• 전자공학회논문지A
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• 제31A권8호
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• pp.72-79
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• 1994

In this paper semi empirical models are presented for the hot electron induced threshold voltage shift(${\Delta}V_{t}$) and effective channel shortening length (${\Delta}L_{H}$) in degraded PMOSFET. Trapped electron charges in gate oxide are calculated from the well known gate current model and ΔLS1HT is calculated by using trapped electron charges. (${\Delta}L_{H}$) is a function of gate stress voltage such as threshold voltage shift and degradation of drain current. From the correlation between (${\Delta}L_{H}$) has a logarithmic function of stress time. From the measured results, (${\Delta}V_{t}$) and (${\Delta}L_{H}$) are function of initial gate current and device channel length.

• 전자공학회논문지A
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• 제30A권12호
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• pp.77-87
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• 1993

PMOSFETs were studied on the effect of Hot-Carrier induced drain leakage current (Gate-Induced-Drain-Leakage). The result turned out that change in Vgl(drain voltage where 1pA/$\mu$m of drain leadage current flows) was largest in the Channel-Hot-Hole(CHH) injection condition and next was in dynamic stress and was smallest in electron trapping (Igmax) condition under various stress conditions. It was analyzed that if electron trapping occurrs in the overlap region of gate and drain(G/D), it reduces GIDL current due to increment of flat-band voltage(Vfb) and if CHH is injected, interface states(Nit) were generated and it increases GIDL current due to band-to-defect-tunneling(BTDT). Especially, under dynamic stress it was confirmed that increase in GIDL current will be high when electron injection was small and CHH injection was large. Therefore as applying to real circuit, low drain voltage GIDL(BTDT) was enhaced as large as CHH Region under various operating voltage, and it will affect the reliablity of the circuit.

• 한국군사과학기술학회지
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• 제11권4호
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• pp.76-82
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• 2008

Alloy 718 nozzle component was manufactured by hot forging and electron beam welding process. In this process, 718 billets produced in domestic company were used and evaluated. Before performing industrial scale hot forging, small size hot compression tests were carried out under various process conditions and then microstructural evaluations were analyzed. Using the results, FEM simulations were performed in order to optimize the hot working process. After hot working, forged work-pieces were machined and welded by electron beam. Final nozzle components were heat treated and their microstructure and mechanical properties were investigated.

• 전자공학회논문지A
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• 제31A권1호
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• pp.77-83
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• 1994

Characteristics of hot-electron-induced degradation by AC, DC was investigated for p-MOSFET's(W/L=25/l$\mu$m) with sub-10nm RTP-CVD gate oxides. It was confirmed that the surface channel p-MOSFET of a thinner gate oxide shows less degradation. Mechanisms for this effect were analyzed using a simple MOS Device degradation model. It was found that the number of generated electron traps(fixed charge) is determined by the amount of peak gate current, dependent of the gate oxide thickness, and the major cause of the smaller degradation in the thinner gate oxide devices is the lower hot electron trapping carriers.

• 반도체디스플레이기술학회지
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• 제17권1호
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• pp.76-83
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• 2018

The electron energy probability function (EEPF) is of significant importance since the plasma chemistry such as the rate of ionization is determined by the electron energy distribution function. It is usually assumed to be Maxwell distribution for 0-D global model. Meanwhile, it has been observed experimentally that the form of EEPF of Ar plasma changes from being two-temperature to Druyvesteyn like as the gas pressure increases. Thus, to apply the 0-D global model of Maxwellian distribution to the non-Maxwellian plasma, we investigated the relative contribution of two distinct electrons with different temperatures. The contributions of cold/hot electrons to the equilibrium state of the plasma have attracted interest and been researched. The contributions to the power and particle balance of cold/hot electrons were studied by comparing the result of the global model considering all combinations of electron temperatures with that of 1-D Particle-in-Cell and Monte Carlo collision (PIC-MCC) simulation and the results of studies were analyzed physically. Furthermore, comparisons term by term for variations of the contribution of cold/hot electrons at different driving currents are presented.

