Browse > Article
http://dx.doi.org/10.5050/KSNVN.2006.16.12.1272

Design and Fabrication of MEMS Condenser Microphone Using Wafer Bonding Technology  

Kwon, Hyu-Sang (한국표준과학연구원 기반표준부 역학그룹)
Lee, Kwang-Cheol (한국표준과학연구원 전력기술연구부 미래신수요측정클럽)
Publication Information
Transactions of the Korean Society for Noise and Vibration Engineering / v.16, no.12, 2006 , pp. 1272-1278 More about this Journal
Abstract
This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin(Au/Sn) eutectic solder bonding. The membrane chip has $2.5mm{\times}2.5mm$, 0.5${\mu}m$ thick low stress silicon nitride membrane, $2mm{\times}2mm$ Au/Ni/Cr membrane electrode, and 3${\mu}m$ thick Au/Sn layer. The backplate chip has $2mm{\times}2mm$, 150${\mu}m$ thick single crystal silicon rigid backplate, $1.8mm{\times}1.8mm$ backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50{\sim}60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is 39.8 ${\mu}V/Pa$(-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.
Keywords
Au/Sn Eutectic Bonding; Si Deep Reactive Ion Etching; MEMS Condenser Microphone; Microphone Packaging; Rigid Backplate; Double-chip Technology; Wafer Bonding;
Citations & Related Records
연도 인용수 순위
  • Reference
1 See, for example, http://www.knowlesacoustics.com/ or http://www.sonion.com/
2 Hsieh, W. H., Yao, T.-J. and Tai, Y.-C., 1999, 'A High Performance MEMS Thin-film Teflon Electret Microphone', Transducers' 99, pp. 1064-1067
3 Martin, D. T, Kadirvel, K, Liu, J., Fox, R. M., Sheplak, M. and Nishida, T., 2005, 'Surface and Bulk Micromachined Dual Back-plate Condenser Microphone', MEMS' 05, pp. 319-322
4 Weigold, J. W., Brosnihan, T. J., Bergeron, J. and Zhang, X., 2006, 'A MEMS Condenser Microphone for Consumer Applications' , MEMS' 06, pp.86-89
5 Scheeper, P. R., Nordstrand, B., Gullov, J. O., Liu, B., Clausen, T., Midjord, L. and Storgaard-Larsen, T., 2003, 'A New Measurement Microphone Based on MEMS Technology', J. Microelectromech. Syst., Vol. 12, No.6, pp. 880-891   DOI   ScienceOn
6 Microphone Handbook, 1996, Bruel & Kjaer A/S, Naerum, Denmark
7 Ono, N., Arita, T., Senjo, Y. and Ando, S., 2005, 'Directivity Steering Principle for Biomimicry Silicon Microphone', Transducers' 05, pp, 792-795
8 Neumann Jr. J. J. and Gabriel, K. J., 2003, 'A Fully-integrated CMOS-MEMS Audio Microphone' , Transducers' 03, pp.230-233
9 Iguchi, Y., Tajima, T., Goto, M., Iwaki, M., Ando, A., Tanioka, K., Takeshi, F., Matsunaga, S. and Yasuno, Y., 2004, 'New Fabrication Process for High-performance Silicon Condenser Microphone with Monocrystalline Silicon Diaphragm and Backplate' , MEMS' 04, pp.601-604
10 Wong, G. S. K. and Embleton, T. F. W., 1995, Handbook of Condenser Microphones, AlP Press, New York, Chap.3, pp.37-69
11 Maier-Schneider, D., Maibach, J. and Obermeier, E., 1995, 'A New Analytical Solution for the Load-deflection of Square Membranes'. J. Microelectromech. Syst., Vol. 4, No.4, pp. 238-241   DOI   ScienceOn
12 Kinsler, L. E., Frey, A. R., Coppens, A. B., and Sanders, J. V., 2000, 'Fundamentals of Acoustics' , John Wiley & Sons, Inc., Chap.4, pp. 91-109
13 Lee, K. I., Cho, J. W., Lee, D. S., Hwang, H.-I., Kim, J. W. and Lee, S. S., 2005, 'A Capacitive Type Miniature Acoustic Transducer with a Diapragm by Electroplating' , The 7th Korean MEMS Conference, pp. 93-96
14 Schafer, D., Shoaf, S. and Loeppert, P., 1998, 'Micromachined Condenser Microhpone for Hearing Aid Use', Solid-state Sensor and Actuator Workshop (Hilton Head' 98), pp.27-30
15 Ko, S. C., Jun, C.-H., Jang, W. I., Moon, S.-H., Hwang, G. and Choi, C. A., 2005, 'Fabrication and Acoustic Characteristics of Capacitive-MEMS Acoustic Sensor', The 7th Korean MEMS Conference, pp.81-84