• Proceedings of the KSME Conference
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• 2004.04a
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• pp.258-263
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• 2004

Mechanical property evaluation of micrometer-sized structures is necessary to help design reliable microelectromechanical systems(MEMS) devices. Most material properties are known to exhibit dependence on specimen size and such properties of microscale structures are not well characterized. This paper describes techniques developed for tensile testing of materials used in MEMS. Epi-polycrystalline silicon is currently the most widely used material, and its tensile strength has been measured as 1.52GPa. We have developed an uniaxial testing machine for testing microscale specimen using electro-magnetic actuator. The field magnet and the moving coil taken from an audio-speaker were utilized as the components of the actuator. Structure of specimen was designed and manufactured for easy handling and alignment. In addition to the static tensile tests, new techniques and procedures for measuring strength are described.

• ETRI Journal
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• v.33 no.5
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• pp.802-805
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• 2011

This letter presents a K-band polarization reconfigurable antenna integrated with a silicon radio frequency MEMS switch into the form of a compact package. The proposed antenna can change its state from linear polarization (LP) to circular polarization (CP) by actuating the MEMS switch, which controls the configuration of the coupling ring slot. Low-loss quartz is used for a radiating patch substrate and at the same time for a packaging lid by stacking it onto the MEMS substrate, which can increase the system integrity. The fabricated antenna shows broadband impedance matching and exhibits high axial ratios better than 15 dB in the LP and small axial ratios in the CP, with a minimum value of 0.002 dB at 20.8 GHz in the K-band.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.6
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• pp.271-277
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• 2002

In this paper, a MEMS silicon package is newly designed, fabricated for HMIC, and characterized for microwave and millimeter-wave device applications. The proposed package is fabricated by using two high resistivity silicon substrates and surface/bulk micromachining technology. It has a good performance characteristic such as -20㏈ of $S_11$/ and -0.3㏈ of $S_21$ up to 20㎓, which is useful in microwave region. It has also better heat transfer characteristics than the commonly used ceramic package. Since the proposed silicon MEMS package is easy to fabricate and wafer level chip scale packaging is also possible, the production cost can be much lower than the ceramic package. Since it will be a promising low-cost package for mobile/wireless applications.

• Journal of Sensor Science and Technology
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• v.24 no.5
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• pp.287-290
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• 2015

Liquid crystal polymer (LCP) is a thermoplastic polymer with superior mechanical and thermal properties. In addition, its characteristics include very low water absorption rate and possibility to apply bonding process under low temperature. In this study, LCP is utilized as a packaging material for a microelectronic system (MEMS) based safety device with suggestion of a low temperature packaging process. Highly sensitive and stable capacitive type humidity sensor is fabricated to investigate hermeticity of the packaged MEMS device.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.8
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• pp.1461-1465
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• 2007

A micromachined sensor part for an infrared focal plane array has been designed and fabricated. Amorphous silicon was adapted as a sensing material, and silicon nitride was used as a membrane material. To get a good efficiency of infrared absorption, the sensor was made as a ${\lambda}/4$ cavity structure. All the processes were done in $0.5\;{\mu}m$ iMEMS fab. in the Electronics and Telecommunication Research Institute (ETRI). The processed MEMS sensor structure had a small membrane deflection less than $0.3\;{\mu}m$. This excellent deflection property can be attributed to the rigorous balancing of the stresses of individual layers. The efficiency of infrared absorption was more than 75% in the wavelength range $8\;-\;14\;{\mu}m$.

• Proceedings of the Optical Society of Korea Conference
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• 2009.02a
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• pp.387-388
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• 2009

Biophotonics is an emerging area in a fusion of biology and photonics, especially in advanced bioimaging, optical biosensors, photomodulation, and biochip optical read-out, and optical manipulation. This emerging area also creates many opportunities for interdisciplinary study of biology and photonics. Micro-Electro-Mechanical-System(MEMS) is an attractive technology in miniaturizing sensors and actuactors. For last decade, it has contributed to the development for active and passive small and integrated optical components in optical communication. Recently, this technology is also merging into biology for high sensitive biosensing and high resolution and fast bioimaging in small form factor. In this talk, some key advantages of small optical components and recent biophotonic MEMS achievement will be discussed for miniaturized advanced biophotonic systems.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.3
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• pp.176-181
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• 2012

Due to the high etch rate and low fabrication cost, the wet etching of silicon using KOH etchant is widely used in MEMS fabrication area. However, anisotropic etch characteristic obstruct intuitional mask design and compensation structures are required for mask design level. Therefore, the accurate modeling for various types of silicon surface is essential for fabrication of three-dimensional MEMS structure. In this paper, we modeled KOH etch profile for MEMS based energy harvester using fuzzy logic. Modeling results are compared with experimental results and it is applied to design of compensation structure for MEMS based energy harvester. Through Fuzzy inference approaches, developed model showed good agreement with the experimental results with limited etch rate information.

• International Journal of Aeronautical and Space Sciences
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• v.17 no.4
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• pp.526-534
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• 2016

A MEMS solid propellant thruster array shall be operated within an allowable range of operating temperatures to avoid ignition failure by incomplete combustion due to a time delay in ignition. The structural safety of the MEMS thruster array under severe on-orbit thermal conditions can also be guaranteed by a suitable thermal control. In this study, we propose a thermal control strategy to perform on-orbit verification of a MEMS thruster module, which is expected to be the primary payload of the STEP Cube Lab mission. The strategy involves, the use of micro-igniters as heaters and temperature sensors for active thermal control because an additional heater cannot be implemented in the current design. In addition, we made efforts to reduce the launch loads transmitted to the MEMS thruster module at the system level structural design. The effectiveness of the proposed thermo-mechanical design strategy has been demonstrated by numerical analysis.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.16 no.12 s.117
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• pp.1272-1278
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• 2006

This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin(Au/Sn) eutectic solder bonding. The membrane chip has $2.5mm{\times}2.5mm$, 0.5${\mu}m$ thick low stress silicon nitride membrane, $2mm{\times}2mm$ Au/Ni/Cr membrane electrode, and 3${\mu}m$ thick Au/Sn layer. The backplate chip has $2mm{\times}2mm$, 150${\mu}m$ thick single crystal silicon rigid backplate, $1.8mm{\times}1.8mm$ backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50{\sim}60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is 39.8 ${\mu}V/Pa$(-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

• Journal of Sensor Science and Technology
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• v.17 no.3
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• pp.183-187
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• 2008

A sub-ppm level MEMS gas sensor that can be used for the detection of formaldehyde (HCHO) is presented. It is realized by using a zinc oxide (ZnO) thin-film material with a Ni-seed layer as a sensing material and by bulk micromachining technology. To enhance sensitivity of the MEMS gas sensor with Ni-seed layer was embedded with ZnO sensing material and sensing electrodes. As experimental results, the changed sensor resistance ratio for HCHO gas was 9.65 % for 10 ppb, 18.06 % for 100 ppb, and 35.7 % for 1 ppm, respectively. In addition, the minimum detection level of the fabricated MEMS gas sensor was 10 ppb for the HCHO gas. And the measured output voltage was about 0.94 V for 10 ppb HCHO gas concentration. The noise level of the fabricated MEMS gas sensor was about 50 mV. The response and recovery times were 3 and 5 min, respectively. The consumption power of the Pt micro-heater under sensor testing was 184 mW and its operating temperature was $400^{\circ}C$.