• Corrosion Science and Technology
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• v.6 no.2
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

• Korean Journal of Materials Research
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• v.5 no.6
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• pp.627-632
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• 1995

W-Cu composites utilize the high electrical conductivity of copper and arc erosion resistance of tungsten to provide properties better suited to electrical contact applications than either tungsten or copper alone. W-Cu composite materials were milled in an attritor with an impeller speed of 300rpm for various milling times. The milled powders were compacted at 300MPa into cylinders, 16m in diameter, and approximately 4m high. Sintering was performed in dry H$_2$at temperature ranging from 1200$^{\circ}C$ to 1400$^{\circ}C$. Samples were sectioned and were polished for scanning electron microscopy (SEM) of microstructures. Homogeneous W-Cu composites were formed after 10 hours mechanical alloying and could be attained 99% density at 1330$^{\circ}C$. As mechanical alloying time increased, Fe-concentration was increased linearly. Intermetallic compound formation interupted the growth of W particles Increased hardness.

• Journal of Welding and Joining
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• v.29 no.6
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• pp.65-70
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• 2011

The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

• Journal of the Korean Society for Nondestructive Testing
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• v.24 no.1
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• pp.29-37
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• 2004

The effect of the substitution of Tungsten(W) for Molybdenum(Mo) on the creep behaviour of 22Cr-5Ni duplex stainless steel(DSS) has been investigated. Creep tests were carried out at $600^{\circ}C\;and\;650^{\circ}C$. Intermetallic ${\sigma}$ phase is precipitated during creep at $650^{\circ}C$, at which creep rupture time was much lower compared with at $600^{\circ}C$. The substitution of W for Mo in the duplex stainless steel was known to retard the formation of ${\sigma}$ phase. Minimum creep rate and creep rupture time, however, were hardly influenced by the substitution of 2wt.% W. An ultrasonic measurement for the creep specimens has been carried out for the evaluation of creep damage. The sound velocity increases propotionally with the increase of creep rupture time at $600^{\circ}C$ of creep temperature. On the contrary, the sound velocity decreases with the increase of rupture time at $650^{\circ}C$, which can be correlated with the microstructural evolution during creep.

• Journal of Surface Science and Engineering
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• v.52 no.2
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• pp.62-71
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• 2019

Al1050 and Al7075 alloy specimens were exposed to atmospheric conditions for 24 months and analyzed by Transmission Electron Microscopy to characterize their corrosion behavior and oxide film characteristics, especially focusing on intergranular corrosion or oxidation. In general, the intergranular oxygen penetration depth of Al1050 was deeper than Al7075. Since O and Si signals were overlapped at the oxidized grain boundaries of Al1050 and Mg is not included in Al1050, it is concluded that Si segregated along the grain boundaries directly impacts on the intergranular corrosion of Al1050. Cr-Si or Mg-Si intermetallic particles were not observed along the grain boundaries of Al7050, but Mg-Si particle was barely observed in the matrix. 10-nm size Mg-Zn particles were also found all over the matrix. Mg was mainly observed along the oxidized grain boundary of Al7075, but Si was not detected due to the Mg-Si particle formation in the matrix and relatively low concentration of Si in Al7075. Therefore, it is thought that Mg plays an important role in the intergranular corrosion of Al7075 under atmospheric corrosion conditions.

• Korean Journal of Metals and Materials
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• v.47 no.12
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• pp.811-818
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• 2009

In order to meet increasingly complex and rigorous technical specifications, extensive effort has been devoted to fabricate clad materials with multi-layered metal plates. In this study, novel stainless steel/aluminum/copper (STS/Al/Cu) three-ply clad materials were fabricated by a hot rolling process for cookware applications. The effect of the testing temperature on the mechanical properties of the clad materials and on each component metal was investigated during the tensile tests. The interface properties of the clad materials were also examined by optical microscopy (OM) and an electron probe micro-analyzer (EPMA). The best mechanical and interfacial properties for a warm working process were found in a sample annealed at a temperature of $300^{\circ}C$. For the sample annealed at $400^{\circ}C$, the results of the tensile test indicated that interface delamination occurred only in the region of the Al/Cu interfaces. This was due to the formation of the thick and brittle intermetallic compound of $Al_2Cu$ in the Al/Cu interface. In contrast, no interface delamination was observed in the STS/Al interface, most likely due to its strong bond strength.

