• Journal of Power Electronics
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• v.18 no.4
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• pp.985-996
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• 2018

The implementation and performance evaluation of an interleaved boundary conduction mode (BCM) boost power factor correction (PFC) converter is presented in this paper by employing three wide band-gap switching devices: a super junction silicon (Si) MOSFET, a silicon carbide (SiC) MOSFET and a gallium nitride (GaN) high electron mobility transistor (HEMT). The practical considerations for adopting wide band-gap switching devices to BCM boost PFC converters are also addressed. These considerations include the gate drive circuit design and the PCB layout technique for the reliable and efficient operation of a GaN HEMT. In this paper it will be shown that the GaN HEMT exhibits the superior switching characteristics and pronounces its merits at high-frequency operations. The efficiency improvement with the GaN HEMT and its application potentials for high power density/low profile BCM boost PFC converters are demonstrated.

• Transactions on Electrical and Electronic Materials
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• v.12 no.5
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• pp.204-208
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• 2011

In this paper, the design area of a fabricated solar cell has been analyzed with respect to its charge density. The mathematical calculation used for charge-density derivation was obtained from the 2001 version of a MATHCAD program. The parameter range for the calculations was ${\pm}1{\times}10^{17}cm^{-3}$, which is in the normal parameter range for n-type doping impurities ($7.0{\times}10^{17}cm^{-3}$) and also for p-type impurities ($4.0{\times}10^{17}cm^{-3}$). Therefore, it can be said that the fabricated solar-cell design area has a direct effect on charge-density changes.

• Proceedings of the KIEE Conference
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• 1992.07b
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• pp.839-842
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• 1992

This paper describes an improved analytic model for a gallium-arsenide MESFET computer simmulation and deals with application to microwave performance. The current-voltage characteristics, the dependence of the capacitances, transconductances and drainconductances on bias conditions and the dependences of s-parameters on various frequencies are calculated. The model is base on a physical picture revealed through two-dimensional numerical analysis, and takes into account transition region and diffusion process under gate but it require a very small computer time. Simulation results agree well with the experimental data found earlier by other author The proposed model can be used for a computer-aided design of GaAs MESFET devices and for a study of application to microwave performance.

• Journal of the Korean Society of Combustion
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• v.10 no.3
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• pp.17-24
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• 2005

A sub-millimeter scale catalytic combustor with a simple plate-shaped combustion chamber was fabricated. A porous ceramics support coated with platinum catalyst was placed in the chamber. The combustor has a gallium arsenide window on the top that is transparent to infrared ray. The temperature distribution in the combustion chamber was measured using infrared thermal imager while hydrogen-air premixture is steadily supplied to the combustor. The area where the catalytic reaction took place broaden for higher flow rate and lower equivalence ratio made activated area in the combustion chamber broaden. The amount of coated platinum catalyst did not affect the reaction. Stop of reaction, which is similar to flame quenching of conventional combustion, was investigated. Large content of heat generation and broad activated area are essential criteria to prevent stop of reaction that has a bad effect on the combustor performance.

• Journal of Energy Engineering
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• v.22 no.1
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• pp.58-81
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• 2013

Recently, the technological progress in manufacturing power devices based on wide bandgap materials, for example, silicon carbide(SiC) or gallium nitride(GaN), has resulted in a significant improvement of the operating-voltage range and switching speed and/or specific on resistance compared with silicon power devices. This paper will give an overview of the status on The Next generation Power Devices such as SiC/GaN with a focus on commercialization and research.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.04a
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• pp.180-182
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• 1997

GaN crystals were deposited by tile direct reaction between ammonia and gallium at 105$0^{\circ}C$, 107$0^{\circ}C$ and 110$0^{\circ}C$ on (0001) plane sapphire substrate. The size of GaN crystals were increased with reaction temperature, but its were decreased with increasing the flow rates of NH$_3$. The size of GaN of 46${\mu}{\textrm}{m}$ were deposited ell sapphire substrate at the reaction temperature of 107$0^{\circ}C$ for growth time of 60 min.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.851-854
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• 2001

Europium-activated Ga$_2$O$_3$powders were prepared by modified "Pechini method" from mixed aqueous solutions of gallium nitrate, europium nitrate, ethylene glycol and citric acid. The formation process and structure of the phosphor powders were investigated by means of TG/DTA, XRD and SEM. It has been found that the phosphor powders were amorphous up to 50$0^{\circ}C$ and changed into crystalline $\beta$-Ga$_2$O$_3$phase above $600^{\circ}C$. The resulting nano-sized powders were obtained. Red luminescence in emission spectra were observed at room temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.305-306
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• 2006

Ga-doped and Al-doped ZnO thin films were fabricated via a sol-gel technique and electrical and optical properties of the films were investigated. Film deposition was performed by spin coating at 4000 rpm for 30 s on $SiO_2$ glass substrate FE-SEM was used to obtain the surface morphology images and the film thickness Four-point probe and UV-VIS spectrophotometer were used to measure the sheet resistance and the optical transparency, respectively.

• Electronics and Telecommunications Trends
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• v.29 no.6
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• pp.1-13
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• 2014

GaN(Gallium Nitride)는 3.4eV의 넓은 에너지 갭으로 인하여 고전압에서 동작이 가능하고, 분극전하를 이용한 캐리어 농도가 높아 높은 전류밀도와 전력밀도를 얻을 수 있으며, 높은 전자 이동도와 포화 속도로부터 고속 동작이 가능하여 고주파 고출력 고효율 소형의 전력증폭기 소자의 재료로 적합하다. 본고에서는 민수 및 군수 겸용 Ku-대역 및 Ka-대역 GaN 고출력 전력증폭기(SSPA: Solid-State Power Amplifier)와 관련된 GaN 전력증폭 소자, GaN 전력증폭기 MMIC(Microwave Monolithic Integrated Circuit), 내부정합 패키지형 GaN 전력증폭기 및 GaN SSPA에 대하여, 국내외 특허 기술동향과 연구개발 기술동향을 중심으로 고찰하고자 한다. 국외의 GaN 고주파 고출력 전력증폭기 기술의 연구동향이나 특허동향을 심층분석하여 연구개발에 활용하고자 한다.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.8
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• pp.959-965
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• 1988

Zinc diffusion characteristics and its applicabilities have been studied using an open-tube system. Thermal decomposition of arsenide(As) at gallium arsenide(GaAs) wafer surface was well inhibited by using Ga: poly-GaAs: Zn compositon as a diffusion source. Junction depth was obtained as 4.6x10**7\ulcorner exp)-1.25/kT) where activation energy of diffusion was 1.25eV. From Boltzmann-matano analysis, it could be identified that concentration dependencies of Zn diffusivity well consisted with those of kick-out model. The ideality factor of p+-n junction formed by Zn diffusion was about 1.6 and infrared light intensity was linearly varied in the range of sixty folds. It is concluded frodm these results that Zn diffuses according to kick-out model, and open-tube method is applicable to compound semiconductor devices.