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http://dx.doi.org/10.6117/kmeps.2018.25.4.089

Comparative Study on the Characteristics of Heat Dissipation using Silicon Carbide (SiC) Powder Semiconductor Module  

Jung, Cheong-Ha (Electronic Packaging Research Center, Kangnam University)
Seo, Won (Electronic Packaging Research Center, Kangnam University)
Kim, Gu-Sung (Electronic Packaging Research Center, Kangnam University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.25, no.4, 2018 , pp. 89-93 More about this Journal
Abstract
Ceramic substrates applied to power modules of electric vehicles are required to have properties of high thermal conductivity, high electrical insulation, low thermal expansion coefficient and resistance to abrupt temperature change due to high power applied by driving power. Aluminum nitride and silicon nitride, which are applied to heat dissipation, are considered as materials meeting their needs. Therefore, in this paper, the properties of aluminum nitride and silicon nitride as radiator plate materials were compared through a commercial analysis program. As a result, when the process of applying heat of the same condition to aluminum nitride was implemented by simulation, the silicon nitride exhibited superior impact resistance and stress resistance due to less stress and warping. In terms of thermal conductivity, aluminum nitride has superior properties as a heat dissipation material, but silicon nitride is more dominant in terms of reliability.
Keywords
Silicon Nitride; Aluminum Nitride; SiC Semiconductor;
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Times Cited By KSCI : 1  (Citation Analysis)
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1 Y. J. Park, J. W. Ko, J. M. Kim, J. W. Lee, and H. D. Kim, "High Thermal Conductivity Silicon Nitride Substrate Material for Power Devices(in Kor.)", CERAMIST, 15(5), 7 (2012).
2 J. Faltenbacher, and C. Gobl, "Low temperature sinter technology Die attachment for power electronic applications", Proc. 6th International Conference on Integrated Power Electronics Syste (CIPS), 1 (2010).
3 J. W. Yoon, J. H. Bang, Y. H. Ko, S. H. Yoo, J. K. Kim, and C. W. Lee, "Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications (in Kor.)", J. Microelectron. Packag. Soc., 21(4), 1 (2014).   DOI
4 K. Shinozaki, and A. Tsuge, "Characterization Techniques of Ceramics: Development of High Thermal Conductive Aluminum Nitride (in Japan)", Ceramics, 12, (1986).
5 K. I. Kim, S. C. Choi, K. S. Han, K. T. Hwang, and J. H. Kim, "Synthesis of high purity aluminum nitride nanopowder by RF induction thermal plasma(in Kor.)", Journal of the Korean Crystal Growth and Crystal Technology, 24(1), 1 (2014).   DOI
6 O. S. Jeon, G. Y. Jeun, S. Y. Park, K. H. Lee, and B. G. Kim, "Cost-effective Power Module Package using Leadframe and Ceramic substrate", Proc. 6th International Joint Symposium on Microeletronics and Packaging (ISMP), Seoul, 9 (2001).
7 K. Bai, S. K. Woo, I. S. Han, and D. W. Seo, "Fabrication of Silicon Nitride Ceramics by Gel-Casting and Microwave Gas Phase Reaction Sintering(I)", Journal of the Korean Ceramic Society, 48(5), 348 (2011).   DOI