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http://dx.doi.org/10.6117/kmeps.2022.29.1.035

Wettability and Intermetallic Compounds of Sn-Ag-Cu-based Solder Pastes with Addition of Nano-additives  

Seo, Seong Min (Department of Materials Science and Engineering, University of Seoul)
Sri Harini, Rajendran (Department of Materials Science and Engineering, University of Seoul)
Jung, Jae Pil (Department of Materials Science and Engineering, University of Seoul)
Publication Information
Journal of the Microelectronics and Packaging Society / v.29, no.1, 2022 , pp. 35-41 More about this Journal
Abstract
In the era of Fifth-Generation (5G), technology requirements such as Artificial Intelligence (AI), Cloud computing, automatic vehicles, and smart manufacturing are increasing. For high efficiency of electronic devices, research on high-intensity circuits and packaging for miniaturized electronic components is important. A solder paste which consists of small solder powders is one of common solder for high density packaging, whereas an electroplated solder has limitation of uniformity of bump composition. Researches are underway to improve wettability through the addition of nanoparticles into a solder paste or the surface finish of a substrate, and to suppress the formation of IMC growth at the metal pad interface. This paper describes the principles of improving the wettability of solder paste and suppressing interfacial IMC growth by addition of nanoparticles.
Keywords
Sn-Ag-Cu solder paste; nano-composite solder; wettability; IMC growth;
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Times Cited By KSCI : 1  (Citation Analysis)
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