• 한국전기전자재료학회논문지
• /
• 제13권6호
• /
• pp.472-477
• /
• 2000

Oxides of the form Mn$_{4}$/O$_{4}$-CuO-Co$_{3}$/O$_{4}$-NiO-ZnO present properties that make them useful as power NTC thermistor for current limited. Electrical properties of Mn$_{3}$/O$_{4}$-CuO-Co$_{3}$/O$_{4}$-CuO-Co$_{3}$/O$_{4}$-NiO-ZnO power NTC thermistor such as I-V characteristics tim constant activation energy and heat dissipation coefficient measured as a function of temperature and composition. In Mn$_{4}$/O$_{4}$-CuO-Co$_{3}$/O$_{4}$-NiO-ZnO system with the 5wt% addition of Co$_{3}$/O$_{4}$ it can be seen that resistivity and B-constant were increased as the ratio of ZnO/Mn$_{3}$/O$_{4}$ was increased. Heat dissipation constant, I-V characteristics and time constant showed similar behaviour compared with those of conventional thermistors. In particular resistance change ratio ($\Delta$R) the important factor for reliability varied within $\pm$5% indicating the compositions of these products could be available for power thermistor.

• E2M - 전기 전자와 첨단 소재
• /
• 제9권5호
• /
• pp.455-462
• /
• 1996

Automobile Fuel Shortage Detecting Sensor, in this paper, was fabricated by using heat dissipation coefficient difference between gasoline and air condition the NTC thermistor of Mn-Ni Co system with the composition ratio of Mn$_{3}$O$_{4}$ : 9wt%, NiO : 28wt%, and CO$_{3}$O$_{4}$ : 61wt%. The condition of sensor operation is that, for turn-on characteristics, the time of arriving at 135mA must be less than 180 second when the DC voltage of 11V is applied in the air condition of -10.deg. C and that, for turn-off characteristics, the saturation current must be less than 60mA when the DC voltage of 15V is applied in the gasoline condition of 60.deg. C. It is known, from the experimental results, that the resistance range and B-constant for the Automobile Fuel Shortage Detecting Sensor with dimension of 5*3*0.9mm were 850-1150.ohm. and 1150-1250.deg. C, respectively and the resistance range and B-constant were agree with that of sensor operation condition. When Bi$_{2}$O$_{3}$ of 0-0.5wt% was added to Mn$_{3}$O$_{4}$ : 9wt%, NiO : 28wt%, and CO$_{3}$O$_{4}$ : 61wt% composition, the resistivity and B-value were 380-430(.ohm.-cm) and 1930 - 2030, respectively. Particularly, for Bi$_{3}$O$_{3}$ of 0.25-0.5wt%, the sintering density of over 90% and the operation characteristics necessary to Automobile Fuel Shortage Detecting Sensor were obtained. The difference of heat dissipation coefficient gasoline and air condition was 15 times.

• 마이크로전자및패키징학회지
• /
• 제21권3호
• /
• pp.7-17
• /
• 2014

Power electronics modules are semiconductor components that are widely used in airplanes, trains, automobiles, and energy generation and conversion facilities. In particular, insulated gate bipolar transistors(IGBT) have been widely utilized in high power and fast switching applications for power management including power supplies, uninterruptible power systems, and AC/DC converters. In these days, IGBT are the predominant power semiconductors for high current applications in electrical and hybrid vehicles application. In these application environments, the physical conditions are often severe with strong electric currents, high voltage, high temperature, high humidity, and vibrations. Therefore, IGBT module packages involves a number of challenges for the design engineer in terms of reliability. Thermal and thermal-mechanical management are critical for power electronics modules. The failure mechanisms that limit the number of power cycles are caused by the coefficient of thermal expansion mismatch between the materials used in the IGBT modules. All interfaces in the module could be locations for potential failures. Therefore, a proper thermal design where the temperature does not exceed an allowable limit of the devices has been a key factor in developing IGBT modules. In this paper, we discussed the effects of various package materials on heat dissipation and thermal management, as well as recent technology of the new package materials.

• 한국표면공학회지
• /
• 제53권4호
• /
• pp.160-168
• /
• 2020

A polymer-based carbon nanomaterial composite was fabricated and characterized for the application of a thermal conductive adhesive. Low-dimensional carbon nanomaterials with excellent thermal conductivity such as carbon nanotube (CNT) and graphene were selected as a filler in the composite. Thermal, electrical and adhesive properties of the composite were investigated with respect to the morphology and content of the low-dimensional carbon nanomaterials. As a result, the composite-based adhesive fabricated by the loading of surface-treated MWCNTs of 0.4 wt% showed uniform dispersion, moderate adhesion and effective heat dissipation properties. Finally, it was confirmed through the thermal image analysis of LED module that the temperature reduction of 10℃ was achieved using the fabricated composite adhesive with MWCNT-6A. Expecially, heat dissipation performance of the optimized composite adhesive was evident at the hot spot in the module compared to other samples mixed with graphene or different MWCNT loading ratios.

