Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Wettability and Intermetallic Compounds of Sn-Ag-Cu-based Solder Pastes with Addition of Nano-additives

나노 첨가제에 따른 Sn-Ag-Cu계 솔더페이스트의 젖음성 및 금속간화합물

  • Seo, Seong Min (Department of Materials Science and Engineering, University of Seoul) ;
  • Sri Harini, Rajendran (Department of Materials Science and Engineering, University of Seoul) ;
  • Jung, Jae Pil (Department of Materials Science and Engineering, University of Seoul)
  • Received : 2022.03.11
  • Accepted : 2022.03.25
  • Published : 2022.03.30
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Abstract

In the era of Fifth-Generation (5G), technology requirements such as Artificial Intelligence (AI), Cloud computing, automatic vehicles, and smart manufacturing are increasing. For high efficiency of electronic devices, research on high-intensity circuits and packaging for miniaturized electronic components is important. A solder paste which consists of small solder powders is one of common solder for high density packaging, whereas an electroplated solder has limitation of uniformity of bump composition. Researches are underway to improve wettability through the addition of nanoparticles into a solder paste or the surface finish of a substrate, and to suppress the formation of IMC growth at the metal pad interface. This paper describes the principles of improving the wettability of solder paste and suppressing interfacial IMC growth by addition of nanoparticles.

5G 시대를 맞아, 인공지능, 클라우드 컴퓨팅, 자율주행 차량, 스마트 제조 등의 기술 소요가 증가하고 있다. 전자기기의 고효율을 위해 고집적회로 및 패키징 연구는 중요하다. 전해도금된 솔더는 범프 조성의 균일성에 한계가 있다. 작은 크기의 솔더 파우더로 구성된 솔더 페이스트는 고집적 패키징에 일반적으로 사용되는 솔더 중 하나이다. 솔더 페이스트에 나노 입자를 첨가하거나 기판 표면 마감 처리를 하여 젖음성을 향상시키고, 금속 패드 계면에서 금속간화합물의 성장을 억제하는 연구가 진행중이다. 본 논문은 나노 입자 첨가를 통한 솔더 페이스트의 젖음성 향상과 계면 금속간화합물의 성장을 억제하는 원리에 대하여 설명한다.

Keywords

Acknowledgement

본 연구는 산업통상자원부 및 산업기술평가관리원(KEIT)의 소재부품기술개발사업 연구비 지원에 의한 연구 결과입니다(과제번호 및 과제명; '20010580', 미니-LED 미세전극 접합을 위한 도전성 나노소재 기술 개발).

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