• Title/Summary/Keyword: LTPS TFT

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Electrical characteristics of poly-Si NVM by using the MIC as the active layer

  • Cho, Jae-Hyun;Nguyen, Thanh Nga;Jung, Sung-Wook;Yi, Jun-Sin
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.151-151
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    • 2010
  • In this paper, the electrically properties of nonvolatile memory (NVM) using multi-stacks gate insulators of oxide-nitride-oxynitride (ONOn) and active layer of the low temperature polycrystalline silicon (LTPS) were investigated. From hydrogenated amorphous silicon (a-Si:H), the LTPS thin films with high crystalline fraction of 96% and low surface's roughness of 1.28 nm were fabricated by the metal induced crystallization (MIC) with annealing conditions of $650^{\circ}C$ for 5 hours on glass substrates. The LTPS thin film transistor (TFT) or the NVM obtains a field effect mobility of ($\mu_{FE}$) $10\;cm^2/V{\cdot}s$, threshold voltage ($V_{TH}$) of -3.5V. The results demonstrated that the NVM has a memory window of 1.6 V with a programming and erasing (P/E) voltage of -14 V and 14 V in 1 ms. Moreover, retention properties of the memory was determined exceed 80% after 10 years. Therefore, the LTPS fabricated by the MIC became a potential material for NVM application which employed for the system integration of the panel display.

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Vth Compensation Current Source with Poly-Si TFT for System-On-Panel (System-On-Panel을 위한 Poly-Si TFT Vth보상 전류원)

  • Hong, Moon-Pyo;Jeong, Ju-Young
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.43 no.10 s.352
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    • pp.61-67
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    • 2006
  • We developed a constant current source which is insensitive to threshold voltage variation caused by irregular grain boundary distribution in polycrystalline silicon. The proposed current source has superior saturation characteristics over wide range of input voltages as well as small current error compared to the previously reported Vth compensated sources. We measured the circuit performance and error in current due to parameter variation by using HSPICE.

SLS (Sequential Lateral Solidification) Technology for High End Mobile Applications

  • Kang, Myung-Koo;Kim, Hyun-Jae;Kim, ChiWoo;Kim, Hyung-Guel
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.8-11
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    • 2007
  • The new technologies in mobile display developed in SEC are briefly reviewed. For a differentiation, SEC's LTPS line is based on SLS (Sequential Lateral Solidification) technology. In this paper, the characteristics of SEC's SLS in recent and future mobile displays were discussed. The microstructure produced by SLS crystallization is dependent on SLS process conditions such as mask design, laser energy density, and pulse duration time. The microstructure and TFT (Thin Film Transistor) performance are closely related. For an optimization of TFT performance, SLS process condition should be adjusted. Other fabrication processes except crystallization such as blocking layer, gate insulator deposition and cleaning also affect TFT performance. Optimized process condition and tailoring mask design can make it possible to produce high quality AMOLED devices. The TFT non-uniformity caused by laser energy density fluctuation could be successfully diminished by mixing technology.

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Design and Analysis of Current Mode Low Temperature Polysilicon TFT Inverter/Buffer

  • Lee, Joon-Chang;Jeong, Ju-Young
    • Journal of Information Display
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    • v.6 no.4
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    • pp.11-15
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    • 2005
  • We propose a current mode logic circuit design method for LTPS TFT for enhancing circuit operating speed. Current mode inverter/buffers with passive resistive load had been designed and fabricated. Measurement results indicated that the smaller logic swing of the current mode allowed significantly faster operation than the static CMOS. In order to reduce the chip size, both all pTFT and all nTFT active load current mode inverter/buffer had been designed and analyzed by HSPICE simulation. Even though the active load current mode circuits were inferior to the passive load circuits, it was superior to static CMOS gates.

Dynamic Digital Logic Style for LTPS TFT Based System-On-Panel Application

  • Kim, Jae-Geun;Jeong, Je-Young
    • 한국정보디스플레이학회:학술대회논문집
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    • 2004.08a
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    • pp.446-449
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    • 2004
  • We developed a dynamic logic architecture which resulted better leakage current, lower power consumption and less area compared to the conventional dynamic logic structures. We demonstrated the advantage from HSPICE simulation and test chip design has been completed.

