• Journal of information and communication convergence engineering
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• v.13 no.3
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• pp.180-188
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• 2015

As a potential alternative to the complementary metal-oxide semiconductor (CMOS) technology, many researchers are focusing on carbon-nanotube field-effect transistors (CNFETs) for future electronics. However, existing studies report the advantages of CNFETs over CMOS at the device level by using small-scale circuits, or over outdated CMOS technology. In this paper, we propose a methodology of analyzing CNFET-based circuits and study its impact at the full-chip scale. First, we design CNFET standard cells and use them to construct large-scale designs. Second, we perform parasitic extraction of CNFET devices and characterize their timing and power behaviors. Then, we perform a full-chip analysis and show the benefits of CNFET over CMOS in 45-nm and 20-nm designs. Our full-chip study shows that in the 45-nm design, CNFET circuits achieve a 5.91×/3.87× (delay/power) benefit over CMOS circuits at a density of 200 CNTs/µm. In the 20-nm design, CNFET achieves a 6.44×/3.01× (delay/power) benefit over CMOS at a density of 200 CNTs/µm.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.7
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• pp.131-137
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• 2016

In this paper, we analyze the impedance analysis of vertical interconnection through-silicon vias (TSV) that is being studied for the purpose of improving the degree of integration and an electric feature in 3D IC. Also, it is to improve the performance and the degree of integration of the three-dimensional integrated circuit system which can exceed the limits of conventional two-dimensional a IC. In the future, TSV technology in full-chip 3-dimensional integrated circuit system design is very important, and a study on the electrical characteristics of the TSV for high-density and high-bandwidth system design is very important. Therefore, we study analyze the impedance influence of the TSV in accordance with the distance and frequency in a multiple TSV-to-TSV for the purpose of designing a full-chip three-dimensional IC. The results of this study also are applicable to semiconductor process tools and designed for the manufacture of a full-chip 3D IC.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.249-250
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• 2008

In this paper, we propose the single polycrystalline silicon flash EEPROM IC with a new structure which does not need the high voltage switching circuit. The design of high voltage switching circuits which are needed for the data program and erase, has been an obstacle to develop the single-poly EEPROM. Therefore, we has proposed the new cell structure which uses the low voltage switching circuits and has designed the full chip. A new single-poly EEPROM cell is designed and the full chip including the control block, the analog block, row decoder block, and the datapath block is designed. And the each block is verified by using the computer simulation. In addition, the full chip layout is performed.

• Journal of IKEEE
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• v.25 no.3
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• pp.517-527
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• 2021

This paper presents the phase-shift full-bridge DC-DC converter using the one-chip micom. The proposed converter primary is the full-bridge power topology that operates with the unipolar pulse-width modulation (PWM) by the phase-shift method, and the secondary is the full-bridge full-wave rectifier composed of four diodes. The control of proposed converter is performed by the one-chip micom and its MOSFET switches are driven by the bootstrap circuit. Thus the total system of proposed converter is simple. The proposed converter achieves high-efficiency using the resonant circuit and blocking capacitor. In this paper, first, the power-circuit operation of proposed converter is explained according to each operation mode. And the power-circuit design method of proposed converter is shown, and the software control algorithm on the micom and the feedback and switch drive circuits operating the proposed converter are described, briefly. Then, the operation characteristics of proposed converter are validated through the experimental results of a designed and implemented prototype converter by the shown design and implementation method in this paper. The highest efficiency in the results was about 92%.

