1 |
E. H. Wong, S. K. W. Seah and V. P. W. Shim, "A Review of Board Level Solder Joints for Mobile Applications," Microelectronics Reliability, Vol. 48, pp. 1747-1758, 2008.
DOI
|
2 |
X. Hu, Y. Li, Y. Liu, Y. Liu and Z. Min, "Microstructure and Shear Strength of Sn37Pb/Cu Solder Joints Subjected to Isothermal Aging," Microelectronics Reliability, Vol. 54, pp. 1575-1582, 2014.
DOI
|
3 |
J. W. Yoon and S.B. Jung, "Reliability Studies of Sn-9Zn/Cu Solder Joints with Aging Treatment," J. Alloy. Compounds, Vol. 407, pp. 141-149, 2006.
DOI
|
4 |
S. M. Joo, T-. Y. Kim, W. Lim and H-. K. Kim, "Evaluation of the Joint Strength of Lead-free Solder Ball Joints at High Strain Rates", Jourmal of The Korean Society of Safety, Vol. 27, No. 6, pp. 7-13, 2012.
|
5 |
H. D. Blair, T. Y. Pan, J. M. Nicholson, R. P. Cooper, S. W. Oh and A. R. Farah, "Manufacturing Concerns of the Electronic Industry Regarding Inter-metallic Compound Formation during the Soldering Stage," IEEE/CMPT Int. El. Mfg., Vol. 19, pp. 282-292, 1996.
|
6 |
N. Mookam and K. Kanlayasiri, "Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging," J. Mater. Sci. Technol. Vol. 28, No.1, pp. 53-59, 2012.
DOI
|
7 |
V. L. Nguyen and H. K. Kim, "Mechanical Properties of Lead-free Solder Joints under High-speed Shear Impact Loading," J. Electron. Mater., Vol. 43, pp. 4171-4178, 2014.
DOI
|
8 |
Y. H. Tian, C. J. Hang, C. Q. Wang, S. H. Yang and P.R. Lin, "Effects of Bump Size on Deformation and Fracture Behavior of Sn3.0Ag0.5Cu/Cu Solder Joints during Shear Testing," Mater. Sci. Eng. A, Vol. 529, pp. 468-478 , 2011.
DOI
|
9 |
J. W. Yoon and S. B. Jung, "Solder Joint Reliability Evaluation of Sn-Zn/Au/Ni/Cu Ball-grid-array Package during Aging," Mater. Sci. Eng. A, Vol. 452-453, pp. 46-54, 2007.
DOI
|
10 |
C. Y. Yu, W. Y. Chen and J.G. Duh, "Improving the Impact toughness of Sn-Ag-Cu/Cu-Zn Pb-free Solder Joints under High Speed Shear Testing," J. Alloy. Compound, Vol. 586, pp. 633-638, 2014.
DOI
|