• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.7-17
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• 2014

Power electronics modules are semiconductor components that are widely used in airplanes, trains, automobiles, and energy generation and conversion facilities. In particular, insulated gate bipolar transistors(IGBT) have been widely utilized in high power and fast switching applications for power management including power supplies, uninterruptible power systems, and AC/DC converters. In these days, IGBT are the predominant power semiconductors for high current applications in electrical and hybrid vehicles application. In these application environments, the physical conditions are often severe with strong electric currents, high voltage, high temperature, high humidity, and vibrations. Therefore, IGBT module packages involves a number of challenges for the design engineer in terms of reliability. Thermal and thermal-mechanical management are critical for power electronics modules. The failure mechanisms that limit the number of power cycles are caused by the coefficient of thermal expansion mismatch between the materials used in the IGBT modules. All interfaces in the module could be locations for potential failures. Therefore, a proper thermal design where the temperature does not exceed an allowable limit of the devices has been a key factor in developing IGBT modules. In this paper, we discussed the effects of various package materials on heat dissipation and thermal management, as well as recent technology of the new package materials.

• Proceedings of the KIPE Conference
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• 2003.07a
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• pp.10-14
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• 2003

This paper deals with the design of heat dissipation system using the forced air cooling method. It suggests the method of appropriately dividing the whole thermodynamic system into analytical subsystems and also presents the correspondent analytic or experimental equations to subsystems. The experimental results on the designed thermodynamic system for 400kw 1GBT inverter show the validity of the proposed design method in the steady state.

• The Korean Journal of Rheology
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• v.6 no.2
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• pp.129-138
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• 1994

공압출되는 sheet die에서 고분자 물질의 비등온 유동유동을 수치모사하였다. 유변학 적 식으로 power-law model을 사용하였고, 격자생성법을 이용한 유한차분법을 사용하였다. 수치계산을 통해 수축채널에서의 온도 분포를 구해보고 점도가 채널에서의 온도 분포를 구 해 보고 점도가 채널에서의 압력강하 및 신장속도에 미치는 영향을 알아보았다. 압력강하는 외부 유체의 점도 및 heat dissipation의 영향을 크게 받았다. 신장속도는 외부 유체의 점도 가 증가함에 따라 커진 반면 내부 유체의 점도가 증가함에 따라 커진반면, 내부 유체의 점 도증가에 따라 감소하였고, heat dissipation에 의해 증가하였다.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.33 no.4
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• pp.79-84
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• 2010

In recent years, conventional streetlight is replaced by LED streetlight to reduce power consumption dramatically and to maximize lighting effects. However the characteristic of power LED itself driven by high current to increase the illumination, we need to develop effective heat release device. This study suggests new concept of heat dissipation device using PCM (Phase Change Material) and shows an experiment results to investigate thermal effects of PCM.

• The Journal of the Korea institute of electronic communication sciences
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• v.18 no.4
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• pp.641-648
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• 2023

Recently, the rapid growth of artificial intelligence among the 4th industrial revolution has progressed based on the performance improvement of semiconductor, and circuit integration. According to transistors, which help operation of internal electronic devices and equipment that have been progressed to be more complicated and miniaturized, the control of heat generation and improvement of heat dissipation efficiency have emerged as new performance indicators. The DUT(Device Under Test) Shell is equipment which detects malfunction transistor by evaluating the durability of transistor through heat dissipation in a state where the power is cut off at an arbitrary heating point applying the rating current to inspect the transistor. Since the DUT shell can test more transistor at the same time according to the heat dissipation structure inside the equipment, the heat dissipation efficiency has a direct relationship with the malfunction transistor detection efficiency. Thus, in this paper, we propose various method for PCB configuration structure to optimize heat dissipation of DUT shell and we also propose various transformation and thermal analysis of optimal DUT shell using computational fluid dynamics.

• Bulletin of the Korean Space Science Society
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• 2004.10b
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• pp.270-273
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• 2004

The initial thermal analysis needs to be fast and efficient to reduce the feedback time for the optimal electronic equipment designing. In this study, a thermal model is developed by using power consumption measurement values of each functional breadboard, that is, semi-empirical power dissipation method. In modeling heat dissipated EEE parts, power dissipation is imposed evenly on the EEE part footprint area which is projected to the printed circuit board, and is called surface heat model. The application of these methods is performed in the development of a command and telemetry unit (CTU) for a geostationary satellite. Finally, the thermal cycling test is performed to verify the applied thermal analysis methods.

• The Transactions of the Korean Institute of Power Electronics
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• v.28 no.1
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• pp.39-47
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• 2023

This paper applies a structural technique with uniform parallel switch characteristics in gates and power loops to minimize the ringing and current imbalance that occurs when a general discrete package (TO-247)-based power semiconductor device is operated in parallel. Also, this propose a heat sink integrated switching module with heat sink design flexibility and high power density. The developed heat dissipation-integrated switching module verifies the symmetry of the parasitic inductance of the parallel switch through Q3D by ansys and the validity of the structural technique of the parallel switch using the LLC resonant converter experiment operating at a rated capacity of 7.5 kW.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.89-93
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• 2018

Ceramic substrates applied to power modules of electric vehicles are required to have properties of high thermal conductivity, high electrical insulation, low thermal expansion coefficient and resistance to abrupt temperature change due to high power applied by driving power. Aluminum nitride and silicon nitride, which are applied to heat dissipation, are considered as materials meeting their needs. Therefore, in this paper, the properties of aluminum nitride and silicon nitride as radiator plate materials were compared through a commercial analysis program. As a result, when the process of applying heat of the same condition to aluminum nitride was implemented by simulation, the silicon nitride exhibited superior impact resistance and stress resistance due to less stress and warping. In terms of thermal conductivity, aluminum nitride has superior properties as a heat dissipation material, but silicon nitride is more dominant in terms of reliability.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.42 no.9
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• pp.789-794
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• 2014

The FPGA is used to the high speed digital satellite communication on the Digital Signal Process Unit of the next generation GEO communication satellite. The high capacity FPGA has the high power dissipation and it is difficult to satisfy the derating requirement of temperature. This matter is the major factor to degrade the equipment life and reliability. The thermal control at the equipment level has been worked through thermal conduction in the space environment. The FPGA of CCGA or BGA package type was mounted on printed circuit board, but the PCB has low efficient to the thermal control. For the FPGA heat dissipation, the heat sink was applied between part lid and housing of equipment and the performance of heat sink was confirmed via thermal vacuum test under the condition of space qualification level. The FPGA of high power dissipation has been difficult to apply for space application, but FPGA with heat sink could be used to space application with the derating temperature margin.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.10
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• pp.1-8
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• 2014

Heat dissipation of the high power LED is a critical issue. To estimate the junction temperature of the LED chip is most important in characterizing the heat dissipation, but it is impossible to directly measure it. In this study, surface temperatures of the 12.8W LED bulb was measured for 5 points using a data logger and compared with the simulated results using a thermal simulator based on FVM (finite volume method) to secure a reliability of the simulation. Effects of some factors such as lens, emissivity and air inlet were investigated using simulation works and then the results were analysed.