Performance Characteristics of a Hybrid Air-Conditioner for Telecommunication Equipment Rooms |
Kim, Yong-Chan
(Department of Mechanical Engineering, Korea University)
Choi, Jong-Min (Department of Mechanical Engineering, Hanbat National University) Kang, Hoon (IFTP, Hanbat National University) Yoon, Joon-Sang (Graduate School of Mechanical Engineering, Hanbat National University) Kim, Young-Bae (Graduate School of Mechanical Engineering, Korea University) Choi, Kwang-Min (Graduate School of Mechanical Engineering, Korea University) Lee, Ho-Seong (Graduate School of Mechanical Engineering, Korea University) |
1 | Schmidt, R R and Shaukatullah, H., 2003, Computer and telecommunications equipment room cooling, A review of literature, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No.1, pp.89-98 DOI ScienceOn |
2 | Cinato, P., Bianco, c. Licciardi, L., Pizzuti, F., Antonetti, M. and Grossoni, M., 1998, INTELEC, pp.770-776 |
3 | ANSI, 1985, Laboratory methods of testing fans for rating, ANSI/AMCA 210, Arington (VA) |
4 | Yun, R, Kim, Y. C., Kim,. H., Choi, J, M. and Cheon, D. K, 2006, Optimum design of liquid cooling. heat exchangers and cooling-fluid distributors for a amplifier of telecommunication' equipment, Korean Journal of Air-Conditioning and Refrigeration Engineering, Vol. 18, No.1, pp.24-30 과학기술학회마을 |
5 | Noh, H. K, Song, K S. and Chun, S. K, 1998, The cooling characteristics on the air supply and return flow system in the telecommunication cabinet room, INTELEC, pp.777-784 |
6 | Hayana, H. and Nakao, M., 1989, Cooling data and dot-coms, Consulting-Specifying Engineering, Vol. 29, No.1, pp.28-36 |
7 | Baer, D. B., 2001, Emerging cooling requirements & systems in telecommunications spaces, INTELEC, pp. 95-100 |
8 | Kim, W. T., Song, K S. and Lee, Y, 1998, Design of a two-phase loop thermosyphone for telecommunication system(ll), KSME International Journal, Vol. 12, pp.942-955 DOI |
9 | Kim, W. T. and Kim, K. S., 1996, Forced convective cooling characteristics with stacked modules of multi-PCB's in telecommunication cabinet, Korean Journal of Air-Conditioning and Refrigeration Engineering, Vol. 8, No.2, pp. 230-239 |
10 | Ha, S.J., Kim, T. H., Yang, T.J. and Kim, J. S., 2004, Development : of cooling system for electronic 'devices using oscillating capillary tube heat pipe, Proceedings of the SAREK, pp.869-874 |
11 | Lee, H., Jeong, Y, Shin, J' Kang, M. and Chun, K, 2004, Package embedded heat exchanger for stacked multi-chip module, Sensors and actuators, Vol. 114, pp.204-211 DOI ScienceOn |
12 | ASHRAE, 1983, Methods of testing. for seasonal efficiency of unitary air-conditioners and heat pumps, ASHRAE Standard 116, Atlanta (GA) |