1 |
Yoda, K., Morita, H., Mori, T., Shibuya, T. 'Impact printer head using piezoelectric actuators', Applications of Ferroelectrics, 1990. IEEE 7th International Symposium on Consummers, 1991
|
2 |
Ishizuka, M. 'Application of the thermal network method to the thermal analysis of thermal printer heads used in high speed thermal printers', Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International, 1989
|
3 |
Bogletti, A., Chiampi, M., Tartaglia, A., Cattaneo, S, Contessa, M, Garramone, A 'Analysis of a permanent magnet dot matrix printer head', Magnetics, IEEE Transactions on , Volume: 25 Issue: 5 , Sept. 1989
|
4 |
Hatada, K, Fujimoto, H, Ochi, T., Ishida, Y. 'Applications of new assembly method 'micron bump bonding method' ' Electronic Manufacturing Technology Symposium, 1989, Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International, 1989
|
5 |
Yuji H., Hisao H., Michio N., Takeshi M., Masanori Y., Tetsuo E., 'A Thermal Printer Head with CMOS Thin-Film Transistor and Heating Elements Integrated on a Chip', ISSCC 88, Feb 19, 1988
|
6 |
Tokunaga, Y. and Sugiyama, K., 'Thermal Ink-Transfer Imaging' IEEE Trans. Electron Devices, VoI.ED-27, No.1, (1980-1), pp218-222
|