A Study on the Characteristics of Sn-Ag-X Solder Joint
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김문일
(서울시립대학교 공과대학 재료공학과)
문준권 (서울시립대학교 공과대학 재료공학과) 정재필 (서울시립대학교 공과대학 재료공학과) |
1 |
Flip Chip Technologies
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2 |
Micristructure evolution of eutectic Su-Ag solder joints
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DOI ScienceOn |
3 |
Investigation of Interfacial Reaction Between Sn-Ag Eutectic Solder and Au/Ni/Cu/Ti Thin Film Metallization
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DOI ScienceOn |
4 |
Advanced in Electronic Packaging
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5 |
Soldering in electronics(2nd ed)
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6 |
The Mechanics of Solder Alloy Wetting and Spreading
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7 |
Activation Energies of Intermetallic Growth of Sn- Ag Eutectic Solder on Copper Substrstes
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DOI ScienceOn |
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