• Journal of Sensor Science and Technology
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• v.25 no.6
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• pp.423-430
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• 2016

This study used a single metal oxide semiconductor (MOS) sensor to classify the major odorous gases hydrogen sulfide ($H_2S$), ammonia ($NH_3$) and toluene ($C_6H_5CH_3$). In order to classify these odorous substances, the voltage on the MOS sensor heater was gradually reduced in 0.5 V steps 5.0 V to examine the changes to the response by the cooling effect on the sensor as the voltage decreased. The hydrogen sulfide gas showed the highest sensitivity compared to odorless air under approximately 2.5 V and the ammonia and toluene gases showed the highest sensitivity under approximately 5.0 V. In other words, the hydrogen sulfide gas reacted better in the low temperature range of the MOS sensor, and the ammonia and toluene gases reacted better in the high-temperature range. In order to analyze the response characteristics of the MOS sensor by temperature in a pattern, a two-dimensional (2D) x-y pattern analysis was introduced to clearly classify the hydrogen sulfide, ammonia, and toluene gases. The hydrogen sulfide gas was identified by a straight line with a slope of 1.73, whereas the ammonia gas had a slope of 0.05 and the toluene gas had a slope of 0.52. Therefore, the 2D x-y pattern analysis is suggested as a new way to classify these odorous substances.

• Proceedings of the KIEE Conference
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• 1989.07a
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• pp.377-379
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• 1989

Very thin gate oxide(100-300A) MOS capacitor has been fabricated. The effect of series resistance must be calculated and the exact metal-semiconductor work function difference should be obtained to get the fixed oxide charge density exisiting in oxide. Dilute oxidation make sagy to control oxide thickness and reduce fixed oxide charge density. In case of dilute oxidation, fixed oxide charge density depends on oxidation time. If oxide is very thin, the annealing effect is ignored.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.4
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• pp.159-163
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• 2003

ln this work, we studied electrical characteristics and leakage current mechanism of $Ta_2O_{5}$ MOS(Metal-Oxide-Semiconductor) devices. $Ta_2O_{5}$ thin film (63 nm) was deposited by ALD(Atomic Layer Deposition) method at temperature of 235 $^{\circ}C$. The structures of the $Ta_2O_{5}$ thin films were examined by XRD(X-Ray Diffraction). From XRD, it is found that the structure of $Ta_2O_{5}$ is single phase and orthorhombic. From capacitance-voltage (C-V) anaysis, the dielectric constant was 19.4. The temperature dependence of current density-electric field (J-E) characteristics of $Ta_2O_{5}$ thin film was studied at temperature range of 300 - 423 K. In ohmic region (<0.5 MV/cm), the resistivity was 2.456${\times}10^{14}$ ($\omega{\cdot}cm$ at 348 K. The Schottky emission is dominant at lower temperature range from 300 to 323 K and Poole-Frenkel emission is dominant at higher temperature range from 348 to 423 K.

• JSTS:Journal of Semiconductor Technology and Science
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• v.10 no.2
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• pp.100-106
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• 2010

The impact of surface quantization on device parameters of a Si metal oxide semiconductor (MOS) capacitor has been analyzed in the present work. Variation of conduction band bending, position of discrete energy states, variation of surface potential, and the variation of inversion carrier concentration at charge centroid have been analyzed for different gate voltages, substrate doping concentrations and oxide thicknesses. Oxide thickness calculated from the experimental C-V data of a MOS capacitor is different from the actual oxide thickness, since such data include the effect of surface quantization. A correction factor has been developed considering the effect of charge centroid in presence of surface quantization at strong inversion and it has been observed that the correction due to surface quantization is crucial for highly doped substrate with thinner gate oxide.

• Journal of IKEEE
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• v.22 no.3
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• pp.706-711
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• 2018

In this work, we have investigated the characteristics of 4H-SiC metal-oxide-semiconductor (MOS) devices with silicon oxynitride (SiON) insulator using plasma enhanced chemical vapor deposition (PECVD). After post metallization annealing, the trap densities of the fabricated devices decreased significantly. In particular, the device annealed at $500^{\circ}C$ in forming gas ambient exhibited excellent MOS characteristics along with negligible hysteresis, which proved the potential of PECVD SiON as an alternative gate insulator for use in 4H-SiC MOS device.

• Proceedings of the Korean Vacuum Society Conference
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• 1994.06a
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• pp.79-79
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• 1994

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1988.10a
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• pp.95-97
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• 1988

The instability of MOS devices is mainly caused by the oxide charges, and as the need to develop the gate metal grows researches for various new metal gate have been performed, and in these researches, the difference work function existing between the metal and the semiconductor should be considered. Here int his paper, the device is made by the sputtering and the LPCVD method using pure Al, compound metal. poly-si, as a gate metal, the result of the research was shown that the work function difference from using different gate metals effects on the flatband voltage shift. This means we can infer that the threshold voltage adjustment is possible by using different gate metals and this whole mechanism makes the devices behavior more stable.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1963-1966
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• 2008

We fabricate and evaluate the metal-oxide-semiconductor (MOS) transistor probe with the focused-ionbeam (FIB) for surface electric properties. The probes are designed with the rectangular and V-shaped structures, and their dimensions are determined considering the contact mode operation. The conductive nano tip is grown with FIB system, and deposition condition is controlled for the sharp tip. The fabricated device is applied to the various test patterns like the metal lines and PZT poling regions, and the results show the well defined measurement patterns.

• Journal of the Semiconductor & Display Technology
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• v.21 no.3
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• pp.22-25
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• 2022

Metal oxide semiconductor (MOS) based on spray-pyrolysis deposition technique has attracted large attention due to simple and low-cost processibility while preserving their intrinsic optical and electrical characteristics. However, their high process temperature limits practical applications. Here, we demonstrated the nc-ZnO/ZnO field-effect transistors (FETs) via spray-pyrolysis as incorporating ZnO nanocrystalline nanoparticles into typical ZnO precursor. The nc-ZnO/ZnO FETs exhibit good quality of electrical properties. Our experiments reveal that nc-ZnO in active layer enhance electrical characteristics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.9-10
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• 2007

In this paper, Thin films of $HfO_2$/Hf were deposited on p-type wafer by Atomic Layer Deposition(ALD). And we studied the electrical characterization of $HfO_2$/Hf/Si MOS capacitor depending on thickness of Hf metal layer. $HfO_2$ films were deposited using TEMAH and $O_3\;at\;350^{\circ}C$. Samples were then annealed using furnace heating to $500^{\circ}C$. The MOS capacitor of round-type was fabricated on Si substrates. Through TEM(Transmission Electron Microscope), XRD(X-ray Diffraction), capacitance-voltage(C-V) and current-voltage(I-V) analysis, the role of thin Hf metal layer for the better $HfO_2$/Si interface property was investigated.