• ETRI Journal
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• v.38 no.6
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• pp.1240-1249
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• 2016

With the number of IP cores in a multicore system-on-chip increasing to up to tens or hundreds, the role of on-chip interconnection networks is vital. We propose a networks-on-chip-style bus network as a compromise and redefine the exploration problem to find the best IP tiling patterns and communication path combinations. Before solving the problem, we estimate the time complexity and validate the infeasibility of the solution. To reduce the time complexity, we propose two fast exploration algorithms and develop a program to implement these algorithms. The program is executed for several experiments, and the exploration time is reduced to approximately 1/22 and 7/1,200 at the first and second steps of the exploration process, respectively. However, as a trade-off for the time saving, the time cost (TC) of the searched architecture is increased to up to 4.7% and 11.2%, respectively, at each step compared with that of the architecture obtained through full-case exploration. The reduction ratio can be decreased to 1/4,000 by simultaneously applying both the algorithms even though the resulting TC is increased to up to 13.1% when compared with that obtained through full-case exploration.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.3 s.357
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• pp.26-34
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• 2007

This Paper describes a chip design technique for body composition analyzer based on the BIA (Bioelectrical Impedance Analysis) method. All the functions of signal forcing circuits to the body, signal detecting circuits from the body, Micom, SRAM and EEPROMS are integrated in one chip. Especially, multi-frequency detecting method can be applied with selective band pass filter (BPF), which is designed in weak inversion region for low power consumption. In addition new full wave rectifier (FWR) is also proposed with differential difference amplifier (DDA) for high performance (small die area low power consumption, rail-to-rail output swing). The prototype chip is implemented with 0.35um CMOS technology and shows the power dissipation of 6 mW at the supply voltage of 3.3V. The die area of prototype chip is $5mm\times5mm$.

• Journal of information and communication convergence engineering
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• v.13 no.3
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• pp.172-179
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• 2015

Face-to-face (F2F) bonding in three-dimensional integrated circuits (3D ICs), compared with other bonding styles, is closer to commercialization because of its benefits in terms of density, yield, and cost. However, despite the benefits that F2F bonding expect to provide, it's physical nature has not been studied thoroughly. In this study, we, for the first time, extract cross-die (inter-die) parasitic elements from F2F bonds on the full-chip scale and compare them with the intra-die elements. This allows us to demonstrate the significant impact of field sharing across dies in F2F bonding on full-chip noise and critical path delay values. The baseline method used is the die-by-die method, where the parasitic elements of individual dies are extracted separately and the cross-die parasitic elements are ignored. Compared with this inaccurate method, which was the only method available until now, our first-of-its-kind holistic method corrects the delay error by 25.48% and the noise error by 175%.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.4
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• pp.798-804
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• 2003

In this paper, We have designed an advanced circuits for controlling the Ink Nozzle of Printer Head We can fully increase the number of nozzle by reducing the number of Input/Output PADs using the proposed new circuit. The proposed circuit is tested with only 20 nozzles to evaluate functional test using FPGA sample chip. The new circuit architecture can be estimated. Full circuit for controlling 320 nozzles was designed and simulated from ASIC full custom methodology, then the circuit was fabricated by applying 3${\mu}{\textrm}{m}$ CMOS process design rule.

• Proceedings of the KIEE Conference
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• 1992.07b
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• pp.1176-1178
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• 1992

This paper shows enhanced working performance of the battery fork-lift truck by developing the IGBT full bridge dc-dc convertor using one-chip micro-processor. The PWM pulse is generated from a 16 bit one-chip micro-processor for the speed control of DC motor. In order to ensure the operation of IGBT and motor pecewisely, IGBT gate drive circuit was designed by using current limiting IC and hige voltage limit IC. And also It is able to regenerative braking.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.12
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• pp.110-119
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• 1996

A novel high speed VLSI architecture and its VLSI realization methodologies for a motion estimation processor based on full search block matching algorithm are presentd. The presented architecture is designed in order to be suitable for highly parallel and pipelined processing with identical PE's and adjustable in performance and hardware amount according to various application areas. Also, the throughput is maximized by enhancing PE utilization up to 100% and the chip pin count is reduced by reusing image data with embedded image memories. Also, the uniform and identical data processing structure of PE's eases VLSI implementation and the clock rate of external I/O data can be made slower compared to internal clock rate to resolve I/O bottleneck problem. The logic and spice simulation results of the proposed architecture are presented. The performances of the proposed architecture are evaluated and compared with other architectures. Finally, the chip layout is shown.