high current/high voltage CMOS drivers onto monolithic chip.

Keywords

References

  1. IEEE IEDM'96 Microelectromechanical Systems: Interfacing Electronics to a Non-Electronic World Wise, K.
  2. IEEE IEDM'96 Fabrication of Surface Micromachined Polysilicon Actuators Using Dry Release Process of HF Gas-Phase Etching Lee, H.H.(et al.)
  3. Proc. of 3rd Int. Forum on ASIC and Xducer Tech. Frank, R.;Staller, Joe
  4. IEEE IEDM'96 ${\alpha}$ (6H) -Si Pressuree Sensor at $350^{\circ}C$ Okojie, R.;Ned, A.;Kurtz, A.
  5. Proc. IEEE MEMS Workshop Paoletti, F.;Gretillat, M.A.;de Rooji, N.F.
  6. IEEE IEDM'96 Shinogi, M.(et al.)
  7. IEEE IEDM'96 IC MEMs Microtransducers Baltes, H.(et al.)
  8. IEEE IEDM'96 Lee, C.(et al.)
  9. IEEE Trans. Electron Devices v.40 A High-speed $0.6-{\mu}m$ 16K CMOS gate array on a thin SIMOX film Yamaguchi, Y.(et al.)
  10. IEEE IEDM'96 SOl: Materials and Systems Auberton-Herve, A.
  11. IEEE ISSCC 0.5V SOl CMOS pass-gate logic Fuse, T.(et al.)
  12. The 4fth Korean Conf. on Semiconductor Mastery over Low Power Silcon ICs : Process technologies to System architectures Lee, M.
  13. Handbook of glass properties Bansal, N.P.;Doremus, R.H.
  14. Handbook of MODERN SENSORS Fraden, J.
  15. Journal ol Applied Physics v.36 no.1 Young's Modulus. Shear Modulus. and Poisson's Ratio in Silicon and Germanium Wortman, J.J.;Evans, R.A.
  16. I-DEAS $FEM^{TM}$ User's Guide. MODEL SOLUTION$^{TM}$ Verification Reference Guide
  17. 1997 대한전기학회 MEMS 연구회 학술발표회 논문집 A High Density IC Compatible Multi-purposae Circular-Shape Sensor on Micro-Cavity SOI Technology Lee, M.;Moon, Y.H.