1 |
C. Y. Kang, "Research Trend in Development of Pb Free Solder," The Journal of KWJS, Vol.13, Issue 4, pp.1-6, 1995.
|
2 |
M. I. Kim, K. S. Shin and J. P. Jung, "Research Trends of Sn-Ag Based Pb-Free Solders," The Journal of KWJS, Vol.19, No.1, pp.15-20, 2001.
과학기술학회마을
|
3 |
W. J. Heo, S. S. Baek, Y. H. Jung, I. H. Kwon, S. M. Yang and H. S. Yu, "A Study on Mechanical Properties for Pb-free Solders of Electronic Packages," The Journal of KWJS, Vol.2, pp.83-85, 2003.
|
4 |
H.-Y. Hsiao, C.-C. Hu, M.-Y. Guo, C. Chen and K. N. Tu, "Inhibiting the Consumption of Cu during Multiple Reflows of Pb-free Solder on Cu," Scripta Materialia, Vol.65, Issue101, pp.907-910, 2011.
DOI
ScienceOn
|
5 |
Q. K. Zhang and Z. F. Zhang, "In Situ Observations on Creep Fatigue Fracture behavior of Sn-4Ag/Cu Solder Joints," ACTA Materialia, Vol.59, Issue.15, pp.6017-6028, 2011.
DOI
ScienceOn
|
6 |
C. W. Han, C. M. Oh, N. C. Park and W. S. Hong, "Creep Lifetime Prediction of Solder Joint for Heat Sink Assembly," Microelectronics Reliability, Vol.50, Issues.9-11, pp.1645-1649, 2010.
DOI
ScienceOn
|
7 |
H. Yu, "Miniaturized Shear-Punch Tester and Evaluating Method of Shear Strength and Shear Strain for Solder Joint," KR Patent: 10-2003- 0010858, 2003.
|
8 |
Y. Kanda and Y. Kariya, "Evaluation of Creep Properties for Sn-Ag-Cu Micro Solder Joint by Multi-temperature Stress Relaxation Test," Microelectronics Reliability, In Press, Corrected Proof, 2012.
|
9 |
J. H. Yoon and K. C. Hwang, "Creep Behaviour of Al-Zn-Mg Ternary Aluminum Alloy," Transactions of KSAE, Vol.12, No.1, pp.203-208, 2004.
과학기술학회마을
|
10 |
S. S. Baek, A Study on the Creep Characterization and Life Assessment for Weldments of Heat Resistance Material in Power Plant Using Micro Test Method, Ph. D. Dissertation, Chonbuk National University, Korea, 2006.
|
11 |
S. I. Lee, I. H. Kwon, Y. J. Kim, S. S. Baek, B. G. Ahn, H. K. Ahn and H. S. Yu, "A Study on Small Punch-Creep Test Using Finite Element Analysis II," Transactions of the KSME A, Vol.A, pp.111-116, 2001.
|
12 |
W. S. Hong, W. S. Kim, B. S. Song and K. B. Kim, "Thermal Shock Cycles Optimization of Sn-3.0 Ag-0.5 Cu/OSP Solder Joint with Bonding Strength Variation for Electronic Components," The Journal of Materials Research Society of Korea, Vol.17, Issue 3, pp.152-159, 2007.
과학기술학회마을
DOI
ScienceOn
|