• Journal of the Korean Society of Safety
• /
• v.38 no.3
• /
• pp.27-34
• /
• 2023

With the technological development of the semiconductor industry, the roles of electrical and thermal energy supply and control of semiconductor equipment in ultrafine processes have become very important. However, instances of electrical fires in the chiller heater, which is used for cooling in the semiconductor manufacturing process, are increasing. A fire occurs in combustibles due to high heat at the connection part of the chiller heater, that is, when the number of electrical wires in the connection part is reduced or when the wires are completely disconnected. In this study, the temperature characteristics were compared and analyzed through experiments and 3D simulations. The number of electrical wires, which is the connection part of the chiller heater, was reduced by 90%, 50%, 30%, 10%, and 5%, and the wires were completely disconnected. When the number of electrical wires was reduced by 5%, heat of up to 80℃ was generated, which is a relatively high temperature but insufficient to cause a fire in combustibles. Complete disconnection occurred due to the vibration of the motor and other components, and sparks and arcs were generated, resulting in a rapid increase in temperature to up to 680℃. When completely disconnected, the temperature increase was sufficient to cause a fire in the combustibles covering the terminal block. Therefore, in this study, the causes of electrical fires in chiller heaters were investigated and preventive measures were proposed by analyzing abnormal signals and thermal characteristics caused by the electrical wiring being reduced and completely disconnected.

• Journal of the Semiconductor & Display Technology
• /
• v.21 no.3
• /
• pp.101-104
• /
• 2022

Mist-CVD is known to have advantages of low cost and high productivity compared to ALD and PECVD methods. It is capable of reacting to the substrate by misting an aqueous solution using ultrasonic waves under vacuum-free conditions of atmospheric pressure. In particular, Ga₂O₃ is regarded as advanced power semiconductor material because of its high quality of transmittance, and excellent electrical conductivity through N-type doping. In this study, Computational Fluid Dynamics were used to predict the uniformity of the thin film on a large-area substrate. And also the deposition pattern and uniformity were analyzed using the flow velocity and particle tracking method. The uniformity was confirmed by quantifying the deposition cross section with an FIB-SEM, and the consistency of the uniformity prediction was secured through the analysis of the CFD distribution. With the analysis and experimental results, the match rate of deposition area was 80.14% and the match rate of deposition thickness was 55.32%. As the experimental and analysis results were consistent, it was confirmed that it is possible to predict the deposition thickness uniformity of Mist-CVD.

• Journal of the Semiconductor & Display Technology
• /
• v.19 no.3
• /
• pp.43-48
• /
• 2020

The demand for stable plasma has been on the rise because of the increased delivery power amount in the chamber for improving productivity, and fast and accurate plasma impedance matching become a crucial performance measure for radio frequency (RF) power system in semiconductor manufacturing equipment. In this paper, the overall impedance matching was understood, and voltage and current values were extracted with voltage - current (VI) probe to measure plasma impedance in real-time. Actual matching data were analyzed to derive calibration coefficient for V and I measurements to understand the characteristics of VI probe, and we demonstrated the tendency of RF impedance matching according to changes in load impedance. This preliminary empirical research can contribute to fast RF matching as well as advanced equipment control for the next level of detailed investigation on embedded system based-RF matching controller.

• Journal of the Korea Society for Simulation
• /
• v.11 no.3
• /
• pp.59-65
• /
• 2002

Semiconductor wafer fabrication is a business of high capital investment and fast changing nature. To be competitive, the production in a fab needs to be effectively planned and scheduled starting from the ramping up phase, so that the business goals such as on-time delivery, high output volume and effective use of capital intensive equipment can be achieved. Project executed that use conveyor in bay semiconductor A line. But conveyor capability is lacking and rundown happened in equipment. Do design without normal simulation and conveyor system failed. The comparison is peformed through simulation using .AutoMod a window 98 based discrete system simulation software, as a tool for comparing performance of proposed layouts. In this research estimate optimum conveyor capability, there is the purpose.

