• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 금형가공,미세가공,플라스틱가공 공동 심포지엄
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• pp.9-12
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• 2005

The rapid thermal response (RTR) molding is a novel process developed to raise the temperature of mold surface rapidly to the polymer melt temperature prior to the injection stage and then cool rapidly to the ejection temperature. The resulting filling process is achieved inside a hot mold cavity by prohibiting formation of frozen layer so as to enable thin wall injection molding without filing difficulty. The present work covers flow simulation of thin wall injection molding using the RTR molding process. In order to take into account the effects of thermal boundary conditions of the RTR mold, coupled analysis with transient heat transfer simulation is suggested and compared with conventional isothermal analysis. The proposed coupled simulation approach based on solid elements provides reliable thin wall flow estimation fur both the conventional molding and the RTR molding processes

• JSTS:Journal of Semiconductor Technology and Science
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• 제1권3호
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• pp.158-166
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• 2001

Based on uniform hot carrier injection (optically assisted electron injection) across the $Si-SiO_2$ interface into the gate insulator of n-channel IGFETs, the threshold voltage shifts associated with electron injection of $1.25{\times}l0^{16}{\;}e/\textrm{cm}^2 between 0.5 and 7 MV/cm were found to decrease from positive to negative values, indicating both a decrease in trap cross section ($E_{ox}{\geq}1.5 MV/cm$) and the generation of FPC $E_{ox}{\geq}5{\;}MV/cm$). It was also found that FNC and large cross section NETs were generated for $E_{ox}{\geq}5{\;}MV/cm$. Continuous, uniform low-field (1MV/cm) electron injection up to $l0^{19}{\;}e/\textrm{cm}^2 is accompanied by a monatomic increase in threshold voltage. It was found that the data could be modeled more effectively by assuming that most of the threshold voltage shift could be ascribed to generated bulk defects which are generated and filled, or more likely, generated in a charged state. The injection method and conditions used in terms of injection fluence, injection density, and temperature, can have a dramatic impact on what is measured, and may have important implications on accelerated lifetime measurements.

• JSTS:Journal of Semiconductor Technology and Science
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• 제16권2호
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• pp.191-197
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• 2016

In this paper, we investigated the hotcarrier injection (HCI) mechanism, one of the most important reliability issues, in 10 nm node Input/Output (I/O) bulk FinFET. The FinFET has much intensive HCI damage in Fin-bottom region, while the HCI damage for planar device has relatively uniform behavior. The local damage behavior in the FinFET is due to the geometrical characteristics. Also, the HCI is significantly affected by doping profile, which could change the worst HCI bias condition. This work suggested comprehensive understanding of HCI mechanisms and the guideline of doping profile in 10 nm node I/O bulk FinFET.

• JSTS:Journal of Semiconductor Technology and Science
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• 제2권3호
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• pp.157-163
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• 2002

A new flash EEPROM device with p^＋ poly-Si control gate and n^＋ poly-Si floating side gate was fabricated and characterized. The n^＋ poly-Si gate is formed on both sides of the p^＋ poly-Si gate, and controls the underneath channel conductivity depending on the number of electron in it. The cell was programmed by hot-carrier-injection at the drain extension, and erased by direct tunneling. The proposed EEPROM cell can be scaled down to 50 nm or less. Shown were measured programming and erasing characteristics. The channel resistance with the write operation was increased by at least 3 times.

• 한국기계가공학회지
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• 제14권4호
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• pp.14-20
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• 2015

Molding technologies for plastic microstructures have been extensively investigated during the last two decades, and theoretical and numerical studies on the micro molding process have provided efficient tools for the development of such molding technologies. In this paper, we present a review of numerical simulation methods for the micro molding process. Basic models for a description of the material property, governing equations of the flow and heat transfer during the molding process, and numerical methods will be described. Particularly, numerical simulations for micro injection molding and hot embossing processes will be presented, and their main features noted and compared to those for conventional molding processes.

