• 한국재료학회지
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• 제21권5호
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• pp.268-272
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• 2011

Due to their novel properties, GaN based semiconductors and their nanostructures are promising components in a wide range of nanoscale device applications. In this work, the gallium nitride is deposited on c-axis oriented sapphire and porous SWCNT substrates by molecular beam epitaxy using a novel single source precursor of $Me_2Ga(N_3)NH_2C(CH_3)_3$ with ammonia as an additional source of nitrogen. The advantage of using a single molecular precursor is possible deposition at low substrate temperature with good crystal quality. The deposition is carried out in a substrate temperature range of 600-750$^{\circ}C$. The microstructural, structural, and optical properties of the samples were analyzed by scanning electron microscopy, X-ray diffraction, Raman spectroscopy, and photoluminescence. The results show that substrate oriented columnar-like morphology is obtained on the sapphire substrate while sword-like GaN nanorods are obtained on porous SWCNT substrates with rough facets. The crystallinity and surface morphology of the deposited GaN were influenced significantly by deposition temperature and the nature of the substrate used. The growth mechanism of GaN on sapphire as well as porous SWCNT substrates is discussed briefly.

• Nuclear Engineering and Technology
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• 제52권7호
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• pp.1537-1544
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• 2020

Molecular dynamics (MD) simulations were conducted to investigate the temperature effects on the primary damage in gallium nitride (GaN) material. Five temperatures ranging from 300 K to 900 K were studied for 10 keV Ga primary knock-on atom (PKA) with inject direction of [0001]. The results of MD simulations showed that threshold displacement energy (E_d) was affected by temperatures and at higher temperature, it was larger. The evolutions of defects under various temperatures were similar. However, the higher temperature was found to increase the peak number, peak time, final time and recombination efficiency while decreasing the final number. With regard to clusters, isolated point defects and little clusters were common clusters and the fraction of point defects increased with temperature for vacancy clusters, whereas it did not appear in the interstitial clusters. Finally, at each temperature, the number of Ga interstitial atoms was larger than that of N and besides that, there were other different results of specific types of split interstitial atoms.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 하계종합학술대회 논문집(2)
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• pp.217-220
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• 2001

Modified Materka-Kacprzak 대신호 MODFET(modulation-doped field-effect transistor) model을 사용하여 GaN(gallium nitride) MODFET 대신호 모델링을 수행하였다. Dambrine(3)이 제안한 방법에 따라 45㎒에서 40㎒의 주파수 범위에 걸쳐 S-parameter 및 DC특성을 측정하였으며, 측정결과를 토대로 cold FET 방법［4］에 의해 측정된 기생성분들을 de-embedding 함으로써 소신호 파라미터를 추출하였고, 추출된 소신호 파라미터는 함수를 사용하여 측정결과를 재현하는 맞춤함수 모델의 일종인 modified Materka 모델을 사용하여 모델링하였다. 수행된 대신호 모델링을 검증하기 위하여 모델링된 GaN MODFET의 DC 및 S-파라미터, 전력특성을 측정값과 각각 비교해 보았을 때 비교적 일치하고 있음을 보여서 GaN 대신호 모델링을 검증하였으며, modified Materka 모델이 GaN MODFET 대신호 모델링에 유용하게 사용될 수 있음을 보였다.

• 한국ITS학회 논문지
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• 제10권5호
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• pp.71-78
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• 2011

본 논문은 GaN HEMT (Gallium Nitride High Electron Mobility Transistor)를 이용하여 Class-J 모드를 적용한 고효율, 광대역 특성을 갖는 전력증폭기를 설계 및 제작하였다. 제안된 Class-J 모드 전력증폭기의 정합회로는 2차 고조파 임피던스가 리액턴스 성분만 갖도록 하였으며, 1.4 ~ 2.6 GHz 주파수대역내에서 연속파 (CW) 신호를 사용하여 $40{\pm}1$ dBm의 출력 전력과 50 % 이상의 전력부가효율 (Power-Added Efficiency, PAE) 및 60 % 이상의 드레인 효율 (Drain Efficiency, DE)이 측정되었다.

• Journal of Electrical Engineering and Technology
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• 제10권3호
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• pp.1131-1137
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• 2015

Gallium nitride (GaN) is a promising material for next-generation high-power applications due to its wide bandgap, high breakdown field, high electron mobility, and good thermal conductivity. From a structure point of view, the vertical device is more suitable to high-power applications than planar devices because of its area effectiveness. However, it is challenging to obtain a completely upright vertical structure due to inevitable sidewall slope in anisotropic etching of GaN. In this letter, we design and analyze the enhancement-mode n-channel vertical GaN MOSFET with variation of sidewall gate angle by two-dimensional (2D) technology computer-aided design (TCAD) simulations. As the sidewall slope gets closer to right angle, the device performances are improved since a gradual slope provides a leakage current path through the bulk region.

