• Journal of the Korean Society of Safety
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• v.25 no.6
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• pp.14-21
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• 2010

A miniature single solder ball joint is designed to mimic the actual solder joints used in the micro-electric industries. Shear tests were conducted to evaluate the mechanical behavior of miniature single solder joints at intermediate strain rates from $0.019\;s^{-1}$ to $2.16\;s^{-1}$ at room temperature. The shear fracture strength of the present solder ball joints generally increased with increasing shear strain rate, ranging from 32 to 51MPa. This behavior is affected by the sensitivity of bulk solder strength to strain rate. Shear fracture mode changed from brittle to partial ductile (failure inside the bulk solder) with an increase of shear speed. The unloading shear fracture toughness is generally consistent with the measure of the amount of bulk solder on the fractured surface.

• Journal of the Korean Society of Safety
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• v.30 no.6
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• pp.7-11
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• 2015

The present study investigates the impact shear strength of thermal aged Sn-3Ag-0.5Cu lead-free solder joints at impact speeds ranging from 0.5 m/s to 2.5 m/s. The specimens were thermal aged for 24, 100, 250 and 1000 hours at $100^{\circ}C$. The experimental results demonstrate that the shear strength of the solder joint decreases with an increase in the load speed and aging time. The shear strength of the solder joint aged averagely decreased by 43% with an increase in the strain rate. For the as-reflowed specimens, the mode II stress intensity factor ($K_{II}$) of interfacial IMC between Sn-3.0Ag-0.5Cu and a copper substrate also was found to decrease from $1.63MPa.m^{0.5}$ to $0.97MPa.m^{0.5}$ in the speed range tested here. The degradations in the shear strength and fracture toughness of the aged solder joints are mainly caused by the growth of IMC layers at the solder/substrate interface.

• Archives of Reconstructive Microsurgery
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• v.14 no.2
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• pp.144-151
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• 2005

Purpose: Disaster as traffic accident, industrial disaster, high voltage electrical bum and flame burn of extremity have a destructive effect because of the involvement of deep structure. Generally, such injury may result in decreased function or loss of limb. In this study the successful use of the combined scapular/parascapular flap as microsurgical transfer to cover extensive defect of electrical and flame bum is reported. Material and Method: Between January 2000 and June 2001, the combined scapular and parascapular flap was used for the coverage of soft tissue defect for 7 patients were admitted to our department with high voltage electrical bum and flame burn. The recipient site were the wrist joint in 2 cases, the forearm in 1 case, the ankle joint in 1 case, the foot dorsum in 1 case, the heel in 1 case. Result: Flap survival was complete in all patients. The result of flap coverage for these deep wound was successful. Conclusion: The advantages of scapular/parascapular combined flap were coverage of the large defect, easy shaping of the flap to fit the required three dimensional configuration around the joint, non hair bearing skin of uniform thickness, minimal donor site morbidity.

• Archives of Reconstructive Microsurgery
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• v.22 no.2
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• pp.63-68
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• 2013

Purpose: In case of the failed replantation, if the patients want to preserve the length of amputated stump, toe transfer is the ideal choice. However, reconstruction of these amputated stump with a free flap can be a useful method when the patients refuse sacrificing their toe. Our purpose of this study is to evaluate availability of functional results and patient satisfaction after this procedure. Materials and Methods: From March 2008 to February 2012, we reconstructed the amputated stump with free flap by patients demand. Eleven patients were included, medial plantar artery perforator flap in seven cases and great toe pulp flap in five cases. Follow-up range 12 to 24 months and we evaluate patient satisfaction by using a visual analogue scale (VAS; 1=unsatisfied, 5=excellent) and functional recovery by measuring the range of motion of remaining joint at 12 months after operation. Results: During follow-up period, all transferred free flaps survived and no major complications were noted. Range of motion of remaining joint appeared satisfactory result ($15^{\circ}$ to $100^{\circ}$). The VAS patient satisfaction score for aesthetic were five in six patients, four in four patients, and three in one patient. Conclusion: In case of the failed digital replantation, if patient refuse toe transfer, it could be useful method to reconstruction with the free flap to preserving maximal length of amputated stump.

• 제어로봇시스템학회:학술대회논문집
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• 1990.10b
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• pp.990-995
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• 1990

A minimum-time trajectory planning for two robot arms with designated paths and coordination is proposed. The problem considered in this paper is a subproblem of hierarchically decomposed trajectory planning approach for multiple robots : i) path planning, ii) coordination planning, iii) velocity planning. In coordination planning stage, coordination space, a specific form of configuration space, is constructed to determine collision region and collision-free region, and a collision-free coordination curve (CFCC) passing collision-free region is selected. In velocity planning stage, normal dynamic equations of the robots, described by joint angles, velocities and accelerations, are converted into simpler forms which are described by traveling distance along collision-free coordination curve. By utilizing maximum allowable torques and joint velocity limits, admissible range of velocity and acceleration along CFCC is derived, and a minimum-time velocity planning is calculated in phase plane. Also the planning algorithm itself is converted to simple numerical iterative calculation form based on the concept of neural optimization network, which gives a feasible approximate solution to this planning problem. To show the usefulness of proposed method, an example of trajectory planning for 2 SCARA type robots in common workspace is illustrated.

