Browse > Article

A Study on the Characteristics of Sn-Ag-X Solder Joint  

김문일 (서울시립대학교 공과대학 재료공학과)
문준권 (서울시립대학교 공과대학 재료공학과)
정재필 (서울시립대학교 공과대학 재료공학과)
Publication Information
Journal of Welding and Joining / v.20, no.2, 2002 , pp. 77-81 More about this Journal
Abstract
Many kinds of Pb-free solder have been investigated because of the environmental concerns. Sn-Ag-Cu system is well blown as most competitive Pb-free solder. However, since Sn-Ag-Cu system has relatively high melting point compared to Sn-Pb eutectic, it may a limitation, the some application. In this study, Bi and In contained solder of $Sn_3Ag_8Bi_5In$ which has relatively lower melting point, $188~204^{\circ}C$, was investigated. $Sn_3Ag_8Bi_5In$ solder ball of $500\mu\textrm{m}$ diameter was set on the Ni/Cu/Cr-UBM and reflow soldered in the range of $220~240^{\circ}C$ for 5~15s. The maximum shear strength of the solder ball was around 170mN by reflowing at $240^{\circ}C$ for 10s. Intermetallic compound formed on the UBM of Si-wafer was analysed by SEM(scanning electron microscope) and XRD(X-ray diffractometer).
Keywords
Pb-free solder; $Sn_3Ag_8Bi_5In$ solder; Microstructure; Intermetallic compound; Joint strength;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Flip Chip Technologies /
[ H. Lau (ed) ] / McGraw-Hill Book Co
2 Micristructure evolution of eutectic Su-Ag solder joints /
[ W. Yang;R. W. Jr. Messler;L. E. Felton ] / J. Electronic Master   DOI   ScienceOn
3 Investigation of Interfacial Reaction Between Sn-Ag Eutectic Solder and Au/Ni/Cu/Ti Thin Film Metallization /
[ J. Y. Park (et al) ] / J. Electronic Master   DOI   ScienceOn
4 Advanced in Electronic Packaging /
[ T. Y. Pang;H. D. Brair;J. M. Nicholson;S. W. Oh ] / ASME
5 Soldering in electronics(2nd ed) /
[ R. J. Klein wassink ] / Electrochemical Publication Ltd
6 The Mechanics of Solder Alloy Wetting and Spreading /
[ F. G. Yost;F. M. Hosking;F. M. Frear ] / Van Nostrand Reinhold
7 Activation Energies of Intermetallic Growth of Sn- Ag Eutectic Solder on Copper Substrstes /
[ D. R. Flanders;E. G. Jacobs;R. F. Pinizzotto ] / J. Electronic Master   DOI   ScienceOn