Effect of Tension-Test Temperature on Fracture Behavior and Mechanical Properties in STS/Al/Cu Clad Materials

STS/Al/Cu 클래드재의 파괴거동 및 기계적 물성에 미치는 인장시험 온도의 영향

  • Bae, Dong-Hyun (Dept. of Materials Science and Engineering, Pusan National University) ;
  • Choi, Young-Jun (Dept. of Materials Science and Engineering, Pusan National University) ;
  • Chung, Won-Sub (Dept. of Materials Science and Engineering, Pusan National University) ;
  • Bae, Dong-Su (Dept. of Advanced Materials Engineering, Dong-Eui University) ;
  • Cho, Young-Rae (Dept. of Materials Science and Engineering, Pusan National University)
  • Received : 2009.09.07
  • Published : 2009.12.20

Abstract

In order to meet increasingly complex and rigorous technical specifications, extensive effort has been devoted to fabricate clad materials with multi-layered metal plates. In this study, novel stainless steel/aluminum/copper (STS/Al/Cu) three-ply clad materials were fabricated by a hot rolling process for cookware applications. The effect of the testing temperature on the mechanical properties of the clad materials and on each component metal was investigated during the tensile tests. The interface properties of the clad materials were also examined by optical microscopy (OM) and an electron probe micro-analyzer (EPMA). The best mechanical and interfacial properties for a warm working process were found in a sample annealed at a temperature of $300^{\circ}C$. For the sample annealed at $400^{\circ}C$, the results of the tensile test indicated that interface delamination occurred only in the region of the Al/Cu interfaces. This was due to the formation of the thick and brittle intermetallic compound of $Al_2Cu$ in the Al/Cu interface. In contrast, no interface delamination was observed in the STS/Al interface, most likely due to its strong bond strength.

Keywords

References

  1. W. S. Miller, L. Zhuang, J. Bottema, A. J. Wittebrood, P. D. Smet, A. Haszler, and A. Vieregge, Mater. Sci. Eng. A 280, 37 (2000) https://doi.org/10.1016/S0921-5093(99)00653-X
  2. H. D. Manesh and A. K. Taheri, Mater. Design. 24, 617(2003) https://doi.org/10.1016/S0261-3069(03)00135-3
  3. K. J. Min, M. H. Jeong, K. H. Lee, Y. S. Jeong, and Y. B. Park, J. Kor. Inst. Met. & Mater. 47, 675 (2009)
  4. Y. M. Hwang, H. H. Hso, and H. J. Lee, Int. J. Mech. Sci. 37, 297 (1995) https://doi.org/10.1016/0020-7403(95)93522-8
  5. J. E. Lee, D. H. Bae, W. S. Chung, K. H. Kim, J. H. Lee, and Y. R. Cho, J. Mater. Process. Technol. 187-189, 546 (2007) https://doi.org/10.1016/j.jmatprotec.2006.11.121
  6. H. D. Manesh and A. K. Taheri, J. Alloys Comp. 361, 138(2003) https://doi.org/10.1016/S0925-8388(03)00392-X
  7. D. H. Bae, S. J. Jung, Y. R. Cho, W. S. Jung, H. S. Jung, C. Y. Kang, and D. S. Bae, J. Kor. Inst. Met. & Mater. 47, 573(2009)
  8. P. C. Tortorici, and M. A. Dayanada, Mater. Sci. Eng. A 244, 207 (1998) https://doi.org/10.1016/S0921-5093(97)00534-0
  9. B. Fei, M. Fei, and Z. Chen, IEEE Trans. Electromagn. Compat. 41, 196 (1999) https://doi.org/10.1109/15.784154
  10. T. Mori, and S. Kuromoto, J. Mater. Process. Technol. 56, 242 (1996) https://doi.org/10.1016/0924-0136(95)01838-7
  11. K. Y. Rhee, W. Y. Han, H. J. Park, and S. S. Kim, Mater. Sci. Eng. A. 384, 70 (2004) https://doi.org/10.1016/j.msea.2004.05.051
  12. D. N. Wasnik, V. Kain, I. Samajdar, B. Verlinden, and P. K. De, Acta Mater. 50, 587 (2002) https://doi.org/10.1016/S1359-6454(02)00306-3
  13. L. M. Ramirez, E. Almanza, and L. E. Murr, Mater. Charact. 53, 79 (2004) https://doi.org/10.1016/j.matchar.2004.08.003
  14. V. Kain, K. Chandra, K. N. Adhe, and P. K. De, J. Nucl. Mater. 334, 115 (2004) https://doi.org/10.1016/j.jnucmat.2004.05.008
  15. R. E. Reed-Hill, Physical Metallurgy Principal, 2nd ed., p.284-291, D. Van Nostrand Company, New York (1973)
  16. J. H. Kim, B. K. Suh, H. C. Kwon, and W.Y. Yoon, J. Kor. Inst. Met. & Mater. 38, 474 (2000)
  17. D. L. Cocke, R. Schennach, M. A. Hossain, D. E. Mencer, H. McWhinney, J. R. Parga, M. Kesmez, J. A. G. Gomes and M. Y. A. Mollah, Vacuum. 79, 71 (2005) https://doi.org/10.1016/j.vacuum.2005.01.010