• Archives of Reconstructive Microsurgery
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• v.19 no.1
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• pp.21-28
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• 2010

Purpose: To report the clinical results of the use of arterialized venous free flaps in reconstruction in soft tissue defects of the finger and to extend indications for the use of such flaps based on the clinical experiences of the authors. Materials and Methods: Eighteen patients who underwent arterialized venous free flaps for finger reconstruction, between May 2007 and July 2009 were reviewed retrospectively. The mean flap size was 4.7${\times}3.2$ cm. The donor site was the ipsilateral volar aspect of the distal forearm in all cases. There were 8 cases of venous skin flaps, 5 cases of neurocutaneous flaps, 4 cases of tendocutaneous flaps, 1 case of innervated tendocutaneous flap. The vascuality of recipient beds was good except in 4 cases (partial devascuality in 2, more than 50% avascuality (bone cement) in 2). Results: All flaps were survived. The mean number of included veins was 2.27 per flap. Mean static two-point discrimination was 10.5 mm in neurocutaneous flaps. In 3 of 5 cases where tendocutaneous flaps were used, active ROM at the PIP joint was 60 degrees, 30 degrees at the DIP joint and 40 degrees at the IP joint of thumb. There were no specific complications except partial necrosis in 3 cases. Conclusions: An arterialized venous free flap is a useful procedure for single-stage reconstruction in soft tissue or combined defect of the finger; we consider that this technique could be applied to fingers despite avascular recipient beds if the periphery of recipient bed vascularity is good.

• Transactions of the Korean Society of Automotive Engineers
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• v.21 no.1
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• pp.145-153
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• 2013

In this study, shear punch-creep (SP-Creep) at Sn-4Ag/Cu pad the joint was tested by using environment-friendly Pb-free solder alloy Sn-4Ag of electronic components. Pb eutectic alloy (Sn-37Pb) joints limited to environmental issues with reflow time (10sec, 30sec, 100sec, 300sec) according to two types of solder alloy joints are compared and evaluated by creep strain rate, rupture time and IMC (Intermetallic Compound) behavior. As the results, reflow time increases with increasing thickness of IMC can be seen at overall 100sec later in case of two solder joints on the IMC thickness of Sn-4Ag solder joints thicker than Sn-37Pb solder joints. In addition, when considering creep evaluation factors, lead-free solder alloy Sn-4Ag has excellent creep resistance more than Pb eutectic alloy. For this reason, the two solder joints, such as in the IMC (Cu6Sn5) was formed. However, the creep resistance of Sn-4Ag solder joints was largely increased in the precipitation strengthening effect of dispersed Ag3Sn with interface more than Sn-37Pb solder joints.

• Journal of Welding and Joining
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• v.20 no.2
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• pp.77-81
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• 2002

Many kinds of Pb-free solder have been investigated because of the environmental concerns. Sn-Ag-Cu system is well blown as most competitive Pb-free solder. However, since Sn-Ag-Cu system has relatively high melting point compared to Sn-Pb eutectic, it may a limitation, the some application. In this study, Bi and In contained solder of $Sn_3Ag_8Bi_5In$ which has relatively lower melting point, $188~204^{\circ}C$, was investigated. $Sn_3Ag_8Bi_5In$ solder ball of $500\mu\textrm{m}$ diameter was set on the Ni/Cu/Cr-UBM and reflow soldered in the range of $220~240^{\circ}C$ for 5~15s. The maximum shear strength of the solder ball was around 170mN by reflowing at $240^{\circ}C$ for 10s. Intermetallic compound formed on the UBM of Si-wafer was analysed by SEM(scanning electron microscope) and XRD(X-ray diffractometer).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1221-1222
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• 2011

• Journal of Korean Association for Spatial Structures
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• v.14 no.3
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• pp.47-56
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• 2014

This paper investigates the characteristics of unstable behaviour and critical buckling load by joint rigidity of framed large spatial structures which are sensitive to initial conditions. To distinguish the stable from the unstable, a singular point on equilibrium path and a critical buckling level are computed by the eigenvalues and determinants of the tangential stiffness matrix. For the case study, a two-free node example and a folded plate typed long span example with 325 nodes are adopted, and these adopted examples' nonlinear analysis and unstable characteristics are analyzed. The numerical results in the case of the two-free node example indicate that as the influence of snap-through is bigger; that of bifurcation buckling is lower than that of the joint rigidity as the influence of snap-through is lower. Besides, when the rigidity decreases, the critical buckling load ratio increases. These results are similar to those of the folded-typed long span example. When the buckling load ratio is 0.6 or less, the rigidity greatly increases.