Experimental Verification of Heat Sink for FPGA Thermal Control
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Park, Jin-Han
(Samsung Thales)
Kim, Hyeon-Soo (Samsung Thales) Ko, Hyun-Suk (Agency for Defense Development) Jin, Bong-Cheol (Agency for Defense Development) Seo, Hak-Keum (Agency for Defense Development) |
1 | Jin-Han Park, Hyeon-Seok Seo, Yeoung-Keun Jang, "A Study on Heat Load Mitigation for High Power Dissipation Equipment of KOMPSAT-2", KSAS Journal, No. 30, Vol. 3, pp. 77-88, 2002. |
2 | Michael Pecht, Handbook of Electronic Package Design, Marcel Dekker, Inc., New York, 1991. |
3 | ECSS-Q-ST-30-11, Derating-EEE components, ESA Requirements and Standards Division |
4 | Min-Young Kang, Jin-Han Park, Yeoung-Keun Jang, Hwa-Seok Oh "A Study on Thermal Modeling Method of Satellite Equipment", KSAS Journal, No. 29, Vol. 7, pp. 127-136, 2001. |
5 | Frank P. Incropera, David P. DeWitt, Fundamentals of Heat and Mass Transfer, John Wiley and sons, 1996 |
6 | UG520, Virtex-5QV FPGA Packaging and Pinout Specification, Xilinx Inc. |
7 | Technical Data & Information of DIS-APASTE 2310-PMF, Aptek Laboratories, Inc. |
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