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THe Novel Silicon MEMS Package for MMICS  

Gwon, Yeong-Su (아주대 공대 전자공학부 대학원)
Lee, Hae-Yeong (아주대 공대 전자공학부 정)
Park, Jae-Yeong (LG전자기술원 소자재료연구소)
Kim, Seong-A (LG전자기술원 소자재료연구소)
Publication Information
The Transactions of the Korean Institute of Electrical Engineers C / v.51, no.6, 2002 , pp. 271-277 More about this Journal
Abstract
In this paper, a MEMS silicon package is newly designed, fabricated for HMIC, and characterized for microwave and millimeter-wave device applications. The proposed package is fabricated by using two high resistivity silicon substrates and surface/bulk micromachining technology. It has a good performance characteristic such as -20㏈ of $S_11$/ and -0.3㏈ of $S_21$ up to 20㎓, which is useful in microwave region. It has also better heat transfer characteristics than the commonly used ceramic package. Since the proposed silicon MEMS package is easy to fabricate and wafer level chip scale packaging is also possible, the production cost can be much lower than the ceramic package. Since it will be a promising low-cost package for mobile/wireless applications.
Keywords
MEMS; high resistivity silicon (HRS); silicon package; wafer level packaging; MMIC;
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