• 설비공학논문집
• /
• 제20권3호
• /
• pp.213-219
• /
• 2008

Microscale heat transfer and microfluidics have become increasingly important to overcome some very complex engineering challenges. The use of very small passages to gain heat transfer enhancement is a well documented method for achieving high heat flux dissipation. In this study, the performance evaluation of micro-channel plated heat exchangers with straight, V-shaped and Y-shaped channels has been experimentally carried out under the counterflow condition. It is found that the mixing effect in V-shaped and Y-shaped channels enhances the heat transfer but pressure drop does not increase seriously in the range of low Reynolds number.

• 대한설비공학회:학술대회논문집
• /
• 대한설비공학회 2007년도 동계학술발표대회 논문집
• /
• pp.229-234
• /
• 2007

Microscale heat transfer and microfluidics have become increasingly important to overcome some very complex engineering challenges. The use of very small passages to gain heat transfer enhancement is a well documented method for achieving high heat flux dissipation. As the passage size is decreased, the heat transfer performance increases but the pressure drop increases sharply when the passage size is reduced. In this study, the performance evaluation of micro plated heat exchangers under the counter flows with straight, V-shaped and Y-shaped channel are carried out.

• Journal of Mechanical Science and Technology
• /
• 제20권1호
• /
• pp.158-166
• /
• 2006

Extended Graetz problem in microtube is analyzed by using eigenfunction expansion to solve the energy equation. For the eigenvalue problem we applied the shooting method and Galerkin method. The hydrodynamically isothermal developed flow is assumed to enter the microtube with uniform temperature or uniform heat flux boundary condition. The effects of velocity and temperature jump boundary condition on the microtube wall, axial conduction and viscous dissipation are included. From the temperature field obtained, the local Nusselt number distributions on the tube wall are obtained as the dimensionless parameters (Peclet number, Knudsen number, Brinkman number) vary. The fully developed Nusselt number for each boundary condition is obtained also in terms of these parameters.

• 설비공학논문집
• /
• 제18권11호
• /
• pp.874-880
• /
• 2006

The power density and heat dissipation rate per unit area of the telecommunication equipment have been increased with the technology development in the footprint of telecommunication hardware. A proper heat dissipation method from the PCB module is very important to allow reliable operation of its electronic component. In this study, a hybrid air-conditioner for the telecommunication equipment room was designed to save energy and obtain system reliability. For high outdoor temperatures, the hybrid system operates in the vapor compression cycle, while, for low outdoor temperatures, the hybrid system works in the secondary fluid cooling cycle with no operation of the compressor. The performance of the hybrid air-conditioner was measured by varying outdoor and indoor temperatures. The hybrid air-conditioner yielded 50% energy saving compared with the conventional refrigeration system when the mode switch temperature was $8.3^{\circ}C$.

• 마이크로전자및패키징학회지
• /
• 제17권4호
• /
• pp.95-100
• /
• 2010

LED (Light Emitting Diode)는 인가된 에너지 대비 15%가 빛으로, 나머지 85%가 열로 변환되는 것은 이미 잘 알려져 있다. 최근 LED칩 용량이 증가함에 따라서 LED칩으로부터 방출되는 열은 더욱 증가하게 되고 이는 LED 제품의 성능저하와 수명단축에 직접적인 영향을 미친다. 따라서, 산업계에서는 고출력 LED 칩에서 발생하는 열을 제어하기 위해 제품설계구조 연구가 진행 중에 있으며 또한, 부가적으로, 기존의 알루미늄, 접착제 및 구리를 사용하는 MCL(Metal Clad Laminate)구조에서 저가형 FR4 및 구리를 사용하는 CCL (Copper Clad Laminate)로 변경하여 원가절감을 하고자 하는 대체 소재연구가 진행되고 있다. 본 연구에서는 저가형 CCL에 열방출 극대화를 위하여 열비아(thermal via)를 디자인별로 형성한 후 1 W급 LED 칩을 실장하여 열저항(thermal resistance) 변화를 분석하였으며, 최적의 열방출을 위한 열비아 구조를 제안하고자 하였다.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2004년도 추계학술대회
• /
• pp.1046-1051
• /
• 2004

A plate-fin-tube heat exchanger used for a $SF_{6}$ gas-insulated transformer is extremely important since the dissipation of the heat generated from inside coils has a significant effect on the performance as well as the durability of the transformer. The heat exchanger consists of corrugated plate fins and staggered array tube bundles for coolant. In order to find out heat transfer and pressure drop characteristics, series of numerical analyses for plate fins with enhanced surface geometries were conducted. Based on the results of the numerical analyses, an improved model of the plate fin has been proposed.