• 한국전자파학회논문지
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• 제26권6호
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• pp.540-545
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• 2015

본 논문은 GaN(Gallium Nitride) HEMT(High Electron Mobility Transistor) die를 이용하여 S-대역 내부 정합형 전력 증폭기 설계, 제작 그리고 실험 결과에 대해 기술하였다. S-대역 내부 정합형 전력 증폭기를 설계하기 위하여 고유전율을 가지는 기판과 알루미나 기판을 이용하여 입/출력단 정합 회로를 설계 및 제작하였다. 측정 결과로는 펄스 모드로 동작시켰을 때 3 GHz에서 55.4 dBm의 출력 전력, 78 % 드레인 효율 그리고 11 dB의 전력 이득을 얻었다.

• 전력전자학회논문지
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• 제19권3호
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• pp.283-289
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• 2014

This paper carries out a series of analysis of power system using Gallium Nitride (GaN) FET which has wide band gap (WBG) characteristics comparing to conventional Si MOSFET-used power system. At first, for comparison of each semiconductor device, the switching-transient parameter is quantitatively extracted from released information of GaN FET. And GaN FET model which reflect this dynamic property is configured. By using this model, the performance of GaN FET is analyzed comparing to Si MOSFET. Also, in order to enable a representative assessment on the power system level, Si MOSFET and GaN FET are applied to the most common structure of power system, full-bridge, and each power systems are compared based on various criteria, such as performance, efficiency and power density. The entire process is verified with the aid of mathematical analysis and simulation.

• Journal of Power Electronics
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• 제18권6호
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• pp.1912-1919
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• 2018

The output capacitance of power semiconductor devices is important in determining the switching losses and in the operation of some resonant converter topologies. Thus, it is important to be able to accurately determine the output capacitance of a particular device operating at elevated power levels so that the contribution of the output capacitance discharge to switch-on losses can be determined under these conditions. Power semiconductor switch manufacturers usually measure device output capacitance using small-signal methods that may be insufficient for power switching applications. This paper shows how first principle methods are applied in a novel way to obtain more relevant large signal output capacitances of Gallium-Nitride (GaN) FETs using the drain-source voltage transient during device switch-off numerically. A non-linear capacitance for an increase in voltage is determined with good correlation. Simulations are verified using experimental results from two different devices. It is shown that the large signal output capacitance as a function of the drain-source voltage is higher than the small signal values published in the data sheets for each of the devices. It can also be seen that the loss contribution of the output capacitance discharging in the channel during switch-on correlates well with other methods proposed in the literature, which confirms that the proposed method has merit.

• 전자통신동향분석
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• 제33권6호
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• pp.12-23
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• 2018

In this paper, we review the technical trends of diamond and gallium oxide ($Ga_2O_3$) semiconductor technologies among ultra-wide bandgap semiconductor technologies for harsh environments. Diamond exhibits some of the most extreme physical properties such as a wide bandgap, high breakdown field, high electron mobility, and high thermal conductivity, yet its practical use in harsh environments has been limited owing to its scarcity, expense, and small-sized substrate. In addition, the difficulty of n-type doping through ion implantation into diamond is an obstacle to the normally-off operation of transistors. $Ga_2O_3$ also has material properties such as a wide bandgap, high breakdown field, and high working temperature superior to that of silicon, gallium arsenide, gallium nitride, silicon carbide, and so on. In addition, $Ga_2O_3$ bulk crystal growth has developed dramatically. Although the bulk growth is still relatively immature, a 2-inch substrate can already be purchased, whereas 4- and 6-inch substrates are currently under development. Owing to the rapid development of $Ga_2O_3$ bulk and epitaxy growth, device results have quickly followed. We look briefly into diamond and $Ga_2O_3$ semiconductor devices and epitaxy results that can be applied to harsh environments.

• 한국산학기술학회논문지
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• 제12권5호
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• pp.2241-2248
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• 2011

본 논문에서는 고출력 및 고효율 특성을 지니는 질화갈륨(gallium nitride, GaN) 고출력 트랜지스터 소자를 이용하여 WiMAX 및 LTE(long term evolution) 시스템에 사용 가능한 60watt급 고출력증폭기 모듈을 팔렛트(palette) 타입으로 개발한 결과에 대하여 기술한다. 높은 이득을 얻기 위한 라인업(lineup) 구성을 위해 저전력이면서 고이득을 지니는 전치증폭단, 8watt급의 GaN 구동증폭단, 그리고 30watt급 GaN 소자 2개를 도허티(doherty) 구조로 구성한 60watt 고출력증폭단을 사용하였으며, 이로부터 2.5~2.68GHz에서 61.4dB의 이득과 ${\pm}$0.075dB의 우수한 이득 평탄도를 얻었다. 특히 구동단과 고출력증폭단은 고효율 및 고출력 특성의 GaN 소자를 사용하였고, 또한 추가적인 효율 개선을 위해 도허티 구조를 적용함으로써 보다 높은 효율을 가지도록 하였다. 현재 전 세계적으로 널리 사용되고 있는 WiMAX 신호를 사용하여 제작된 팔렛트 타입의 증폭기 모듈의 성능을 측정하였는데, RRH(remote radio head) 타입으로 구성된 사용 예에서 WiMAX 변조 신호 10watt 출력 기준으로 약 37~38%의 효율을 나타내었다. 제작된 증폭기 모듈을 디지털 전치왜곡기(digital predistorter, DPD)와 연동하여 시험한 결과 WiMAX 변조 신호 10watt 출력에서 ACLR은 46dBc 이상의 특성을 지닌다.