• Title/Summary/Keyword: Micro Assembly

검색결과 189건 처리시간 0.022초

PEMFC 시스템의 성능향상을 위한 단위전지 설계에 관한 연구 (A Study on Unit Cell Design for the Performance Enhancement in PEMFC System)

  • 김홍건;김유신;양성모;나석찬
    • 한국공작기계학회논문집
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    • 제14권4호
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    • pp.104-109
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    • 2005
  • The catalyst layer design is one of the most important factors to enhance the performance of PEMFC(Proton Exchange Membrane Fuel Cell) system. The hydrophobic and ion conductive type is studied for the MEA(Membrane Electrolyte Assembly). It is found that those have some limitations for performance enhancement when they are used separately. Thus, the dual catalyst type, a mixed model, is developed for the better MEA performance. In the meantime, the design of flow field plate is subsequently carried out in order to give more enhanced output during its operation. The conductivity of flow field plate showed better performance in the case of manufactured by the more compressed process(20MPa) than by the less compressed process(10MPa). The micro-structure of the flow field plate is examined in details using SEM(Scanning Electron Microscope) to analyse the effects on the different compression processes.

X선 영상의 에지 추출을 통한 플립칩 솔더범프의 접합 형상 오차 검출 (Detection of Flip-chip Bonding Error Through Edge Size Extraction of X-ray Image)

  • 송춘삼;조성만;김준현;김주현;김민영;김종형
    • 제어로봇시스템학회논문지
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    • 제15권9호
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    • pp.916-921
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    • 2009
  • The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.

인공위성의 미소 진동 영향성에 관한 해석 및 실험적 연구 (Analytical & Experimental Study on Microvibration Effects of Satellite)

  • 박지용;이대은;윤재산;한재흥
    • 한국소음진동공학회논문집
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    • 제24권1호
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    • pp.5-13
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    • 2014
  • Number of components and payload systems installed in satellites were found to be exposed to various disturbance sources such as the reaction wheel assembly, the control moment gyro, coolers, and others. A micro-level of vibration can introduce jitter problems into an optical payload system and cause significant degradation of the image quality. Moreover, the prediction of on-orbit vibration effects on the performance of optical payloads during the development process is always important. However, analyzing interactions between subsystems and predicting the vibration level of the payloads is extremely difficult. Therefore, this paper describes the analytical and experimental approach to microvibration effects on satellite optical payload performance with integrated jitter analysis frame-work, microvibration emulator and satellite structure testbed.

An Experimental Study of the Performance Characteristics with Four Different Rotor Blade Shapes on a Small Mixed-Type Turbine

  • Cho Soo-Yong;Cho Tae-Hwan;Choi Sang-Kyu
    • Journal of Mechanical Science and Technology
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    • 제19권7호
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    • pp.1478-1487
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    • 2005
  • A small mixed-type turbine with a diameter of 19.9 mm has been substituted for a rotational part of pencil-type air tool. Usually, a vane-type rotor is applied to the rotational part of the air tool. However, the vane-type rotor has some problems, such as friction, abrasion, and necessity of accurate assembly etc.,. These problems make the life time of the vane-type air tool short, but air tools operated by mixed-type turbines are free of friction and abrasion because the turbine rotor dose not contact with the casing. Moreover, it is assembled easily because of no axis offset. These characteristics are merits for using air tools, but loss of power is inevitable on a non-contacting type rotor due to flow loss, tip clearance loss, and profile loss etc.,. In this study, four different rotors are tested, and their characteristics are investigated by measuring the specific output power. Additionally, optimum nozzle location against the rotor is studied. Output powers are obtained through measured pressure, temperature, torque, rotational speed, and flow rate. The experimental results obtained with four different rotors show that the rotor blade shape greatly influences to the performance, and the optimum nozzle location exists near the mid span of the rotor.

Ordered Micropatterns by Confined Dewetting of an Imprinted Polymer Thin Film and Their Microlens Application

  • Lee, Geun-Tak;Yoon, Bo-Kyung;Acharya, Himadri;Park, Cheol-Min;Huh, June
    • Macromolecular Research
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    • 제17권3호
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    • pp.181-186
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    • 2009
  • We fabricated ordered micro/nano patterns induced by controlled dewetting on the topographically patterned PS/P4VP bilayer thin film. The method is based on utilizing microimprinting lithography to induce a topographically heterogeneous bilayer film that allows the controlled dewetting upon subsequent thermal annealing. The dewetting that was initiated strictly at the boundary of the thicker and thinner regions was guided by the presence of the topographic structure. The dewetting front velocity of the microdomains in the confined regions was linearly proportional to the measurement time, which enabled us to control the size of the dewet domain with annealing time. In particular, the submicron sized dot arrays between lines were generated with ease when the dewetting was confined into geometry with a few microns in size. The kinetically driven, non-lithographical pattern structures accompanied the pattern reduction to 400%. The pattern arrays on a transparent glass substrate were especially useful for non-circular microlens arrays where the focal length of the lens was easily tunable by controlling the thermal annealing.

