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http://dx.doi.org/10.5573/JSTS.2011.11.1.015

Experimental Characterization and Signal Integrity Verification of Interconnect Lines with Inter-layer Vias  

Kim, Hye-Won (Dept. Electrical and Computer Engineering, Hanyang University)
Kim, Dong-Chul (Dept. Electrical and Computer Engineering, Hanyang University)
Eo, Yung-Seon (Dept. Electrical and Computer Engineering, Hanyang University)
Publication Information
JSTS:Journal of Semiconductor Technology and Science / v.11, no.1, 2011 , pp. 15-22 More about this Journal
Abstract
Interconnect lines with inter-layer vias are experimentally characterized by using high-frequency S-parameter measurements. Test patterns are designed and fabricated using a package process. Then they are measured using Vector Network Analyzer (VNA) up to 25 GHz. Modeling a via as a circuit, its model parameters are determined. It is shown that the circuit model has excellent agreement with the measured S-parameters. The signal integrity of the lines with inter-layer vias is evaluated by using the developed circuit model. Thereby, it is shown that via may have a substantially deteriorative effect on the signal integrity of high-speed integrated circuits.
Keywords
Circuit model; eye-diagram; scattering parameter; via;
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