• JSTS:Journal of Semiconductor Technology and Science
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• 제11권2호
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• pp.80-87
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• 2011

Low temperature hole transport characteristics of gate-all-around p-channel metal oxide semiconductor (PMOS) type silicon nanowire field-effect-transistors with the radius of 5 nm and lengths of 44-46 nm are presented. They show coexisting two single hole states randomly switching between each other. Analysis of Coulomb diamonds of these two switching states reveals a variety of electrostatic effects which is originated by the potential of a single hole captured in the trap near the nanowire.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.303.1-303.1
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• 2014

좋은 전기적 특성을 가지면서 소자의 크기를 줄이기에 용이한 Gate-all-around (GAA) twin Si nanowire field-effect transistors (TSNWFETs)의 연구가 많이 진행되고 있다. Switching 특성과 단채널 효과가 없는 TSNWFETs의 특성은 GAA 구조의 본질적인 특성이다. TSNWFETs는 기존의 single Si nanowire TSNWFETs와 bulk FET에 비하여 Drive current가 nanowire의 지름에 많은 영향을 받지 않는다. 그러나 TSNWFETs의 전체 on-current는 훨씬 작고 nanowire의 지름이 작아지면서 줄어들게 되면서 소자의 sensing speed와 sensing margin 특성의 악화를 가지고 온다. GAA TSNWFETs의 제작 및 전기적 실험에 대한 연구는 많이 진행되었으나, GAA TSNWFETs의 전기적 특성에 대한 이론적 연구는 매우 적다. 본 연구에서는 GAA TSNWFETs의 nanowire 크기에 따른 전기적 특성을 관찰하였다. GAA TSNWFETs와 bulk FET의 전기적 특성을 양자역학을 고려하여 3차원 TCAD 시뮬레이션을 툴을 이용하여 계산하였다. GAA TSNWFETs와 bulk FET의 전류-전압 특성 계산을 통해 on-current 크기, subthreshold swing, drain-induced barrier lowering (DIBL), gate-induced drain leakage를 보았다. 전류가 흐르는 경로와 전기적 특성의 물리적 의미에 대한 연구를 위해 TSNWFETs에서의 전류 밀도, conduction band edge, potential 특성을 분석하였다. 시뮬레이션 결과를 통해 Switching 특성, 단채널 효과에 대한 면역 특성, nanowire의 단면적에 따른 전류 흐름을 보았다. nanowire의 크기가 작아지면서 DIBL이 증가하고 문턱전압과 전체 on-current는 감소하면서 소자의 특성이 악화된다. 이러한 결과는 GAA TSNWFETs의 전기적 특성을 이해하고 좋은 소자 특성을 위한 구조를 연구하는데 많은 도움이 될 것이다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 하계종합학술대회 논문집(2)
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• pp.5-8
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• 2002

Hot carrier induced device degradation is observed in thin-film, gate-all-around SOI transistor under DC stress conductions. We observed the more significant device degradation in GAA device than general single gate SOI device due to the degradation of edge transistor. Therefore, it is expected that the maximum available supply voltage of GAA transistor is lower than that o( bulk MOSFET or single gale SOI device.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.181-184
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• 2001

Chemical Mechanical Polishing(CMP) of Shallow Trench Isolation(STD structure in 0.18 m semiconductor device fabrication is studied. CMP process is applied for the STI structure with and without reverse moat pattern and End Point Detection (EPD) method is tested. To optimize the transistor properties related metal 1 parameters. we studied the correlation between CMP thickness of STI using high selectivity slurry. DOE of gate etch recipe, and 1st metal DC values. Remaining thickness of STI CMP is proportional to the thickness of gate-etch process and this can affect to gate profile. As CMP thickness increased. the N-poly foot is deteriorated. and the P-Poly Noth is getting better. If CD (Critical Dimension) value is fixed at some point,, all IDSN/P values are in inverse proportional to CMP thickness by reason of so called Profile Effect. Weve found out this phenomenon in all around DOE conditions of Gate etch process and we also could understand that it would not have any correlation effects between VT and CMP thickness in the range of POE 120 sec conditions. As CMP thickness increased by $100\AA$. 3.2 $u\AA$ of IDSN is getting better in base 1 condition. In POE 50% condition. 1.7 $u\AA$ is improved. and 0.7 $u\AA$ is improved in step 2 condition. Wed like to set the control target of CD (critical dimension) in gate etch process which can affect Idsat, VT property versus STI topology decided by CMP thickness. We also would like to decide optimized thickness target of STI CMP throughout property comparison between conventional STI CMP with reverse moat process and newly introduced STI CMP using high selectivity slurry. And we studied the process conditions to reduce Gate Profile Skew of which source known as STI topology by evaluation of gate etch recipe versus STI CMP thickness.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.181-184
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• 2001

Chemical Mechanical Polishing(CMP) of Shallow Trench Isolation(STI) structure in 0.18 m semiconductor device fabrication is studied. CMP process is applied for the STI structure with and without reverse moat pattern and End Point Detection (EPD) method is tested. To optimize the transistor properties related metal 1 parameters, we studied the correlation between CMP thickness of STI using high selectivity slurry, DOE of gate etch recipe, and 1st metal DC values. Remaining thickness of STI CMP is proportional to the thickness of gate-etch process and this can affect to gate profile. As CMP thickness increased, the N-poly foot is deteriorated, and the P-Poly Noth is getting better. If CD (Critical Dimension) value is fixed at some point, all IDSN/P values are in inverse proportional to CMP thickness by reason of so called Profile Effect. Weve found out this phenomenon in all around DOE conditions of Gate etch process and we also could understand that it would not have any correlation effects between VT and CMP thickness in the range of POE 120 sec conditions. As CMP thickness increased by 100 ${\AA}$, 3.2 u${\AA}$ of IDSN is getting better in base 1 condition. In POE 50% condition, 1.7 u${\AA}$ is improved, and 0.7 u${\AA}$ is improved in step 2 condition. Wed like to set the control target of CD (critical dimension) in gate etch process which can affect Idsat, VT property versus STI topology decided by CMP thickness. We also would like to decide optimized thickness target of STI CMP throughout property comparison between conventional STI CMP with reverse moat process and newly introduced STI CMP using high selectivity slurry. And we studied the process conditions to reduce Gate Profile Skew of which source known as STI topology by evaluation of gate etch recipe versus STI CMP thickness.