The effect of particle size on the edge notched disk (END) using particle flow code in three dimension

  • Haeri, Hadi;Sarfarazi, Vahab;Zhu, Zheming;Marji, Mohammad Fatehi
    • Smart Structures and Systems
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    • 제22권6호
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    • pp.663-673
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    • 2018
  • In this study, the effect of particle size on the cracks propagation and coalescence or cracking pattern of the edge notched disc specimens are investigated. Firstly, calibration of PFC3D was performed using Brazilian experimental test output. Then micro parameters were used to build edge notched disc specimen. The horizontal wall of the assembly is let to move downward with a standard low speed of 0.016 m/s. The numerical results show that the tensile cracks are dominant failure pattern for the modeled discs. These tensile cracks initiate from the pre-existing notch tip and propagate parallel to the loading direction then interact with the upper boundary of the modeled specimen. As the size of the balls (ball diameter) decrease the number of tensile cracks increase. The tensile fracture toughness of the samples also decreases as the particle size increases. Understanding the crack propagation and crack coalescence phenomena in brittle materials such as concretes and rocks is of paramount importance in the stability analyses for engineering structures such as rock slopes, underground structures and tunneling.

패턴전사프린팅용 고분자 복제 소재 연구 (A Study on Polymer Replica Materials for Nanotransfer Printing)

  • 강영림;박운익
    • 한국전기전자재료학회논문지
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    • 제34권4호
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    • pp.262-268
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    • 2021
  • For the past several decades, various next-generation patterning methods have been developed to obtain well-designed nano-to-micro structures, such as imprint lithography, nanotransfer printing (nTP), directed self-assembly (DSA), E-beam lithography, and so on. Especially, nTP process has much attention due to its low processing cost, short processing time, and good compatibility with other patterning techniques in achieving the formation of high-resolution functional patterns. To transfer functional patterns onto desirable substrates, the use of soft materials is required for precise replication of master mold. Here, we introduce a simple and practical nTP method to create highly ordered structures using various polymeric replica materials. We found that polymethyl methacrylate (PMMA), polystyrene (PS), and polyvinylpyridine (PVP) are possible candidates for replica materials for reliable duplication of Si master mold based on systematic analysis of pattern visualization. Furthermore, we successfully obtained well-defined metal and oxide nanostructures with functionality on target substrates by using replica patterns, through deposition and transfer process. We expect that the several candidates of replica materials can be exploited for effective nanofabrication of complex electronic devices.

Spherical Silicon/CNT/Carbon Composite Wrapped with Graphene as an Anode Material for Lithium-Ion Batteries

  • Shin, Min-Seon;Choi, Cheon-Kyu;Park, Min-Sik;Lee, Sung-Man
    • Journal of Electrochemical Science and Technology
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    • 제13권1호
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    • pp.159-166
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    • 2022
  • The assembly of the micron-sized Si/CNT/carbon composite wrapped with graphene (SCG composite) is designed and synthesized via a spray drying process. The spherical SCG composite exhibits a high discharge capacity of 1789 mAh g-1 with an initial coulombic efficiency of 84 %. Moreover, the porous architecture of SCG composite is beneficial for enhancing cycling stability and rate capability. In practice, a blended electrode consisting of spherical SCG composite and natural graphite with a reversible capacity of ~500 mAh g-1, shows a stable cycle performance with high cycling efficiencies (> 99.5%) during 100 cycles. These superior electrochemical performance are mainly attributed to the robust design and structural stability of the SCG composite during charge and discharge process. It appears that despite the fracture of micro-sized Si particles during repeated cycling, the electrical contact of Si particles can be maintained within the SCG composite by suppressing the direct contact of Si particles with electrolytes.

Surface Mounting Device의 동역학적 모델링 및 상태 민감도 해석 (A Dynamic Modeling & State Sensitivity Analysis of the Surface Mounting Device)

  • 장진희;한창수;김정덕
    • 한국정밀공학회지
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    • 제13권7호
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    • pp.90-99
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    • 1996
  • In the area of assembly process of micro-chips and electronic parts on the printed circuit board, surface mounting device(SMD) is used as a fundamental tool. Generally speaking, the motion of the SMD is based on the ball screw system operated by any type of actuators. The ball screw system is a mechanical transformed which converts the mechanical rotational motion to the translational one. Also, this system could be considered as an efficient motion device against mechanical backlash and friction. Therefore a dynamic modeling and state sensitivity analysis of the ball screw system in SMD have to be done in the initial design stage. In this paper, a simple mathematical dynamic model for this system and the sensit- ivity analysis are mentioned. Especially, the bond graph approach is used for graphical modeling of the dynamic system before analysis stage. And the direct differentiation method is used for the state sensit- ivity analysis of the system. Finally, some trends for the state variables with respect to the design variables could be suggested for the better design and faster operating based on the results of dynamic and state sensitivity.

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이종 집적 유연 반도체 시스템 구현을 위한 무기물 박막소재의 전사 방법 (Transfer Methods of Inorganic Thin Film Materials for Heterogeneously- Integration Flexible Semiconductor System)

  • 주경현;김정현;박상윤;김강현;이한얼
    • 한국전기전자재료학회논문지
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    • 제37권3호
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    • pp.241-252
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    • 2024
  • With the recent development of emerging technologies, information acquisition and delivery between users has been actively conducted, and inorganic thin film transfer technology that effectively transfers various materials and devices is being studied to develop flexible electronic devices accordingly. This is aimed at innovative structural changes and functional improvement of electronic devices in the era of the Internet of Things (IoT). In particular, advanced technologies such as microLEDs are used to realize high-resolution flexible displays, and the possibility of heterogeneous integrated technologies can be presented by precisely transferring materials to substrates through various transfer process. This paper introduced physical, chemical, and self-assembly transfer methods based on inorganic thin film materials to implement heterogeneous integrated flexible semiconductor systems and introduces the results of application studies of semiconductor devices obtained through different transfer technologies. These studies are expected to bring about innovative changes in the field of smart devices, medical technology, and user interfaces in the future.