• 대한전자공학회논문지
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• 제20권2호
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• pp.1-6
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• 1983

MOS 트랜지스터의 채널이 짧아짐에 따라 threshold 전압과 punchthrough 전압이 감소하는 현상을 실리콘 게이트 NMOS 기술로 제작한 소자로써 실험적으로 관찰하였다. 또한 게이트 산화막의 두께를 50nm와 70nm로 감소시키고 보론(boron)을 임플랜트한 소자를 제작하여 게이트 산화막의 두께와 서브스트레이트의 불순물의 농도가 threshold 전압과 Punchthrough 전압의 감소에 미치는 영향을 측정하였다. 또 채널의 길이가 3㎛인 소자에 대하여 hot-electron의 방출을 플로우팅 게이트 패준 방법에 의하여 측정하였으며 그 결과 채널의 길이가 3㎛까지는 hot-electron의 방출은 문제가 되진 않음을 관찰하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.310.1-310.1
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• 2013

We show the novel hot electron based-solar energy conversion using tandem structured Schottky diode with double Schottky barriers. In this report, we show the effect of the double Schottky barriers on solar cell performance by enhancing both of internal photoemission and band-to-band excitation. The tandem structured Au/Si diode capped with TiO2 layer as second semiconductor exhibited improved ability for light harvesting. The proposed mechanisms consist of multiple reflections of hot electrons and additional pathway of solar energy conversion due to presence of multiple interfaces between thin gold film and semiconductors. Short-circuit photocurrent measured on the tandem structured Au/Si diodes under illumination of AM1.5 increased by approximately 70% from 3.1% to 5.3% and overall incident photon to electron conversion efficiency (IPCE) was enhanced in visible light, revealing that the concept of the double Schottky barriers have significant potential as novel strategy for light harvesting.

• 한국수산과학회지
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• 제50권4호
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• pp.388-395
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• 2017

We investigated the toxicity of zinc and aluminum hot-dip galvanized sheet steel to abalone Haliotis discus hannai via changes in the gill and hepatopancreas using histological and transmission electron microscopy analysis. Experimental groups were composed of one control and four exposure conditions (direct or indirect exposure to zinc and aluminum hot-dip galvanized sheet steel). In the control group, aluminum exposure groups (direct and indirect), and indirect zinc exposure group, abalone mortality was not observed until the end of the experiment, and no histopathological changes were observed in the gill and hepatopancreas. However, the direct zinc exposure group exhibited 100% mortality. Ultrastructural analysis of the cytoplasm of ciliated and microvilli-bearing epithelial cells from gill filaments revealed electron-dense vesicles near the cell membrane and disruption of the nuclear membrane. We also observed swollen mitochondria and a loss of mitochondrial cristae. The hepatopancreas showed similar changes, and we detected highly electron-dense particles within the vesicles. These results suggest that abalone exposed directly to zinc hot-dip galvanized sheet steel experience acute toxicity, causing damage to cell organelles in the gill and hepatopancreas and, finally, inducing mortality.

• 대한전자공학회논문지SD
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• 제41권7호
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• pp.21-29
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• 2004

본 논문에서는 Dual oxide를 갖는 Nano-scale CMOSFET에서 각 소자의 Hot carrier 특성을 분석하여 두 가지 중요한 결과를 나타내었다. 하나는 NMOSFET Thin/Thick인 경우 CHC stress 보다는 DAHC stress에 의한 소자 열화가 지배적이고, Hot electron이 중요하게 영향을 미치고 있는 반면에, PMOSFET에서는 특히 Hot hole에 의한 영향이 주로 나타나고 있다는 것이다. 다른 하나는, Thick MOSFET인 경우 여전히 NMOSFET의 수명이 PMOSFET의 수명에 비해 작지만, Thin MOSFET에서는 오히려 PMOSFET의 수명이 NMOSFET보다 작다는 것이다. 이러한 분석결과는 Charge pumping current 측정을 통해 간접적으로 확인하였다. 따라서 Nano-scale CMOSFET에서의 NMOSFET보다는 PMOSFET에 대한 Hot camel lifetime 감소에 관심을 기울여야 하며, Hot hole에 대한 연구가 진행되어야 한다고 할 수 있다.

• 전자공학회논문지A
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• 제30A권9호
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• pp.38-45
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• 1993

In this study, the degradation characteristics of drain output resis-tance was described due to hot electron effects. An semi-empirical model for the degraded drain output resistance was derived from the measured device characteristics. The suggested model was verified from the measured data and the device parameter dependence was also analyzed. The degradation of drain output resistance was increased with stress time and had linear relationship with the degradation of drain current. The device lifetime which was defined by failure criteria of drain output resistance (such as $\Delta$ro/roo=5%) was equivalent to that of failure criteria of drain current (such as $\Delta$ID/ID=5%)