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High Resolution System on Glass Displays

  • Okumura, Fujio
    • 한국정보디스플레이학회:학술대회논문집
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    • 2004.08a
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    • pp.119-123
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    • 2004
  • This paper describes low temperature poly-Si (LTPS) TFT system on glass (SOG) technology developed in NEC. High resolution SOG-LCDs such as a 230 ppi reflective type LCD, a 2.5", 333 ppi 2D/3D autostereoscopic LCD, and a 2.1" single voltage driven full integration LCD for mobile applications and a 0.9", XGA light valve for projectors are reviewed from the perspective of the high resolution technologies

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Parametric Study for Excimer Laser-induced Crystallization in the a-Si thin film

  • Moon, Min-Hyung;Kim, Hyun-Jae;Choi, Kwang-Soo;Souk, Jun-Hyung;Seo, Chang-Ki;Kim, Do-Young;Dhungel, Suresh Kumar;Yi, Junsin
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.630-633
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    • 2003
  • Integrating the driver circuitry directly onto the glass substrate would be one of the advantages of polycrystalline Si (poly-Si) TFT-(LCD). Low-temperature poly-Si TFT(LTPS) is well-suited for higher-definition display applications due to its intrinsically superior electrical characteristics. In order to improve LTPS electrical characteristics, currently the excimer laser-induced crystallization (ELC) processes and sequential lateral solidification method were developed. Grain size of the poly-Si is mainly affected by beam pitch and energy density. Key parameter for making a larger poly-Si using excimer laser annealing(ELA) and increasing a throughput is due to increase in beam pitch and energy density to a certain degree. Furthermore, thin $SiO_{2}$ capping is effective to suppress the protrusion of the poly-Si thin films and to reduce the interface state density. From the ELA process, we are able to control grain size by varying different parameters such as number of shots and energy density.

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Multiple-Valued Logic Multiplier for System-On-Panel (System-On-Panel을 위한 다치 논리 곱셈기 설계)

  • Hong, Moon-Pyo;Jeong, Ju-Young
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.44 no.2
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    • pp.104-112
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    • 2007
  • We developed a $7{\times}7$ parallel multiplier using LTPS-TFT. The proposed multiplier has multi-valued logic 7-3 Compressor with folding, 3-2 Compressor, and final carry propagation adder. Architecture minimized the carry propagation. And power consumption reduced by switching the current source to the circuit which is operated in current mode. The proposed multiplier improved PDP by 23%, EDP by 59%, and propagation delay time by 47% compared with Wallace Tree multiplier.

A Study on Negative Bias Temperature Instability in ELA Based Low-Temperature polycrystalline Silicon Thin-Film Transistors

  • Im, Kiju;Choi, Byoung-Deog;Hyang, Park-Hye;Lee, Yun-Gyu;Yang, Hui-won;Kim, Hye-Dong
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08b
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    • pp.1075-1078
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    • 2007
  • Negative Bias Temperature Instability (NBTI) in Eximer Laser Annealing (ELA) based Low Temperature polysilicon (LTPS) Thin-Film Transistors (TFT) was investigated. Even though NBTI is generally appeared in devices with thin gate oxide, the TFT with gate oxide thickness of 120 nm, relatively thick, also showed NBTI effect and dynamic NBTI effect is dependent on operational frequency.

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Effective Annealing and Crystallization of Si Film for Advanced TFT System

  • Noguchi, Takashi
    • Journal of Information Display
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    • v.11 no.1
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    • pp.12-16
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    • 2010
  • The effect of the crystallization and activated annealing of Si films using an excimer laser and the new CW blue laser are described and compared with furnace annealing for application in advanced TFTs and for future applications. Pulsed excimer laser annealing (ELA) is currently being used extensively as a low-temperature poly-silicon (LTPS) process on glass substrates as its efficiency is high in the ultra-violet (UV) region for thin Si films with thickness of 40-60 nm. ELA enables extremely low resistivity relating to high crystallinity for both the n- and p-type Si films. On the other hand, CW blue laser diode annealing (BLDA) enables the smooth Si surface to have arbitral crystal grains from micro-grains to an anisotropic huge grain structure only by controlling its power density. Both annealing techniques are expected to be applied in the future advanced TFT systems.