Detection of Flip-chip Bonding Error Through Edge Size Extraction of X-ray Image |
Song, Chun-Sam
(서울테크노파크 MSP센터)
Cho, Sung-Man (서울산업대학교 나노생산기술연구소) Kim, Joon-Hyun (서울테크노파크 MSP센터) Kim, Joo-Hyun (국민대학교 기계자동차공학부) Kim, Min-young (경북대학교 전자전기컴퓨터학부) Kim, Jong-Hyeong (서울산업대학교 기계설계자동화공학부) |
1 | R. crane, A simplified approach to image processing: classical & modern techniques in C, Prentice Hall, Section 3. pp. 85-134, 1996 |
2 | D. vernon, Machine vision: Automated visual inspection and robot vision, Prentice Hall, Section 5.3 pp. 90-99, 1991 |
3 | S. M. Cho, 'X-ray image processing and pose estimation of polyhedral objects based on geometric features,' MA Science thesis, 2008 |
4 | Y. K. Ryu and H. S. Cho, 'New optical measuring system for solder joint inspection,' Opctics and Lasers in Engineering, vol. 26, no.6, pp. 487-514, 1997 DOI ScienceOn |
5 | J. H. Kim, H. S. Cho, and S. K. Kim, 'Visual measurement of a 3-D plane by a cylindrical structure light,' 93 Intelligent Robots and Systems, Yokohama, Japan, 1993 |
6 | 'Computed tomography details casting detects,' Advancede Materials & Process, pp. 54-66, Nov. 1990 |
7 | K. W. Ko and H. S. Cho, 'Solder joint inspection using a neural network and fuzzy rule-based classification method,' IEEE Trans. On Electronics Packaging Manufacturing, vol. 23, no. 2, pp. 93-103, 2000 DOI ScienceOn |
8 | J. A. Noble, R Gupta, 1. Mundy, A. Schmitz, and R. I. Hartely, 'High precision x-ray stereo for automated 3D CAD based inspection,' IEEE Trans. Robotics and Automation, vol. 14, no. 2, pp. 292-302, Apr. 1998 DOI ScienceOn |
9 | R K. Ulrich and W. D. Brown, Advanced Electronic Packaging, 2nd Ed., Wiley-Interscience, 2006 |