Browse > Article

Experiments on Heat Transfer Characteristics and Pressure Drop in Micro-channel Plate Heat Exchangers with 3D shapes  

Seo, Jang-Won (Department of Mechanical Engineering, Korea University)
Lee, Kyu-Jung (Department of Mechanical Engineering, Korea University)
Kim, Yoon-Ho (Department of Mechanical Engineering, Korea University)
Moon, Chung-Eun (Department of Mechanical Engineering, Korea University)
Publication Information
Korean Journal of Air-Conditioning and Refrigeration Engineering / v.20, no.3, 2008 , pp. 213-219 More about this Journal
Abstract
Microscale heat transfer and microfluidics have become increasingly important to overcome some very complex engineering challenges. The use of very small passages to gain heat transfer enhancement is a well documented method for achieving high heat flux dissipation. In this study, the performance evaluation of micro-channel plated heat exchangers with straight, V-shaped and Y-shaped channels has been experimentally carried out under the counterflow condition. It is found that the mixing effect in V-shaped and Y-shaped channels enhances the heat transfer but pressure drop does not increase seriously in the range of low Reynolds number.
Keywords
Counterflow; Plate heat exchanger; Chevron angle; Microchannel; Heat transfer; Pressure drop;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Tuckerman, D. B., 1981, High performance heat sink for VLSI, IEEE Electron Device Letters EDL-2, pp. 126-129
2 Focke, W. W., 1986, Selecting optimum plate heat exchanger surface patterns, ASME J. Heat Transfer, Vol. 108, No. 1, pp. 153-160   DOI
3 Yang, N. H., 2004, An experimental study on heat transfer characteristics and pressure drop in micro channel plate heat exchangers with the channel shape, MS thesis, Korea University, Seoul, Korea
4 Ngo, T. L., 2006, New printed circuit heat exchanger with S-shaped fins for hot water supplier, Experimental Thermal and Fluid Science, Vol. 30, No. 8, pp. 811-819   DOI   ScienceOn
5 Mark. S., 2005, Single-phase liquid flow and heat transfer in plain and enhanced silicon microchannels, Ph.D. thesis, Rochester Institute of technology, Minneapolis, MN, U.S.A.
6 Gromoll, B., 1998, Micro cooling systems for high density packaging, Rev. Gen. Therm, Vol. 37, No. 9, pp. 781-787   DOI   ScienceOn
7 Lee, K. S., 2001, Optimal shape and arrangement of staggered pins in the channel of a plate heat exchanger, Heat and mass transfer, Vol. 44, No. 17. pp. 3223-3231   DOI   ScienceOn