System Level Architecture Evaluation and Optimization: an Industrial Case Study with AMBA3 AXI |
Lee, Jong-Eun
(SoC R&D Center, System LSI Samsung Electronics, Co.)
Kwon, Woo-Cheol (SoC R&D Center, System LSI Samsung Electronics, Co.) Kim, Tae-Hun (SoC R&D Center, System LSI Samsung Electronics, Co.) Chung, Eui-Young (SoC R&D Center, System LSI Samsung Electronics, Co.) Choi, Kyu-Myung (SoC R&D Center, System LSI Samsung Electronics, Co.) Kong, Jeong-Taek (SoC R&D Center, System LSI Samsung Electronics, Co.) Eo, Soo-Kwan (SoC R&D Center, System LSI Samsung Electronics, Co.) Gwilt, David (Fabric IP Division, ARM Ltd.) |
1 | Specman eVC, further information available on http://www.cadence.com/verisity |
2 | 'ARM PrimeCell Dynamic Memory Controller Technical Reference Manual,' ARM Limited, Ref: ARM DDI 0331A, June 2004 |
3 | 'PrimeCell AXI Configurable Interconnect,' ARM Limited, Ref: ARM DDI 0354A, Dec 2004 |
4 | 'AMBA AXI Protocol Specification,' ARM Limited, 2003 |
5 | T. Grotker et al., System Design with SystemC, Kluwer, 2002 |
6 | 'New multimedia application processor chips for 2.5/3G mobile phones,' 3G Newsletter, Feb. 2003, online document available at http://www.3g.co.uk/PR/Feb2003/4832.htm, last accessed July 20, 2005 |
7 | 'Mobile application processor for 3G phones,' 3G Newsletter, Sept. 2004, online document available at http://www.3g.co.uk/PR/Sept2004/8344.htm, last accessed July 20, 2005 |
![]() |