• Journal of the Semiconductor & Display Technology
• /
• v.19 no.3
• /
• pp.100-105
• /
• 2020

Recently, as display and semiconductor devices have been miniaturized and highly integrated, there is a demand for optimization of the structural characteristics of the thin film accordingly. The sputtering device has the advantage of stably obtaining a desired thin film depending on the material selected for the target. However, due to the structural characteristics of the sputtering equipment, the structural characteristics of the film may be different depending on the incidence angle of the sputtering target material to the substrate. In this study, the characteristics of the thin film material according to the scattering angle of the target material and the incidence position of the substrate were studied to find the optimization design rule of the sputtering equipment. To this end, a Si thin film of 1 ㎛ or less was deposited on the Si(100) substrate, and then the microstructure, reflectance, surface roughness, and thin film crystallinity of the thin film formed for each substrate location were investigated. As a result of the study, it was found that as the sputter scattering angle increased and the substrate incident angle decreased, the gap energy along with the surface structure of the thin film increased from 1.47 eV to 1.63 eV, gradually changing to a non-conductive tendency.

• Journal of Korean Society of Industrial and Systems Engineering
• /
• v.34 no.4
• /
• pp.57-65
• /
• 2011

Monitoring auto correlated processes is prevalent in recent manufacturing environments. As a proactive control for manufacturing processes is emphasized especially in the semiconductor industry, it is natural to monitor real-time status of equipment through sensor rather than resultant output status of the processes. Equipment's sensor data show various forms of correlation features. Among them, considerable amount of sensor data, statistically autocorrelated, is well represented by Box-Jenkins autoregressive moving average (ARMA) model. In this paper, we present a design method of statistical process control (SPC) used for monitoring processes represented by the ARMA model. The proposed method shows benefits in the power of detecting process changes, and considers robustness to ARMA modeling errors simultaneously. We prove benefits through Monte carlo simulation-based investigations.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
• /
• 2007.06a
• /
• pp.139-143
• /
• 2007

The need for technological developments of lithography equipment is urgent for the stable production in response to the rapid growth of the recent display industry. As an example, the products currently in the market face alteration problems resulting from excessive weight of the mask holder part. This is one of obstacle for the automation of the equipment. In response, the mask holder part problem has been minimized through FEM and design of experiments in order to optimize the situation with minimized Deflection and reduced mass for satisfactory replacement of the mask holder part.

• The Transactions of the Korea Information Processing Society
• /
• v.7 no.1
• /
• pp.115-125
• /
• 2000

In this paper, we suggest the basic components of monitoring system for the semiconductor wafer cleaning equipment and a monitoring system model based on these components. Basic component is defined as a mandatory function which consists of communication with the control system, user interface, communication with the remote monitoring system, management of monitoring data and inter-task communication. We have defined the function of each component and the relation among them, and designed each component as a task. To evaluate the validity of the suggested model, we have implemented the basic components using the Visual C++ on Windows NT and applied them to the Monitoring System for the semiconductor wafer cleaning equipment.

• Journal of the Korea Society for Simulation
• /
• v.21 no.2
• /
• pp.41-50
• /
• 2012

In this study we first explain details of the semiconductor manufacturing processes and cluster tools. Then we discuss the problems in current fab layout and cluster tool architecture. As a solution to these problems, we propose the ILE (In-Line EFEM) architecture in which wafer movements are conducted through interconnected EFEMs (Equipment Front End Modules) instead of AMHS (Automated Material Handling System). Then we model the pilot ILE system using discrete event simulation and analyze the cycle time. Finally we compare three different scenarios of equipment layout in the ILE system in terms of cycle time.

• Journal of the Semiconductor & Display Technology
• /
• v.11 no.4
• /
• pp.31-36
• /
• 2012

The high thrust of the linear motor in the exposer generates the high temperature heat by the friction and the electromagnetic forces on its coil. It can cause the thermal deformation and the accuracy of the equipment is finally decreased which has a bad effect on the productivity. In this research, the heat and flow on the linear motor of the exposer has been analyzed. The existing equipment is non-contact fluid refrigerant type. The numerical analysis data of the existing equipment have been acquired and the reliability of the data has been verified. The revised modeling for the next-generation is suggested for cooling the exposer effectively.