• 한국조경학회지
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• 제27권1호
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• pp.110-121
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• 1999

The purpose of this study is to focus on the characteristics of the form and preference of the main gates of universities. The gate of a university have both functions and artistic design aspects. Fifty-two universities selected for this study were placed all around country except for Je-ju island. The following two research methods were used for this study. 1) an analysis of form character through a classification of the types. 2) and analysis of preference to the gates through a side show. The results are summarized as follows: 1. Main gates of universities were classified by covered-type and uncovered-type in existence of cover. And they were classified by eighteen types in detail. 2. Visual preference have been analyed by using the regression, the result is as follows: Y=-0.357+0.630 X$_4$+0.377X$_1$+0.075X$_2$-0.015X$_3$($R^2$=0.971, X$_4$;harmony, X $_1$;speciality, X$_2$;softness, X$_3$;complex) 3. The gate of Chung-Ang university(Ahn Sung campus) is the highest of all the universities at the average of preference 4.32 through result of slide show. Covered type has a higher preference than uncovered type. This has a good modification and decoration in front side type of main gate.

• JSTS:Journal of Semiconductor Technology and Science
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• 제17권2호
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• pp.230-238
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• 2017

We have proposed an InGaAs-based gate-all-around (GAA) tunneling field-effect transistor (TFET) with a stacked dual-metal gate (DMG). The electrical performances of the proposed TFET are evaluated through technology computer-aided design (TCAD) simulations. The simulation results show that the proposed TFET demonstrates improved DC performances including high on-state current ($I_{on}$) and steep subthreshold swing (S), in comparison with a single-metal gate (SMG) TFET with higher gate metal workfunction, as it has a thinner source-channel tunneling barrier width by low workfunction of source-side channel gate. The effects of the gate workfunction on $I_{on}$, the off-state current ($I_{off}$), and S in the DMG-TFETs are examined. The DMG-TFETs with PNPN structure demonstrate outstanding DC performances and RF characteristics with a higher n-type doping concentration in the $In_{0.8}Ga_{0.2}As$ source-side channel region.

• JSTS:Journal of Semiconductor Technology and Science
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• 제16권5호
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• pp.630-634
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• 2016

We report the computer aided design results for a GaSb/InAs broken-gap gate all around nanowire tunneling FET (TFET). In designing, the semi-empirical tight-binding (TB) method using $sp3d5s^*$ is used as band structure model to produce the bulk properties. The calculated band structure is cooperated with open boundary conditions (OBCs) and a three-dimensional $Schr{\ddot{o}}dinger$-Poisson solver to execute quantum transport simulators. We find an device configuration for the operation voltage of 0.3 V which exhibit desired low sub-threshold swing (< 60 mV/dec) by adopting receded gate configuration while maintaining the high current characteristic ($I_{ON}$ > $100 {\mu}A/{\mu}m$) that broken-gap TFETs normally have.

• EDISON SW 활용 경진대회 논문집
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• 제5회(2016년)
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• pp.295-298
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• 2016

Future logic device over the FinFET generation requires a complete electrostatics and transport characteristic for low-power and high-speed operation as extremely scaled devices. Silicon, Germanium and III-V based nanowire-based MOSFET devices and few-layer TMDC (Transition metal dichalcogenide monolayers) based multi-gate devices have been brought attention from device engineers due to those excellent electrostatic and novel device characteristic. In this study, we simulated ultrascaled Si/Ge/InAs gate-all-around nanowire MOSFET and MoS2 TMDC based DG MOSFET and TFET device by tight-binding NEGF method. As a result, we can find promising candidates of the future logic device of each channel material and device structures.

• 한국정보통신학회논문지
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• 제20권4호
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• pp.793-798
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• 2016

본 연구에서는 1T-DRAM 응용을 위해 Bipolar Junction Transistor 모드 (BJT mode)에서 비대칭 소스/드레인 수직형 나노와이어 소자의 순방향 및 역방향 메모리 윈도우 특성을 분석하였다. 사용된 소자는 드레인 농도가 소스 농도보다 높으며 소스 면적이 드레인 면적보다 큰 사다리꼴의 수직형 gate-all-around (GAA) MOSFET 이다. BJT모드의 순방향 및 역방향 이력곡선 특성으로부터 순방향의 메모리 윈도우는 1.08V이고 역방향의 메모리 윈도우는 0.16V이었다. 또 래치-업 포인트는 순방향이 역방향보다 0.34V 큰 것을 알 수 있었다. 측정 결과를 검증하기 위해 소자 시뮬레이션을 수행하였으며 시뮬레이션 결과는 측정 결과와 일치하는 것을 알 수 있었다. 1T-DRAM에서 BJT 모드를 이용하여 쓰기 동작을 할 때는 드레인 농도가 높은 것이 바람직함을 알 수 있었다.