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Evaluation of Shear Strength of a Miniature Lead-free Single Solder Ball Joint  

Joo, Se-Min (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology)
Kim, Ho-Kyung (Department of Automotive Engineering, Seoul National University of Science and Technology)
Publication Information
Journal of the Korean Society of Safety / v.25, no.6, 2010 , pp. 14-21 More about this Journal
Abstract
A miniature single solder ball joint is designed to mimic the actual solder joints used in the micro-electric industries. Shear tests were conducted to evaluate the mechanical behavior of miniature single solder joints at intermediate strain rates from $0.019\;s^{-1}$ to $2.16\;s^{-1}$ at room temperature. The shear fracture strength of the present solder ball joints generally increased with increasing shear strain rate, ranging from 32 to 51MPa. This behavior is affected by the sensitivity of bulk solder strength to strain rate. Shear fracture mode changed from brittle to partial ductile (failure inside the bulk solder) with an increase of shear speed. The unloading shear fracture toughness is generally consistent with the measure of the amount of bulk solder on the fractured surface.
Keywords
shear test; lead-free solder ball; miniature solder joint; shear fracture mode; unloading fracture toughness;
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Times Cited By KSCI : 1  (Citation Analysis)
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