• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.139-139
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• 2003

많은 압전 후막은 여러 감지소자, 통신 및 사무자동화 기기, 전기 및 전자부품, 의료장비 및 국방산업에 까지 널리 응용되어 왔다. 그 중에서도 압전특성이 뛰어난 PZT 후막은 마이크로 펌프, 밸브, 헤드, 모터, 트랜스듀서 뿐 아니라 최근 바이오칩용 센서와 액추에이터로서 널리 연구되고 있다. 또한 마이크로 센서와 액추에이터 의 제작 및 구동을 위한 MEMS 기술의 도입으로 실리콘 베이스의 소자 개발이 집중되고 있다. 스크린 프린팅 방법은수 마이크론에서 수십 마이크론 후막의 실현이 용이하고 비교적 경제적이며 소자신뢰도가 높고 대량생산에 유리하여 활발한 연구가 진행 중이다. 그러나 후막은 벌크에 비해 기공률이 높고, 또 소자응용에 있어서 고온소결 시 MEMS공정을 위한 실리콘 베이스 기판과의 확산 및 반응에 의 한 계면 및 활물질 성능의 저하가 문제가 되고 있다. 따라서 본 연구에서는 스크린 프린팅과 더불어 졸 코팅 방법의 도입으로 후막의 성형 및 소결 밀도를 높임과 동시에 여러 확산 방지 막의 증착으로 capacitor 형 PZT 후막의 물성 및 전기 적 특성을 향상시키고자 하였다.

• Smart Structures and Systems
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• v.1 no.1
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• pp.63-82
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• 2005

This paper introduces a technology for robust and low maintenance cost sensor network capable to detect accelerations below a micro-g in a wide frequency bandwidth (above 1,000 Hz). Sensor networks with such performance are critical for navigation, seismology, acoustic sensing, and for the health monitoring of civil structures. The approach is based on the fabrication of an array of high sensitivity accelerometers, each utilizing Fabry-Perot cavity with wavelength-dependent reflectivity to allow embedded optical detection and serialization. The unique feature of the approach is that no local power source is required for each individual sensor. Instead one global light source is used, providing an input optical signal which propagates through an optical fiber network from sensor-to-sensor. The information from each sensor is embedded onto the transmitted light as an intrinsic wavelength division multiplexed signal. This optical "rainbow" of data is then assessed providing real-time sensing information from each sensor node in the network. This paper introduces the Fabry-Perot based accelerometer and examines its critical features, including the effects of imperfections and resolution estimates. It then presents serialization techniques for the creation of systems of arrayed sensors and examines the effects of serialization on sensor response. Finally, a fabrication process is proposed to create test structures for the critical components of the device, which are dynamically characterized.

• Journal of the Korean Ceramic Society
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• v.39 no.6
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• pp.570-575
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• 2002

The present tendency of electrical and electronics is concentrated on MEMS devices for advantage of miniaturization, intergration, low electric power and low cost. Therefore it is essential that high aspect ratio and high etch rate by HDP technology development, so that silicon deep trench etching reactions was studied by ICP equipment. Deep trench etching of silicon was investigated as function of platen power, etch step time of etch/passivation cycle time and SF$\_$6/:C$_4$F$\_$8/ flow rate. Their effects on etch profile, scallops, etch rate, uniformity and selectivity were also studied.

• Journal of Sensor Science and Technology
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• v.17 no.1
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• pp.75-80
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• 2008

In this work, we optimized a microbolometer for application of a $CO_2$ detector by using MEMS technology. We fabricated a stable thermal isolation structure by varying the lengths of supporting legs which affect bolometer performance. We could fabricate more stable thermal isolation structure for the microbolometer through the results of ANSYS simulations, and minimize the fabrication processes by using bulk micromachining to use a $CO_2$ detector. The microbolometer shows a detectivity of $2.5{\times}109$ cmHz$^{1/2}$/W at a chopper frequency of 8 Hz and a bias current of $6.25\;{\mu}A$ with a vacuum package of about $3.0{\times}10.3$ torr. Therefore, we put to conclusion that the microbolometer optimized in this experiment could be useful for the application of a $CO_2$ detector.

• Transactions on Electrical and Electronic Materials
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• v.13 no.6
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• pp.305-309
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• 2012

In this study, ZnO nanorods and $SnO_2$-CuO heterogeneous oxide were grown on membrane-type gas sensor platforms and the sensing characteristics for carbon monoxide (CO) were studied. Diaphragm-type gas sensor platforms with built-in Pt micro-heaters were made using a conventional bulk micromachining method. ZnO nanorods were grown from ZnO seed layers using the hydrothermal method, and the average diameter and length of the nanorods were adjusted by changing the concentration of the precursor. Thereafter, $SnO_2$-CuO heterogeneous oxide thin films were grown from evaporated Sn and Cu thin films. The average diameters of the ZnO nanorods obtained by changing the concentration of the precursor were between 30 and 200 nm and the ZnO nanorods showed a sensitivity value of 21% at a working temperature of $350^{\circ}C$ and a carbon monoxide concentration of 100 ppm. The $SnO_2$-CuO heterogeneous oxide thin films showed a sensitivity value of 18% at a working temperature of $200^{\circ}C$ and a carbon monoxide concentration of 100 ppm.

