• JSTS:Journal of Semiconductor Technology and Science
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• v.9 no.1
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• pp.8-13
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• 2009

In this paper, discontinuous interconnect lines are modeled as a cascaded line composed of many uniform interconnect lines. The system functions of respective uniform interconnect lines are determined, followed by its time domain response. Since the time domain response expression is a transcendental form, the waveform expression is reconfigured as an approximated linear expression. The proposed model has less than 2% error in the delay estimation.

• The Magazine of the IEIE
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• v.24 no.12
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• pp.52-68
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• 1997

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.8
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• pp.1547-1554
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• 2011

As process parameters scale, interconnect width are reduced rapidly while the current flowing through interconnects does not decrease in a proportional manner. This effect increases current density in metal interconnects which may result in poor reliability. Since RMS(root-mean-square) current limits are used to evaluate self-heating and short-time stress failures caused by high-current pluses, RMS current estimation is very important to guarantee the reliability of semiconductor systems. Hence, it is critical to estimate the current limits through interconnects earlier in semiconductor design stages. The purpose of this paper is to propose a fast, yet accurate RMS current estimation technique that can offer a relatively precise estimate by using closed-form equations. The efficiency and accuracy of the proposed method have been verified through simulations using HSPICE for a vast range of interconnect parameters.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.4
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• pp.101-112
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• 2004

In this paper, we developed a numerical analysis model by using ADI-FDTD method to analyze three-dimensional interconnect structure. We discretized maxwell's curl equation by using ADI-FDTD. Using ADI-FDTD method, a sampler circuit designed from 3.3 V CMOS technology is simplified to 3-metal line structure. Using this simplified structure, the time delay and signal distortion of complex interconnects are investigated. As results of simulation, 5∼10 ps of delay time and 0.1∼0.2 V of signal distortion are measured. As demonstrated in this paper, the full-wave analysis using ADI-FDTD exhibits a promise for accurate modeling of electromagnetic phenomena in high-speed VLSI interconnect.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.3
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• pp.189-192
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• 2001

A simple metal-insulator-metal (MIM) capacitor in a standard $0.25{\;}\mu\textrm{m}$ digital CMOS process is described. Using all six interconnect layers, this capacitor exploits both the lateral and vertical electrical fields to increase the capacitance density (capacitance per unit area). Compared to a conventional parallel plate capacitor in the four upper metal layers, this capacitor achieves lower parasitic substrate capacitance, and improves the capacitance density by a factor of 4. Measurements and an extracted model for the capacitor are also presented. Calculations, model and measurements agree very well.

• Journal of the Korean Institute of Telematics and Electronics
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• v.23 no.4
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• pp.543-549
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• 1986

A topologically based interconnection routing of multilayer printed circuit boards has been proposed. This study focuses on modeling the relative positioning of the interconnect paths rather than absolute positioning within a fixed coordinate system, thereby avoiding simplifications that impose restrictin on the path shapes.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.1
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• pp.15-22
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• 2011

Interconnect lines with inter-layer vias are experimentally characterized by using high-frequency S-parameter measurements. Test patterns are designed and fabricated using a package process. Then they are measured using Vector Network Analyzer (VNA) up to 25 GHz. Modeling a via as a circuit, its model parameters are determined. It is shown that the circuit model has excellent agreement with the measured S-parameters. The signal integrity of the lines with inter-layer vias is evaluated by using the developed circuit model. Thereby, it is shown that via may have a substantially deteriorative effect on the signal integrity of high-speed integrated circuits.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.8
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• pp.52-63
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• 2002

In this paper, we developed a numerical analysis model by using ADI-FDTD method to analyze three-dimensional interconnect structure. We discretized maxwell's curl equation by using ADI-FDTD. We introduced PML(Perfectly Matched Layer) absorbing boundary condition to solve the effect of the reflected wave at the interface. Evaluating the numerical model of PML and ADI-FDTD, we simulated the electric field distribution in time domain. We compare standard FDTD with ADI-FDTD, and analysis the result.

• Transactions of the Korean Society of Automotive Engineers
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• v.13 no.6
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• pp.48-55
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• 2005

In this paper, a mathematical model and a simulation method for the response time analysis of Local Interconnect Network(LIN) based network systems are proposed. Network-induced delays in a network based control system can vary widely according to the transmission time of message and the overhead time of transmission. Therefore, in order to design a distributed control system using LIN network, a method to predict and verify the timing behavior of LIN protocol is required at the network design phase. Furthermore, a simulation environment based on a timing model of LIN protocol is beneficial to predict the timing behavior of LIN. The model equation is formulated with six timing parameters deduced from timing properties of LIN specification. Additionally, LIN conformance test equations to verify LIN device driver are derived with timing constraints of the parameters. The proposed model equation and simulation method are validated with a result that is measured at real LIN based network system.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.4
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• pp.229-236
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• 2005

This paper presents a system level architecture evaluation technique that leverages transaction level modeling but also significantly extends it to the realm of system level performance evaluation. A major issue lies with the modeling effort. To reduce the modeling effort the proposed technique develops the concept of worst case scenarios. Since the memory controller is often found to be an important component that critically affects the system performance and thus needs optimization, the paper further addresses how to evaluate and optimize the memory controllers, focusing on the test environment and the methodology. The paper also presents an industrial case study using a real state-of-the-art design. In the case study, it is reported that the proposed technique has helped successfully find the performance bottleneck and provide appropriate feedback on time.