• 동력기계공학회지
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• 제8권1호
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• pp.18-23
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• 2004

The direct injection diesel engine is one of the most efficient thermal engines. For this reason DI diesel engines are widely used for heavy-duty applications. But the world is faced with very serious problems related to the air pollution due to the exhaust emissions of diesel engine. So, that is air pollution related to exhaust gas resulted from explosive combustion should be improved. Exhaust Gas Recirculation(EGR) is a proven method to reduce NOx emissions. In this study, the experiments-were performed at various engine loads while the EGR rates were set from 0% to 20%. The emissions trade-off and combustion of diesel engine are investigated. Hot and cooled EGR are achieved without cooling and with cooling respectively. It was found that the exhaust emissions with the EGR system resulted in a very large reduction in oxides of nitrogen at the expense of higher smoke emissions. Also, the reduction rates of NOx emissions for hot and cooled EGR are similar at load 20%.

• 한국분말재료학회지
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• 제25권4호
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• pp.346-354
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• 2018

Over the last decade, the study of the synthesis of semiconductor colloidal quantum dots has progressed at a tremendous rate. Colloidal quantum dots, which possess unique spectral-luminescent characteristics, are of great interest in the development of novel materials and devices, which are promising for use in various fields. Several studies have been carried out on hot injection synthesis methods. However, these methods have been found to be unsuitable for large-capacity synthesis. Therefore, this review paper introduces synthesis methods other than the hot injection synthesis method, to synthesize quantum dots with excellent optical properties, through continuous synthesis and large capacity synthesis. In addition, examples of the application of synthesized colloid quantum dots in displays, solar cells, and bio industries are provided.

• Design & Manufacturing
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• 제13권1호
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• pp.36-41
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• 2019

A large plastic molding requires an injection molding with a large clamping force. However, it could not be prepared in the manufacturing at any time. In order to solve the problem, the injection molding analysis study was conducted on the back cover of 55 inch LED TV. The study compared the case of applying the existing flow system such as hot runner, the improvement of the hot runner lay-out and the precise control of the gate operation time, From the results of using the improved flow system, it was found that the welding and the clamping force were considerably improved as compared with before the improvement. In particular, the clamping force was reduced by 50% compared with before the improvement.

• Nano
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• 제13권10호
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• pp.1850114.1-1850114.7
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• 2018

Here we report an optimized hot-injection method and a phase transfer strategy for the synthesis of water-soluble $CuInS_2$ QDs with desired properties. The structure and morphology studies demonstrate that the resulting QDs are $CuInS_2$ tetragonal phase with well-defined facets. It is also found that the crystal size gradually increases with the increase of reaction temperature, while the surface of QDs with pre- and post-phase transfer is functionalized with hydrophobic and hydrophilic ligands, respectively. Spectroscopy measurements reveal the size-dependent optical properties of $CuInS_2$ QDs, demonstrating the quantum confinement effect in this system.

• JSTS:Journal of Semiconductor Technology and Science
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• 제8권1호
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• pp.11-20
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• 2008

The structure of 2-bit/cell flash memory device was characterized for sub-50 nm non-volatile memory (NVM) technology. The memory cell has spacer-type storage nodes on both sidewalls in a recessed channel region, and is erased (or programmed) by using band-to-band tunneling hot-hole injection (or channel hot-electron injection). It was shown that counter channel doping near the bottom of the recessed channel is very important and can improve the $V_{th}$ margin for 2-bit/cell operation by ${\sim}2.5$ times. By controlling doping profiles of the channel doping and the counter channel doping in the recessed channel region, we could obtain the $V_{th}$ margin more than ${\sim}1.5V$. For a bit-programmed cell, reasonable bit-erasing characteristics were shown with the bias and stress pulse time condition for 2-bit/cell operation. The length effect of the spacer-type storage node is also characterized. Device which has the charge storage length of 40 nm shown better ${\Delta}V_{th}$ and $V_{th}$ margin for 2-bit/cell than those of the device with the length of 84 nm at a fixed recess depth of 100 nm. It was shown that peak of trapped charge density was observed near ${\sim}10nm$ below the source/drain junction.