• Transactions on Electrical and Electronic Materials
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• v.17 no.4
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• pp.183-188
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• 2016

This paper presents the design and characterization of wide band ohmic microswitch with an actuation voltage as low as 20~25 V, and a restoring force of 14.1 μN. The design of the proposed switch is primarily composed of an electrostatic actuator, bridge membrane, cantilever (beam) and coplanar waveguide, suspended over the substrate. The analysis shows an insertion loss of −0.002 dB at 1GHz and remains as low as −0.35 dB, even at 100 GHz. The isolation loss of the switch is sustained at −21.09 dB at 100GHz, with a peak value of −99.58 dB at 1 GHz and up-state capacitance of 4 fF. To our knowledge, this is the first demonstration of a series contact switch, which works over a wide bandwidth (DC-100 GHz) and with such a high and sustained isolation, even at high frequencies and with an excellent figure of merit (f_c=1/2.pi.Ron.Cu= 39.7 THz).

• Transactions on Electrical and Electronic Materials
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• v.18 no.2
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• pp.78-88
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• 2017

Cantilever beam MEMS piezoelectric accelerometers are the simplest and most widely used accelerometer structure. This paper discusses the design of a piezoelectric accelerometer exclusively for SHM applications. While such accelerometers need to operate at a lower frequency range, they also need to possess high sensitivity and low noise floor. The availability of a simple model for deflection, charge, and voltage sensitivities will make the accelerometer design procedure less cumbersome. However, a review of the open literature suggests that such a model has not yet been proposed. In addition, previous works either depended on FEM analysis or only reported on the fabrication and characterization of piezoelectric accelerometers. Hence, this paper presents, for the first time, a simple analytical model developed for the deflection, induced voltage, and charge sensitivity of a cantilever beam piezoelectric accelerometer.The model is then verified using FEM analysis for a range of different cases. Further, the model was validated by comparing the induced voltages of an accelerometer estimated using this model with experimental voltages measured in the accelerometer after fabrication. Subsequently, the design of an accelerometer is demonstrated for SHM applications using the analytical model developed in this work. The designed accelerometer has 60 mV/g voltage sensitivity and 2.4 pC/g charge sensitivity, which are relatively high values compared to those of the piezoresistive and capacitive accelerometers for SHM applications reported earlier.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.34 no.1
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• pp.73-76
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• 2010

The issue of inspection and characterization of microstructures has emerged as a major consideration in design, fabrication, and detection of MEMS devices. However, the conventional measurement techniques, including scanning electron microscopy (SEM) imaging, atomic force microscopy (AFM) scanning, and mechanical surface profiler, require often destructive process or may be difficult to measure with a wafer scale. In this paper, we characterize the surface profiles of microstructures using an optical scanner based on a DVD pick-up module. Scanning images of the microstructures are successfully generated using the intensity of reflected light from different depths of the surface profiles, based on the focus error signal (FES) from photodiodes. It is shown that the proposed optical scanner can be used as an alternative measurement system with high performance and low cost, compared to conventional measurement techniques.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.04a
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• pp.193-197
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• 2003

As one of the core technologies in the field of the optical communication with WDM, the optical cross connector with movements of micro mirrors is getting important day by day. The packaging structure of 2-dimensional NxN MOEMS switch should be determined by the harmonization of the following items such as the geometrical compatability between optical and structural components, the characteristics of optical input and output parts with device, and the electrical performance for the operation of micro mirrors. Therefore, the packaging process could be defined as the integrated technology completed by the optical and electrical science and the material science for the understanding of its thermo-mechanical properties with packaging materials. In the present study, the harmonization between the optical and structural components as well as the optical characteristics of lens system used will be investigated.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.9-12
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• 2006

We have designed and fabricated micro power generators by electroplating which is important in MEMS(micro electro mechanical system) technique. We have electroplated MEMS coils on the glass substrates and have chosen one of these coils for experiments. The thickness, width, and length of the coil are $7{\mu}m,\;20{\mu}m$, and 1.6 m, respectively. We have analyzed the structure of MEMS coil by SEM. We have made a vibrating system for reproducible results in measurement. With reciprocating a magnet on the surface of a fabricated winding coil, the micro power generator produce an alternating voltage. We have changed the vibrational frequency from 0.5 Hz to 8 Hz. The generated voltage was 106 mV at 3 Hz and 198 mV at 6 Hz. We aim at the micro power generator which can change vibration energy to useful electric energy.