• Korean Journal of Metals and Materials
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• v.48 no.1
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• pp.28-38
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• 2010

High temperature high cycle and low cycle fatigue deformation behavior of automotive heat resistant aluminum alloys (A356 and A319 based) were investigated in this study. The microstructures of both alloys were composed of primary Al-Si dendrite and eutectic Si phase. However, the size and distribution for eutectic Si phase varied: a coarse and inhomogeneous distributed was observed in alloy B (A319 based). A brittle intermethallic phase of ${\alpha}-Fe\;Al_{12}(Fe,Mn)_3Si_2$ was detected only in B alloy. Alloy B exhibited high fatigue life only under a high stress amplitued condition in the high cycle fatigue results, whereas alloy A showed high fatigue life when stress was lowered. With regard to the low-cycle fatigue result ($250^{\circ}C$) showing higher fatigue life as ductility increased, alloy A demonstrated higher fatigue life under all of the strain amplitude conditions. Fractographic observations showed that large porosities and pores near the outside surface could be the main factor in the formation of fatigue cracks. In alloy B. micro-cracks were formed in both the brittle intermetallic and coarse Si phasese. These micro-cracks then coalesced together and provided a path for fatigue crack propagation. From the observation of the differences in microstructure and fractography of these two automotive alloys, the authors attempt to explain the high-temperature fatigue deformation behavior of heat resistant aluminum alloys.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.35-41
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• 2022

In the era of Fifth-Generation (5G), technology requirements such as Artificial Intelligence (AI), Cloud computing, automatic vehicles, and smart manufacturing are increasing. For high efficiency of electronic devices, research on high-intensity circuits and packaging for miniaturized electronic components is important. A solder paste which consists of small solder powders is one of common solder for high density packaging, whereas an electroplated solder has limitation of uniformity of bump composition. Researches are underway to improve wettability through the addition of nanoparticles into a solder paste or the surface finish of a substrate, and to suppress the formation of IMC growth at the metal pad interface. This paper describes the principles of improving the wettability of solder paste and suppressing interfacial IMC growth by addition of nanoparticles.

• Journal of Electrochemical Science and Technology
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• v.13 no.2
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• pp.213-226
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• 2022

In the present study, the corrosion behavior of aluminum Al-7075 tempered (T-6 condition) alloy was evaluated by immersion testing and electrochemical testing in 1.75% and 3.5% NaCl environment at acidic, neutral and basic pH. The data obtained by both immersion tests and electrochemical corrosion tests (potentiodynamic polarization and electrochemical impedance spectroscopy tests) present that the corrosion rate of the alloy specimens is minimum for the pH=7 condition of the solution due to the formation of dense and well adherent thin protective oxide layer. Whereas the solutions with acidic and alkaline pH cause shift in the corrosion behavior of aluminum alloy to more active domains aggravated by the constant flux of acidic and alkaline ions (Cl^- and OH^-) in the media which anodically dissolve the Al matrix in comparison to precipitated intermetallic phases (cathodic in nature) formed due to T6 treatment. Consequently, the pitting behavior of the alloy, as observed by cyclic polarization tests, shifts to more active regions when pH of the solutions changes from neutral to alkaline environment due to localized dissolution of the matrix in alkaline environment that ingress by diffusion through the pores in the oxide film. Microscopic analysis also strengthens the results obtained by immersion corrosion testing and electrochemical corrosion testing as the study examines the corrosion behavior of this alloy under a systematic evaluation in marine environment.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.10 no.4
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• pp.292-296
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• 2000

Mechenochemical reaction by planetary type ball mill is applied to prepare $Sm_2$$Fe_{17}$$N_{x}$ permanent magnet powders. Starting from pure samarium and iron powders, the formation process of hard magnetic $Sm_2$$Fe_{17}$$N_{x}$ phase by ball milling and a subsequent solid state reaction were studied. At as-milled stage powders were found to consist of amorphous Sm-Fe and $\alpha$-Fe phases in all composition of $Sm_2$$Fe_{100-x}$(x = 11, 13, 15). The dependence of starting composition of elemental powder on the formation of Sm-Fe intermetallic compound was investigated by heat treatment of as-milled powders. When Sm concentration was 15 at%, heat-treated powder consists of mostly $Sm_2$$Fe_{17}$$N_{x}$single phase. For synthesizing of hard magnetic $Sm_2$$Fe_{17}$$N_{x}$ compound, additional nitriding treatment was carried out under $N_2$gas atmosphere at $450^{\circ}C$. The increase in the coercivity and remanence was parallel to the nitrogen content which increased drastically at first and then gradually as the nitriding time was extended. The ball-milled Sm-Fe-N powders were expected to be prospective materials for synthesizing of permanent magnet with high performance.